NL6907539A - - Google Patents
Info
- Publication number
- NL6907539A NL6907539A NL6907539A NL6907539A NL6907539A NL 6907539 A NL6907539 A NL 6907539A NL 6907539 A NL6907539 A NL 6907539A NL 6907539 A NL6907539 A NL 6907539A NL 6907539 A NL6907539 A NL 6907539A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US72998568A | 1968-05-17 | 1968-05-17 | |
| US73004768A | 1968-05-17 | 1968-05-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6907539A true NL6907539A (Direct) | 1969-11-19 |
Family
ID=27111970
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6907539A NL6907539A (Direct) | 1968-05-17 | 1969-05-16 | |
| NL6907540.A NL163065C (nl) | 1968-05-17 | 1969-05-16 | Halfgeleiderinrichting, omvattende een samengestelde aansluitelektrodelaag, bestaande uit een eerste metaallaag, die wolfraam bevat en een tweede metaallaag van een metaal met een hoog geleidingsvermogen, die de eerste metaallaag bedekt. |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6907540.A NL163065C (nl) | 1968-05-17 | 1969-05-16 | Halfgeleiderinrichting, omvattende een samengestelde aansluitelektrodelaag, bestaande uit een eerste metaallaag, die wolfraam bevat en een tweede metaallaag van een metaal met een hoog geleidingsvermogen, die de eerste metaallaag bedekt. |
Country Status (4)
| Country | Link |
|---|---|
| DE (2) | DE1923253A1 (Direct) |
| FR (2) | FR2011844B1 (Direct) |
| GB (2) | GB1263381A (Direct) |
| NL (2) | NL6907539A (Direct) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE763522A (fr) * | 1970-03-03 | 1971-07-16 | Licentia Gmbh | Serie de couches de contact pour des elements de construction semi-conducteurs |
| US4166279A (en) * | 1977-12-30 | 1979-08-28 | International Business Machines Corporation | Electromigration resistance in gold thin film conductors |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL134170C (Direct) * | 1963-12-17 | 1900-01-01 | ||
| US3368113A (en) * | 1965-06-28 | 1968-02-06 | Westinghouse Electric Corp | Integrated circuit structures, and method of making same, including a dielectric medium for internal isolation |
| DE1283970B (de) * | 1966-03-19 | 1968-11-28 | Siemens Ag | Metallischer Kontakt an einem Halbleiterbauelement |
| NL6706641A (Direct) * | 1966-11-07 | 1968-11-13 |
-
1969
- 1969-05-01 GB GB22235/69A patent/GB1263381A/en not_active Expired
- 1969-05-07 DE DE19691923253 patent/DE1923253A1/de active Pending
- 1969-05-08 GB GB1265896D patent/GB1265896A/en not_active Expired
- 1969-05-16 DE DE1924845A patent/DE1924845C3/de not_active Expired
- 1969-05-16 NL NL6907539A patent/NL6907539A/xx unknown
- 1969-05-16 NL NL6907540.A patent/NL163065C/xx not_active IP Right Cessation
- 1969-05-16 FR FR696915845A patent/FR2011844B1/fr not_active Expired
- 1969-05-16 FR FR696915846A patent/FR2008771B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2008771B1 (Direct) | 1973-08-10 |
| GB1263381A (en) | 1972-02-09 |
| NL163065C (nl) | 1980-07-15 |
| GB1265896A (Direct) | 1972-03-08 |
| DE1923253A1 (de) | 1969-12-11 |
| DE1924845B2 (de) | 1978-03-09 |
| FR2011844B1 (Direct) | 1973-07-13 |
| FR2011844A1 (Direct) | 1970-03-13 |
| NL163065B (nl) | 1980-02-15 |
| FR2008771A1 (Direct) | 1970-01-23 |
| DE1924845C3 (de) | 1978-11-16 |
| DE1924845A1 (de) | 1969-11-27 |
| NL6907540A (Direct) | 1969-11-19 |