NL6902447A - - Google Patents
Info
- Publication number
- NL6902447A NL6902447A NL6902447A NL6902447A NL6902447A NL 6902447 A NL6902447 A NL 6902447A NL 6902447 A NL6902447 A NL 6902447A NL 6902447 A NL6902447 A NL 6902447A NL 6902447 A NL6902447 A NL 6902447A
- Authority
- NL
- Netherlands
Links
Classifications
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01H—SPINNING OR TWISTING
- D01H7/00—Spinning or twisting arrangements
- D01H7/02—Spinning or twisting arrangements for imparting permanent twist
- D01H7/04—Spindles
- D01H7/08—Mounting arrangements
- D01H7/12—Bolsters; Bearings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C17/00—Sliding-contact bearings for exclusively rotary movement
- F16C17/04—Sliding-contact bearings for exclusively rotary movement for axial load only
- F16C17/08—Sliding-contact bearings for exclusively rotary movement for axial load only for supporting the end face of a shaft or other member, e.g. footstep bearings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C17/00—Sliding-contact bearings for exclusively rotary movement
- F16C17/10—Sliding-contact bearings for exclusively rotary movement for both radial and axial load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N80/00—Bulk negative-resistance effect devices
- H10N80/10—Gunn-effect devices
- H10N80/107—Gunn diodes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C2340/00—Apparatus for treating textiles
- F16C2340/18—Apparatus for spinning or twisting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
- Y02P70/62—Manufacturing or production processes characterised by the final manufactured product related technologies for production or treatment of textile or flexible materials or products thereof, including footwear
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Textile Engineering (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Spinning Or Twisting Of Yarns (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6902447A NL6902447A (fr) | 1969-02-14 | 1969-02-14 | |
DE2002810A DE2002810C3 (de) | 1969-02-14 | 1970-01-22 | Halbleiterdiode zum Erzeugen oder Verstarken von Mikrowellen und Verfahren zu ihrem Betrieb |
CH199270A CH504811A (de) | 1969-02-14 | 1970-02-11 | Halbleitervorrichtung zum Erzeugen oder Verstärken von Mikrowellen |
AT121970A ATA121970A (de) | 1969-02-14 | 1970-02-11 | Halbleiterbauelement mit wenigstens einer volumeneffekt-negativwiderstandsdiode oder lawinendiode zum erzeugen oder verstarken von mikrowellen |
SE01736/70A SE348598B (fr) | 1969-02-14 | 1970-02-11 | |
BR216689/70A BR7016689D0 (pt) | 1969-02-14 | 1970-02-11 | Dispositivo semicondutor para produzir ou amplificar micro-ondas |
GB1296348D GB1296348A (fr) | 1969-02-14 | 1970-02-11 | |
BE745906D BE745906A (fr) | 1969-02-14 | 1970-02-12 | Dispositif semi-conducteur |
FR7004919A FR2031421B1 (fr) | 1969-02-14 | 1970-02-12 | |
JP45012219A JPS4834464B1 (fr) | 1969-02-14 | 1970-02-13 | |
GB1296748D GB1296748A (fr) | 1969-02-14 | 1970-06-16 | |
US3669518D US3669518A (en) | 1969-02-14 | 1970-06-17 | Footstep bearing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6902447A NL6902447A (fr) | 1969-02-14 | 1969-02-14 | |
DE19696924371 DE6924371U (de) | 1969-06-16 | 1969-06-16 | Fusslager fuer spinn- und zwirnspindeln |
Publications (1)
Publication Number | Publication Date |
---|---|
NL6902447A true NL6902447A (fr) | 1970-08-18 |
Family
ID=25946352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL6902447A NL6902447A (fr) | 1969-02-14 | 1969-02-14 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3669518A (fr) |
BE (1) | BE745906A (fr) |
CH (1) | CH504811A (fr) |
DE (1) | DE2002810C3 (fr) |
FR (1) | FR2031421B1 (fr) |
GB (2) | GB1296348A (fr) |
NL (1) | NL6902447A (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3755752A (en) * | 1971-04-26 | 1973-08-28 | Raytheon Co | Back-to-back semiconductor high frequency device |
US4160992A (en) * | 1977-09-14 | 1979-07-10 | Raytheon Company | Plural semiconductor devices mounted between plural heat sinks |
DE2907949A1 (de) * | 1979-03-01 | 1980-09-11 | Siemens Ag | Halbleiter-millimeterwellen-oszillator-diode |
US4376488A (en) * | 1979-06-29 | 1983-03-15 | Amsted Industries Incorporated | Railway coupler carrier assembly |
DE2926756C2 (de) * | 1979-07-03 | 1984-03-22 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Schottky-Dioden-Anordnung |
DE2926757C2 (de) * | 1979-07-03 | 1983-08-04 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiteranordnung mit negativem differentiellen Widerstand |
DE2926805C2 (de) * | 1979-07-03 | 1983-08-04 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Dioden-Anordnung |
DE2926786C2 (de) * | 1979-07-03 | 1983-10-20 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Bauelement mit durch ein Magnetfeld steuerbaren Widerstand und Verwendung |
DE2926802C2 (de) * | 1979-07-03 | 1983-08-04 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Mehrfach-Dioden-Anordnung und Verfahren zu ihrer Herstellung |
FR2515866A1 (fr) * | 1981-10-30 | 1983-05-06 | Thomson Csf | Dispositif a transfert d'electrons fonctionnant le domaine des hyperfrequences |
US4536469A (en) * | 1981-11-23 | 1985-08-20 | Raytheon Company | Semiconductor structures and manufacturing methods |
GB2182105B (en) * | 1983-10-21 | 1988-10-26 | Daido Metal Co | Composite sliding and/or bearing structure |
JPS6088222A (ja) * | 1983-10-21 | 1985-05-18 | Daido Metal Kogyo Kk | 複合摺動体 |
JPS6124815A (ja) * | 1984-07-13 | 1986-02-03 | Daido Metal Kogyo Kk | 軸受ブシユ |
JPS6162780U (fr) * | 1984-09-28 | 1986-04-28 | ||
DE19603929A1 (de) * | 1996-02-03 | 1997-08-07 | Kolbenschmidt Ag | Buchsenförmiges Gleitlagerelement |
-
1969
- 1969-02-14 NL NL6902447A patent/NL6902447A/xx unknown
-
1970
- 1970-01-22 DE DE2002810A patent/DE2002810C3/de not_active Expired
- 1970-02-11 CH CH199270A patent/CH504811A/de not_active IP Right Cessation
- 1970-02-11 GB GB1296348D patent/GB1296348A/en not_active Expired
- 1970-02-12 BE BE745906D patent/BE745906A/fr unknown
- 1970-02-12 FR FR7004919A patent/FR2031421B1/fr not_active Expired
- 1970-06-16 GB GB1296748D patent/GB1296748A/en not_active Expired
- 1970-06-17 US US3669518D patent/US3669518A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
BE745906A (fr) | 1970-08-12 |
FR2031421A1 (fr) | 1970-11-20 |
DE2002810B2 (de) | 1978-02-09 |
CH504811A (de) | 1971-03-15 |
GB1296748A (fr) | 1972-11-15 |
GB1296348A (fr) | 1972-11-15 |
FR2031421B1 (fr) | 1974-02-01 |
US3669518A (en) | 1972-06-13 |
DE2002810A1 (de) | 1970-09-03 |
DE2002810C3 (de) | 1978-09-28 |