NL7116792A - - Google Patents

Info

Publication number
NL7116792A
NL7116792A NL7116792A NL7116792A NL7116792A NL 7116792 A NL7116792 A NL 7116792A NL 7116792 A NL7116792 A NL 7116792A NL 7116792 A NL7116792 A NL 7116792A NL 7116792 A NL7116792 A NL 7116792A
Authority
NL
Netherlands
Application number
NL7116792A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7116792A publication Critical patent/NL7116792A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
NL7116792A 1970-12-17 1971-12-07 NL7116792A (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2062215A DE2062215C3 (de) 1970-12-17 1970-12-17 Verfahren zur Abscheidung von Metallschichten auf Formkörpern aus Polyestern

Publications (1)

Publication Number Publication Date
NL7116792A true NL7116792A (cg-RX-API-DMAC7.html) 1972-06-20

Family

ID=5791316

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7116792A NL7116792A (cg-RX-API-DMAC7.html) 1970-12-17 1971-12-07

Country Status (14)

Country Link
JP (1) JPS5426494B1 (cg-RX-API-DMAC7.html)
AT (1) AT320371B (cg-RX-API-DMAC7.html)
AU (1) AU464464B2 (cg-RX-API-DMAC7.html)
BE (1) BE776681A (cg-RX-API-DMAC7.html)
CA (1) CA962146A (cg-RX-API-DMAC7.html)
CH (1) CH574505A5 (cg-RX-API-DMAC7.html)
DE (1) DE2062215C3 (cg-RX-API-DMAC7.html)
ES (1) ES397976A1 (cg-RX-API-DMAC7.html)
FR (1) FR2118150B1 (cg-RX-API-DMAC7.html)
GB (1) GB1377515A (cg-RX-API-DMAC7.html)
IT (1) IT945452B (cg-RX-API-DMAC7.html)
NL (1) NL7116792A (cg-RX-API-DMAC7.html)
SE (1) SE377945B (cg-RX-API-DMAC7.html)
ZA (1) ZA718403B (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125649A (en) * 1975-05-27 1978-11-14 Crown City Plating Pre-etch conditioning of polysulfone and other polymers for electroless plating
JPS5832489A (ja) * 1981-08-20 1983-02-25 日東電工株式会社 印刷回路用ポリエステルフイルム
DE3243190A1 (de) * 1982-11-23 1984-05-24 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung metallisierter textiler flaechengebilde

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1042816A (en) * 1964-06-15 1966-09-14 Ibm Improvements in or relating to the production of metallic coatings upon the surfacesof other materials
FR1481700A (fr) * 1965-06-01 1967-05-19 Photocircuits Corp Perfectionnements apportés aux procédés de dépôt non galvanique de métaux
US3561995A (en) * 1967-04-03 1971-02-09 M & T Chemicals Inc Method of activating a polymer surface and resultant article

Also Published As

Publication number Publication date
AT320371B (de) 1975-02-10
SE377945B (cg-RX-API-DMAC7.html) 1975-08-04
DE2062215A1 (de) 1972-07-06
FR2118150B1 (cg-RX-API-DMAC7.html) 1975-10-03
DE2062215C3 (de) 1978-05-18
AU464464B2 (en) 1975-08-28
DE2062215B2 (de) 1977-09-15
CA962146A (en) 1975-02-04
BE776681A (fr) 1972-06-14
AU3684171A (en) 1973-06-21
JPS5426494B1 (cg-RX-API-DMAC7.html) 1979-09-04
IT945452B (it) 1973-05-10
ZA718403B (en) 1972-09-27
GB1377515A (en) 1974-12-18
CH574505A5 (cg-RX-API-DMAC7.html) 1976-04-15
FR2118150A1 (cg-RX-API-DMAC7.html) 1972-07-28
ES397976A1 (es) 1974-07-01

Similar Documents

Publication Publication Date Title
FR2076036B1 (cg-RX-API-DMAC7.html)
DE2127162B2 (cg-RX-API-DMAC7.html)
DK509674A (cg-RX-API-DMAC7.html)
CS174167B2 (cg-RX-API-DMAC7.html)
FR2080826B1 (cg-RX-API-DMAC7.html)
FR2080762B1 (cg-RX-API-DMAC7.html)
FR2078772A5 (cg-RX-API-DMAC7.html)
DK135503C (cg-RX-API-DMAC7.html)
FR2081593B1 (cg-RX-API-DMAC7.html)
FR2080665A1 (cg-RX-API-DMAC7.html)
FR2080779B1 (cg-RX-API-DMAC7.html)
FR2074786A1 (cg-RX-API-DMAC7.html)
FR2078637A5 (cg-RX-API-DMAC7.html)
DE2044768A1 (cg-RX-API-DMAC7.html)
FR2081765A1 (cg-RX-API-DMAC7.html)
FR2078941A5 (cg-RX-API-DMAC7.html)
FR2075097A5 (cg-RX-API-DMAC7.html)
FR2118150B1 (cg-RX-API-DMAC7.html)
FR2080680A1 (cg-RX-API-DMAC7.html)
FR2078773A5 (cg-RX-API-DMAC7.html)
FR2083229A5 (cg-RX-API-DMAC7.html)
FR2078746A5 (cg-RX-API-DMAC7.html)
DE2048098A1 (cg-RX-API-DMAC7.html)
FR2069327A5 (cg-RX-API-DMAC7.html)
FR2074846A5 (cg-RX-API-DMAC7.html)