NL7202844A - - Google Patents
Info
- Publication number
- NL7202844A NL7202844A NL7202844A NL7202844A NL7202844A NL 7202844 A NL7202844 A NL 7202844A NL 7202844 A NL7202844 A NL 7202844A NL 7202844 A NL7202844 A NL 7202844A NL 7202844 A NL7202844 A NL 7202844A
- Authority
- NL
- Netherlands
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/06—Reaction chambers; Boats for supporting the melt; Substrate holders
- C30B19/061—Tipping system, e.g. by rotation
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/06—Reaction chambers; Boats for supporting the melt; Substrate holders
- C30B19/062—Vertical dipping system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02392—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02581—Transition metal or rare earth elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02625—Liquid deposition using melted materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1206771A JPS53271B1 (fr) | 1971-03-05 | 1971-03-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7202844A true NL7202844A (fr) | 1972-09-07 |
Family
ID=11795240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7202844A NL7202844A (fr) | 1971-03-05 | 1972-03-03 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3783825A (fr) |
JP (1) | JPS53271B1 (fr) |
CA (1) | CA953618A (fr) |
FR (1) | FR2128642B1 (fr) |
GB (1) | GB1344437A (fr) |
NL (1) | NL7202844A (fr) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1414060A (en) * | 1972-07-28 | 1975-11-12 | Matsushita Electronics Corp | Semoconductor devices |
CH541353A (de) * | 1972-11-20 | 1973-09-15 | Ibm | Vorrichtung zum epitaktischen Abscheiden von Halbleitermaterial durch Flüssigphasenepitaxie aus mindestens zwei Lösungen |
JPS5213510B2 (fr) * | 1973-02-26 | 1977-04-14 | ||
DE2346198A1 (de) * | 1973-07-27 | 1975-05-07 | Siemens Ag | Verfahren zur herstellung gelb leuchtender galliumphosphid-dioden |
US4012242A (en) * | 1973-11-14 | 1977-03-15 | International Rectifier Corporation | Liquid epitaxy technique |
JPS50119566A (fr) * | 1974-03-01 | 1975-09-19 | ||
US3963536A (en) * | 1974-11-18 | 1976-06-15 | Rca Corporation | Method of making electroluminescent semiconductor devices |
FR2296264A1 (fr) * | 1974-12-24 | 1976-07-23 | Radiotechnique Compelec | Procede de realisation de dispositif semi-conducteur a heterojonction |
US4052252A (en) * | 1975-04-04 | 1977-10-04 | Rca Corporation | Liquid phase epitaxial growth with interfacial temperature difference |
DE2553113C3 (de) * | 1975-11-26 | 1982-04-08 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zum Züchten von Einkristallen aus schmelzflüssigen Lösungen |
DE2653049C3 (de) * | 1976-11-23 | 1979-10-04 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zur Flüssigphasenepitaxie |
DE2847091C3 (de) * | 1978-10-28 | 1982-03-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und Vorrichtung zur Herstellung von Ga↓1↓-↓x↓Al↓x↓ AS:Si-Epitaxieschichten |
US4236947A (en) * | 1979-05-21 | 1980-12-02 | General Electric Company | Fabrication of grown-in p-n junctions using liquid phase epitaxial growth of silicon |
US4214550A (en) * | 1979-05-21 | 1980-07-29 | Rca Corporation | Apparatus for the deposition of a material from a liquid phase |
FR2470810A1 (fr) * | 1979-12-07 | 1981-06-12 | Labo Electronique Physique | Procede de fabrication de structures semi-conductrices par croissance epitaxiale en phase liquide et structures obtenues |
US4384398A (en) * | 1981-10-26 | 1983-05-24 | Bell Telephone Laboratories, Incorporated | Elimination of silicon pyramids from epitaxial crystals of GaAs and GaAlAs |
DE3628673A1 (de) * | 1986-08-23 | 1988-03-03 | Hans J Scheel | Verfahren und vorrichtung zum beschichten von substraten mit mehreren schichten |
US5264190A (en) * | 1990-04-19 | 1993-11-23 | Mitsubishi Denki Kabushiki Kaisha | Liquid phase epitaxial film growth apparatus |
US5098867A (en) * | 1990-11-13 | 1992-03-24 | Samsung Electronics Co., Ltd. | Heat treatment for compound semiconductor wafer |
JP3007202B2 (ja) * | 1991-09-12 | 2000-02-07 | 日新製鋼株式会社 | 多層エピタキシャル成長結晶の製造方法及び製造装置 |
US7233517B2 (en) * | 2002-10-15 | 2007-06-19 | Nanochip, Inc. | Atomic probes and media for high density data storage |
US20050243592A1 (en) * | 2004-04-16 | 2005-11-03 | Rust Thomas F | High density data storage device having eraseable bit cells |
US20060291271A1 (en) * | 2005-06-24 | 2006-12-28 | Nanochip, Inc. | High density data storage devices having servo indicia formed in a patterned media |
US20070008867A1 (en) * | 2005-07-08 | 2007-01-11 | Nanochip, Inc. | High density data storage devices with a lubricant layer comprised of a field of polymer chains |
US20070008865A1 (en) * | 2005-07-08 | 2007-01-11 | Nanochip, Inc. | High density data storage devices with polarity-dependent memory switching media |
US20070290282A1 (en) * | 2006-06-15 | 2007-12-20 | Nanochip, Inc. | Bonded chip assembly with a micro-mover for microelectromechanical systems |
US20080001075A1 (en) * | 2006-06-15 | 2008-01-03 | Nanochip, Inc. | Memory stage for a probe storage device |
US20070291623A1 (en) * | 2006-06-15 | 2007-12-20 | Nanochip, Inc. | Cantilever with control of vertical and lateral position of contact probe tip |
US20080074984A1 (en) * | 2006-09-21 | 2008-03-27 | Nanochip, Inc. | Architecture for a Memory Device |
US20080074792A1 (en) * | 2006-09-21 | 2008-03-27 | Nanochip, Inc. | Control scheme for a memory device |
US20080175033A1 (en) * | 2007-01-19 | 2008-07-24 | Nanochip, Inc. | Method and system for improving domain stability in a ferroelectric media |
US20080174918A1 (en) * | 2007-01-19 | 2008-07-24 | Nanochip, Inc. | Method and system for writing and reading a charge-trap media with a probe tip |
US20080233672A1 (en) * | 2007-03-20 | 2008-09-25 | Nanochip, Inc. | Method of integrating mems structures and cmos structures using oxide fusion bonding |
US20080232228A1 (en) * | 2007-03-20 | 2008-09-25 | Nanochip, Inc. | Systems and methods of writing and reading a ferro-electric media with a probe tip |
US20080318086A1 (en) * | 2007-06-19 | 2008-12-25 | Nanochip, Inc. | Surface-treated ferroelectric media for use in systems for storing information |
US20080316897A1 (en) * | 2007-06-19 | 2008-12-25 | Nanochip, Inc. | Methods of treating a surface of a ferroelectric media |
US7626846B2 (en) * | 2007-07-16 | 2009-12-01 | Nanochip, Inc. | Method and media for improving ferroelectric domain stability in an information storage device |
US20090201015A1 (en) * | 2008-02-12 | 2009-08-13 | Nanochip, Inc. | Method and device for detecting ferroelectric polarization |
US20090213492A1 (en) * | 2008-02-22 | 2009-08-27 | Nanochip, Inc. | Method of improving stability of domain polarization in ferroelectric thin films |
US20090294028A1 (en) * | 2008-06-03 | 2009-12-03 | Nanochip, Inc. | Process for fabricating high density storage device with high-temperature media |
US20100002563A1 (en) * | 2008-07-01 | 2010-01-07 | Nanochip, Inc. | Media with tetragonally-strained recording layer having improved surface roughness |
US20100039919A1 (en) * | 2008-08-15 | 2010-02-18 | Nanochip, Inc. | Cantilever Structure for Use in Seek-and-Scan Probe Storage |
US20100068509A1 (en) * | 2008-09-17 | 2010-03-18 | Nanochip, Inc. | Media having improved surface smoothness and methods for making the same |
US20100085863A1 (en) * | 2008-10-07 | 2010-04-08 | Nanochip, Inc. | Retuning of ferroelectric media built-in-bias |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1248999A (en) * | 1968-09-27 | 1971-10-06 | Matsushita Electric Ind Co Ltd | Apparatus for epitaxial growth from the liquid state |
US3565702A (en) * | 1969-02-14 | 1971-02-23 | Rca Corp | Depositing successive epitaxial semiconductive layers from the liquid phase |
NL6916855A (fr) * | 1969-02-19 | 1970-08-21 | ||
US3665888A (en) * | 1970-03-16 | 1972-05-30 | Bell Telephone Labor Inc | Horizontal liquid phase crystal growth apparatus |
US3697330A (en) * | 1970-03-27 | 1972-10-10 | Sperry Rand Corp | Liquid epitaxy method and apparatus |
US3677228A (en) * | 1970-04-17 | 1972-07-18 | Bell Telephone Labor Inc | Crystal growth apparatus |
-
1971
- 1971-03-05 JP JP1206771A patent/JPS53271B1/ja active Pending
-
1972
- 1972-03-01 US US00230661A patent/US3783825A/en not_active Expired - Lifetime
- 1972-03-03 CA CA136,218A patent/CA953618A/en not_active Expired
- 1972-03-03 NL NL7202844A patent/NL7202844A/xx unknown
- 1972-03-06 GB GB1028672A patent/GB1344437A/en not_active Expired
- 1972-03-06 FR FR7207642A patent/FR2128642B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2128642B1 (fr) | 1974-09-13 |
US3783825A (en) | 1974-01-08 |
DE2210371A1 (de) | 1972-10-05 |
DE2210371B2 (de) | 1975-06-05 |
GB1344437A (en) | 1974-01-23 |
JPS53271B1 (fr) | 1978-01-06 |
FR2128642A1 (fr) | 1972-10-20 |
CA953618A (en) | 1974-08-27 |