Classifications

• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
  • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
  • G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10B—ELECTRONIC MEMORY DEVICES
  • H10B20/00—Read-only memory [ROM] devices
  • H10B20/20—Programmable ROM [PROM] devices comprising field-effect components
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D99/00—Subject matter not provided for in other groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/01—Manufacture or treatment
  • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
  • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
  • Y10S257/926—Elongated lead extending axially through another elongated lead

Applications Claiming Priority (1)

Publications (1)

Family

ID=5770900

Family Applications (1)

Country Status (10)

Families Citing this family (19)

Family Cites Families (4)

• 1970
  • 1970-05-12 DE DE2023219A patent/DE2023219C3/de not_active Expired
• 1971
  • 1971-04-16 CH CH552071A patent/CH531773A/de not_active IP Right Cessation
  • 1971-04-28 AT AT366771A patent/AT314229B/de not_active IP Right Cessation
  • 1971-05-07 NL NL7106319A patent/NL7106319A/xx unknown
  • 1971-05-10 SE SE7106057A patent/SE379879C/xx unknown
  • 1971-05-10 US US00141725A patent/US3781825A/en not_active Expired - Lifetime
  • 1971-05-11 FR FR7116900A patent/FR2088515B1/fr not_active Expired
  • 1971-05-11 GB GB1434771*[A patent/GB1312171A/en not_active Expired
  • 1971-05-12 CA CA112,781A patent/CA958123A/en not_active Expired
  • 1971-05-12 JP JP3191171A patent/JPS5620637B1/ja active Pending

Also Published As

Similar Documents