JPS4834464B1 - - Google Patents

Info

Publication number
JPS4834464B1
JPS4834464B1 JP45012219A JP1221970A JPS4834464B1 JP S4834464 B1 JPS4834464 B1 JP S4834464B1 JP 45012219 A JP45012219 A JP 45012219A JP 1221970 A JP1221970 A JP 1221970A JP S4834464 B1 JPS4834464 B1 JP S4834464B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45012219A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL6902447A external-priority patent/NL6902447A/xx
Application filed filed Critical
Publication of JPS4834464B1 publication Critical patent/JPS4834464B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microwave Amplifiers (AREA)
JP45012219A 1969-02-14 1970-02-13 Pending JPS4834464B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6902447A NL6902447A (fr) 1969-02-14 1969-02-14

Publications (1)

Publication Number Publication Date
JPS4834464B1 true JPS4834464B1 (fr) 1973-10-22

Family

ID=19806168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45012219A Pending JPS4834464B1 (fr) 1969-02-14 1970-02-13

Country Status (4)

Country Link
JP (1) JPS4834464B1 (fr)
AT (1) ATA121970A (fr)
BR (1) BR7016689D0 (fr)
SE (1) SE348598B (fr)

Also Published As

Publication number Publication date
SE348598B (fr) 1972-09-04
ATA121970A (de) 1975-04-15
BR7016689D0 (pt) 1973-01-16

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