SE348598B - - Google Patents
Info
- Publication number
- SE348598B SE348598B SE01736/70A SE173670A SE348598B SE 348598 B SE348598 B SE 348598B SE 01736/70 A SE01736/70 A SE 01736/70A SE 173670 A SE173670 A SE 173670A SE 348598 B SE348598 B SE 348598B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Microwave Amplifiers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6902447A NL6902447A (fr) | 1969-02-14 | 1969-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE348598B true SE348598B (fr) | 1972-09-04 |
Family
ID=19806168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE01736/70A SE348598B (fr) | 1969-02-14 | 1970-02-11 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS4834464B1 (fr) |
| AT (1) | ATA121970A (fr) |
| BR (1) | BR7016689D0 (fr) |
| SE (1) | SE348598B (fr) |
-
1970
- 1970-02-11 SE SE01736/70A patent/SE348598B/xx unknown
- 1970-02-11 BR BR216689/70A patent/BR7016689D0/pt unknown
- 1970-02-11 AT AT121970A patent/ATA121970A/de not_active Application Discontinuation
- 1970-02-13 JP JP45012219A patent/JPS4834464B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| ATA121970A (de) | 1975-04-15 |
| JPS4834464B1 (fr) | 1973-10-22 |
| BR7016689D0 (pt) | 1973-01-16 |