NL6911177A - - Google Patents

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Publication number
NL6911177A
NL6911177A NL6911177A NL6911177A NL6911177A NL 6911177 A NL6911177 A NL 6911177A NL 6911177 A NL6911177 A NL 6911177A NL 6911177 A NL6911177 A NL 6911177A NL 6911177 A NL6911177 A NL 6911177A
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NL
Netherlands
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NL6911177A
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Publication date
Application filed filed Critical
Publication of NL6911177A publication Critical patent/NL6911177A/xx

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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Element Separation (AREA)
NL6911177A 1968-07-26 1969-07-22 NL6911177A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3587168 1968-07-26

Publications (1)

Publication Number Publication Date
NL6911177A true NL6911177A (enrdf_load_stackoverflow) 1970-01-29

Family

ID=10382481

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6911177A NL6911177A (enrdf_load_stackoverflow) 1968-07-26 1969-07-22

Country Status (6)

Country Link
BE (1) BE736688A (enrdf_load_stackoverflow)
CH (1) CH496321A (enrdf_load_stackoverflow)
DE (1) DE1937638A1 (enrdf_load_stackoverflow)
FR (1) FR2014747A1 (enrdf_load_stackoverflow)
GB (1) GB1230620A (enrdf_load_stackoverflow)
NL (1) NL6911177A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56501784A (enrdf_load_stackoverflow) * 1979-12-18 1981-12-03
US4649415A (en) * 1985-01-15 1987-03-10 National Semiconductor Corporation Semiconductor package with tape mounted die
GB2195825B (en) * 1986-09-22 1990-01-10 Motorola Inc Integrated circuit package
FR2758417B1 (fr) * 1997-01-16 1999-04-09 Thomson Csf Boitier d'encapsulation de composant hyperfrequence, et procede d'obtention

Also Published As

Publication number Publication date
FR2014747A1 (enrdf_load_stackoverflow) 1970-04-17
DE1937638A1 (de) 1970-02-05
CH496321A (de) 1970-09-15
GB1230620A (enrdf_load_stackoverflow) 1971-05-05
BE736688A (enrdf_load_stackoverflow) 1970-01-28

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