NL7111335A - - Google Patents
Info
- Publication number
- NL7111335A NL7111335A NL7111335A NL7111335A NL7111335A NL 7111335 A NL7111335 A NL 7111335A NL 7111335 A NL7111335 A NL 7111335A NL 7111335 A NL7111335 A NL 7111335A NL 7111335 A NL7111335 A NL 7111335A
- Authority
- NL
- Netherlands
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/35—Work-parting pullers [bursters]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/4979—Breaking through weakened portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6518870A | 1970-08-19 | 1970-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7111335A true NL7111335A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1972-02-22 |
Family
ID=22060923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7111335A NL7111335A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1970-08-19 | 1971-08-17 |
Country Status (7)
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE385632B (sv) * | 1972-12-27 | 1976-07-12 | Vychislitelny Ts Sib Otdel Aka | Forfarande for framstellning av minnesblock med magnetkernor |
| GB1487201A (en) * | 1974-12-20 | 1977-09-28 | Lucas Electrical Ltd | Method of manufacturing semi-conductor devices |
| US4247031A (en) * | 1979-04-10 | 1981-01-27 | Rca Corporation | Method for cracking and separating pellets formed on a wafer |
| US4732647A (en) * | 1984-10-24 | 1988-03-22 | Aine Harry E | Batch method of making miniature capacitive force transducers assembled in wafer form |
| US4744550A (en) * | 1986-04-24 | 1988-05-17 | Asm America, Inc. | Vacuum wafer expander apparatus |
| EP0363548B1 (en) * | 1988-10-10 | 1994-03-23 | International Business Machines Corporation | Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils |
| US5029418A (en) * | 1990-03-05 | 1991-07-09 | Eastman Kodak Company | Sawing method for substrate cutting operations |
| US5413659A (en) * | 1993-09-30 | 1995-05-09 | Minnesota Mining And Manufacturing Company | Array of conductive pathways |
| US5710065A (en) * | 1995-01-03 | 1998-01-20 | Texas Instruments Incorporated | Method and apparatus for breaking and separating dies from a wafer |
| US5668062A (en) * | 1995-08-23 | 1997-09-16 | Texas Instruments Incorporated | Method for processing semiconductor wafer with reduced particle contamination during saw |
| US6184063B1 (en) | 1996-11-26 | 2001-02-06 | Texas Instruments Incorporated | Method and apparatus for breaking and separating a wafer into die using a multi-radii dome |
| US6685073B1 (en) | 1996-11-26 | 2004-02-03 | Texas Instruments Incorporated | Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer |
| US6162703A (en) | 1998-02-23 | 2000-12-19 | Micron Technology, Inc. | Packaging die preparation |
| US6403449B1 (en) | 2000-04-28 | 2002-06-11 | Micron Technology, Inc. | Method of relieving surface tension on a semiconductor wafer |
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1970
- 1970-08-19 US US65188A patent/US3677875A/en not_active Expired - Lifetime
-
1971
- 1971-08-09 CA CA120064A patent/CA928869A/en not_active Expired
- 1971-08-17 NL NL7111335A patent/NL7111335A/xx unknown
- 1971-08-17 AU AU32434/71A patent/AU3243471A/en not_active Expired
- 1971-08-19 BE BE771535A patent/BE771535A/xx unknown
- 1971-08-19 DE DE19712141682 patent/DE2141682A1/de active Pending
- 1971-08-19 FR FR7130218A patent/FR2102372A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE2141682A1 (de) | 1972-03-16 |
| CA928869A (en) | 1973-06-19 |
| US3677875A (en) | 1972-07-18 |
| AU3243471A (en) | 1973-02-22 |
| FR2102372A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1972-04-07 |
| BE771535A (fr) | 1972-02-21 |