NL7205728A - - Google Patents
Info
- Publication number
- NL7205728A NL7205728A NL7205728A NL7205728A NL7205728A NL 7205728 A NL7205728 A NL 7205728A NL 7205728 A NL7205728 A NL 7205728A NL 7205728 A NL7205728 A NL 7205728A NL 7205728 A NL7205728 A NL 7205728A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/231—Shapes
- H10W72/237—Multiple bump connectors having different shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
- H10W72/247—Dispositions of multiple bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/29—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/936—Multiple bond pads having different shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13824471A | 1971-04-28 | 1971-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7205728A true NL7205728A (cg-RX-API-DMAC10.html) | 1972-10-31 |
Family
ID=22481133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7205728A NL7205728A (cg-RX-API-DMAC10.html) | 1971-04-28 | 1972-04-27 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3772575A (cg-RX-API-DMAC10.html) |
| AU (1) | AU467540B2 (cg-RX-API-DMAC10.html) |
| BE (1) | BE782752A (cg-RX-API-DMAC10.html) |
| CA (1) | CA975870A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2218230A1 (cg-RX-API-DMAC10.html) |
| ES (2) | ES401934A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2134553B1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1374848A (cg-RX-API-DMAC10.html) |
| IT (1) | IT950041B (cg-RX-API-DMAC10.html) |
| NL (1) | NL7205728A (cg-RX-API-DMAC10.html) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53147968A (en) * | 1977-05-30 | 1978-12-23 | Hitachi Ltd | Thick film circuit board |
| US4376287A (en) * | 1980-10-29 | 1983-03-08 | Rca Corporation | Microwave power circuit with an active device mounted on a heat dissipating substrate |
| US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
| JP2598328B2 (ja) * | 1989-10-17 | 1997-04-09 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| US7198969B1 (en) | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
| US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
| US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
| US5679977A (en) * | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
| US5258330A (en) * | 1990-09-24 | 1993-11-02 | Tessera, Inc. | Semiconductor chip assemblies with fan-in leads |
| GB2255672B (en) * | 1991-05-10 | 1994-11-30 | Northern Telecom Ltd | Opto-electronic components |
| US7073254B2 (en) | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
| US5820014A (en) * | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
| US5874782A (en) * | 1995-08-24 | 1999-02-23 | International Business Machines Corporation | Wafer with elevated contact structures |
| US5994152A (en) * | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
| US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
| US5937276A (en) | 1996-12-13 | 1999-08-10 | Tessera, Inc. | Bonding lead structure with enhanced encapsulation |
| CN114407502A (zh) * | 2022-03-01 | 2022-04-29 | 苏州通富超威半导体有限公司 | 印刷治具以及印刷方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL297002A (cg-RX-API-DMAC10.html) * | 1962-08-23 | 1900-01-01 | ||
| DE1627762B2 (de) * | 1966-09-17 | 1972-11-23 | Nippon Electric Co. Ltd., Tokio | Verfahren zur Herstellung einer Halbleitervorrichtung |
| US3539882A (en) * | 1967-05-22 | 1970-11-10 | Solitron Devices | Flip chip thick film device |
| US3567506A (en) * | 1968-03-22 | 1971-03-02 | Hughes Aircraft Co | Method for providing a planar transistor with heat-dissipating top base and emitter contacts |
| JPS4831507B1 (cg-RX-API-DMAC10.html) * | 1969-07-10 | 1973-09-29 | ||
| US3631307A (en) * | 1970-02-13 | 1971-12-28 | Itt | Semiconductor structures having improved high-frequency response and power dissipation capabilities |
| US3697828A (en) * | 1970-12-03 | 1972-10-10 | Gen Motors Corp | Geometry for a pnp silicon transistor with overlay contacts |
-
1971
- 1971-04-28 US US00138244A patent/US3772575A/en not_active Expired - Lifetime
-
1972
- 1972-02-24 CA CA135,540A patent/CA975870A/en not_active Expired
- 1972-03-09 IT IT21647/72A patent/IT950041B/it active
- 1972-04-10 AU AU40970/72A patent/AU467540B2/en not_active Expired
- 1972-04-14 DE DE19722218230 patent/DE2218230A1/de active Pending
- 1972-04-20 ES ES401934A patent/ES401934A1/es not_active Expired
- 1972-04-21 GB GB1866972A patent/GB1374848A/en not_active Expired
- 1972-04-26 FR FR7214881A patent/FR2134553B1/fr not_active Expired
- 1972-04-27 BE BE782752A patent/BE782752A/xx unknown
- 1972-04-27 NL NL7205728A patent/NL7205728A/xx unknown
- 1972-09-14 ES ES406660A patent/ES406660A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US3772575A (en) | 1973-11-13 |
| ES406660A1 (es) | 1975-09-16 |
| DE2218230A1 (de) | 1972-11-09 |
| BE782752A (fr) | 1972-08-16 |
| FR2134553B1 (cg-RX-API-DMAC10.html) | 1977-09-30 |
| AU467540B2 (en) | 1972-10-18 |
| ES401934A1 (es) | 1975-11-01 |
| IT950041B (it) | 1973-06-20 |
| FR2134553A1 (cg-RX-API-DMAC10.html) | 1972-12-08 |
| AU4097072A (en) | 1972-10-18 |
| GB1374848A (en) | 1974-11-20 |
| CA975870A (en) | 1975-10-07 |