NL7300548A - - Google Patents
Info
- Publication number
- NL7300548A NL7300548A NL7300548A NL7300548A NL7300548A NL 7300548 A NL7300548 A NL 7300548A NL 7300548 A NL7300548 A NL 7300548A NL 7300548 A NL7300548 A NL 7300548A NL 7300548 A NL7300548 A NL 7300548A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP584972A JPS4876059A (xx) | 1972-01-14 | 1972-01-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7300548A true NL7300548A (xx) | 1973-07-17 |
Family
ID=11622437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7300548A NL7300548A (xx) | 1972-01-14 | 1973-01-12 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS4876059A (xx) |
DE (1) | DE2301277A1 (xx) |
FR (1) | FR2167939B1 (xx) |
NL (1) | NL7300548A (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2611871A1 (de) * | 1975-03-26 | 1976-10-07 | Honeywell Inf Systems | Elektrische schaltungsbaugruppe in mehrschichtbauweise und verfahren zu deren herstellung |
JPS5610998A (en) * | 1979-07-09 | 1981-02-03 | Hitachi Ltd | Method of manufacturing ceramic multilayer wiring substrate |
US4302625A (en) * | 1980-06-30 | 1981-11-24 | International Business Machines Corp. | Multi-layer ceramic substrate |
FR2490059A1 (fr) * | 1980-09-09 | 1982-03-12 | Serras Paulet Edouard | Circuit imprime et son procede de fabrication |
US4645552A (en) * | 1984-11-19 | 1987-02-24 | Hughes Aircraft Company | Process for fabricating dimensionally stable interconnect boards |
JPS6276600A (ja) * | 1985-09-29 | 1987-04-08 | 株式会社 アサヒ化学研究所 | 基板に導電回路を形成する方法 |
GB8909729D0 (en) * | 1989-04-27 | 1990-04-25 | Ici Plc | Compositions |
JP4731976B2 (ja) * | 2004-12-15 | 2011-07-27 | 株式会社トクヤマ | メタライズドセラミック基板の製造方法 |
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1972
- 1972-01-14 JP JP584972A patent/JPS4876059A/ja active Pending
-
1973
- 1973-01-11 DE DE19732301277 patent/DE2301277A1/de active Pending
- 1973-01-11 FR FR7300848A patent/FR2167939B1/fr not_active Expired
- 1973-01-12 NL NL7300548A patent/NL7300548A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR2167939A1 (xx) | 1973-08-24 |
JPS4876059A (xx) | 1973-10-13 |
FR2167939B1 (xx) | 1975-03-28 |
DE2301277A1 (de) | 1973-08-02 |