NL7008966A - - Google Patents

Info

Publication number
NL7008966A
NL7008966A NL7008966A NL7008966A NL7008966A NL 7008966 A NL7008966 A NL 7008966A NL 7008966 A NL7008966 A NL 7008966A NL 7008966 A NL7008966 A NL 7008966A NL 7008966 A NL7008966 A NL 7008966A
Authority
NL
Netherlands
Application number
NL7008966A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691931335 external-priority patent/DE1931335C3/de
Application filed filed Critical
Publication of NL7008966A publication Critical patent/NL7008966A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
NL7008966A 1969-06-20 1970-06-18 NL7008966A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931335 DE1931335C3 (de) 1969-06-20 Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens

Publications (1)

Publication Number Publication Date
NL7008966A true NL7008966A (enrdf_load_stackoverflow) 1970-12-22

Family

ID=5737534

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7008966A NL7008966A (enrdf_load_stackoverflow) 1969-06-20 1970-06-18

Country Status (9)

Country Link
US (1) US3694972A (enrdf_load_stackoverflow)
JP (1) JPS5013510B1 (enrdf_load_stackoverflow)
AT (1) AT315241B (enrdf_load_stackoverflow)
CH (1) CH504783A (enrdf_load_stackoverflow)
FR (1) FR2046967B1 (enrdf_load_stackoverflow)
GB (1) GB1259249A (enrdf_load_stackoverflow)
NL (1) NL7008966A (enrdf_load_stackoverflow)
SE (1) SE351523B (enrdf_load_stackoverflow)
ZA (1) ZA704234B (enrdf_load_stackoverflow)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778935A (en) * 1972-01-26 1973-12-18 Pennwalt Corp Abrading apparatus with rotary index table
CH566643A5 (enrdf_load_stackoverflow) * 1973-10-11 1975-09-15 Bbc Brown Boveri & Cie
US3888054A (en) * 1973-11-16 1975-06-10 Western Electric Co Method for abrasive cutting in a liquid
US3866357A (en) * 1974-06-06 1975-02-18 Pennwalt Corp Abrading apparatus
DE2522346C3 (de) * 1975-05-20 1978-10-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen von Halbleiterbauelementen
US4702042A (en) * 1984-09-27 1987-10-27 Libbey-Owens-Ford Co. Cutting strengthened glass
CA1252711A (en) * 1984-09-27 1989-04-18 Richard A. Herrington Ultra-high pressure abrasive jet cutting of glass
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
JPS61159371A (ja) * 1984-12-28 1986-07-19 Fuji Seiki Seizosho:Kk Ｉｃの基板用シリコンウェーハのブラスト装置
US5052155A (en) * 1989-08-10 1991-10-01 Emc Technology, Inc. Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material
DE4235091C2 (de) * 1992-10-17 2001-09-06 Trumpf Sachsen Gmbh Flüssigkeits- und Abrasivmittelzuführung für eine Fluidstrahlschneidanlage
US6705925B1 (en) * 2000-10-20 2004-03-16 Lightwave Microsystems Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
JP2005539381A (ja) * 2002-09-13 2005-12-22 トーワ−インターコン・テクノロジー・インコーポレーテッド 基板のジェット個別切断
US7153186B2 (en) * 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
EP1873824B1 (en) * 2002-09-13 2009-03-11 Towa-Intercon Technology, Inc. Jet singulation of a substrate
DE10337920B4 (de) * 2003-08-18 2008-08-28 Schott Ag Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes
US20060180579A1 (en) * 2005-02-11 2006-08-17 Towa Intercon Technology, Inc. Multidirectional cutting chuck
JP4791787B2 (ja) * 2005-09-22 2011-10-12 Ｔｏｗａ株式会社 アブレイシブウォータジェットを使用した切断装置
JP2008284635A (ja) * 2007-05-16 2008-11-27 Disco Abrasive Syst Ltd ウォータジェット加工方法
JP2008307639A (ja) * 2007-06-14 2008-12-25 Disco Abrasive Syst Ltd ウォータジェット加工方法
JP6022862B2 (ja) * 2012-05-08 2016-11-09 株式会社不二製作所 硬質脆性基板の切り出し方法及び切り出し装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US587892A (en) * 1897-08-10 M a t iiia s w a l t e k
US1664159A (en) * 1926-04-23 1928-03-27 Elroy A Chase Apparatus for producing ornamental background on stone
GB794528A (en) * 1955-10-07 1958-05-07 William Howard Mead Improvements in receivers for particulate material
US3205104A (en) * 1961-07-10 1965-09-07 Litton Industries Inc Fabrication of interdigital delay lines
US3187412A (en) * 1963-04-26 1965-06-08 Gen Electric Method of mounting and aligning transducers on delay lines
US3262234A (en) * 1963-10-04 1966-07-26 Int Rectifier Corp Method of forming a semiconductor rim by sandblasting
US3453781A (en) * 1966-03-30 1969-07-08 Ibm Tailoring microminiature components
US3516204A (en) * 1967-08-21 1970-06-23 Pennwalt Corp Abrading apparatus

Also Published As

Publication number Publication date
FR2046967B1 (enrdf_load_stackoverflow) 1974-09-20
FR2046967A1 (enrdf_load_stackoverflow) 1971-03-12
US3694972A (en) 1972-10-03
SE351523B (enrdf_load_stackoverflow) 1972-11-27
AT315241B (de) 1974-05-10
JPS5013510B1 (enrdf_load_stackoverflow) 1975-05-20
GB1259249A (enrdf_load_stackoverflow) 1972-01-05
ZA704234B (en) 1971-03-31
DE1931335B2 (de) 1976-03-11
CH504783A (de) 1971-03-15
DE1931335A1 (de) 1970-12-23

Similar Documents

Publication Publication Date Title
AU2270770A (enrdf_load_stackoverflow)
FR2046967B1 (enrdf_load_stackoverflow)
AU465413B2 (enrdf_load_stackoverflow)
AU429630B2 (enrdf_load_stackoverflow)
AU450150B2 (enrdf_load_stackoverflow)
CS151028B2 (enrdf_load_stackoverflow)
AU442375B2 (enrdf_load_stackoverflow)
AU2355770A (enrdf_load_stackoverflow)
CS151033B2 (enrdf_load_stackoverflow)
CS152470B2 (enrdf_load_stackoverflow)
AU427401B2 (enrdf_load_stackoverflow)
AU410358B2 (enrdf_load_stackoverflow)
AU428074B2 (enrdf_load_stackoverflow)
AU442535B2 (enrdf_load_stackoverflow)
AU438128B2 (enrdf_load_stackoverflow)
AT308690B (enrdf_load_stackoverflow)
AU442538B2 (enrdf_load_stackoverflow)
AU442357B2 (enrdf_load_stackoverflow)
AU414607B2 (enrdf_load_stackoverflow)
AU417208B2 (enrdf_load_stackoverflow)
AU442322B2 (enrdf_load_stackoverflow)
AU425297B2 (enrdf_load_stackoverflow)
AU442554B2 (enrdf_load_stackoverflow)
AU428129B2 (enrdf_load_stackoverflow)
AU442285B2 (enrdf_load_stackoverflow)