NL6717634A - - Google Patents

Info

Publication number
NL6717634A
NL6717634A NL6717634A NL6717634A NL6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A
Authority
NL
Netherlands
Application number
NL6717634A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6717634A priority Critical patent/NL6717634A/xx
Priority to US780085A priority patent/US3555375A/en
Priority to DE1812942A priority patent/DE1812942C3/de
Priority to FR1595201D priority patent/FR1595201A/fr
Priority to AT1235268A priority patent/AT302418B/de
Priority to GB60379/68A priority patent/GB1245610A/en
Priority to CH1899468A priority patent/CH485322A/de
Priority to BE725859D priority patent/BE725859A/xx
Publication of NL6717634A publication Critical patent/NL6717634A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Wire Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Amplifiers (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
NL6717634A 1967-12-22 1967-12-22 NL6717634A (https=)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL6717634A NL6717634A (https=) 1967-12-22 1967-12-22
US780085A US3555375A (en) 1967-12-22 1968-11-29 High frequency power transistor having crossing input and output leads
DE1812942A DE1812942C3 (de) 1967-12-22 1968-12-05 Halbleiteranordnung und Schaltungsanordnung mit einer solchen Halbleiteranordnung
FR1595201D FR1595201A (https=) 1967-12-22 1968-12-17
AT1235268A AT302418B (de) 1967-12-22 1968-12-19 Halbleitervorrichtung, insbesondere Transistor
GB60379/68A GB1245610A (en) 1967-12-22 1968-12-19 Improvements in and relating to semiconductor devices
CH1899468A CH485322A (de) 1967-12-22 1968-12-19 Halbleitervorrichtung
BE725859D BE725859A (https=) 1967-12-22 1968-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6717634A NL6717634A (https=) 1967-12-22 1967-12-22

Publications (1)

Publication Number Publication Date
NL6717634A true NL6717634A (https=) 1969-06-24

Family

ID=19802087

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6717634A NL6717634A (https=) 1967-12-22 1967-12-22

Country Status (8)

Country Link
US (1) US3555375A (https=)
AT (1) AT302418B (https=)
BE (1) BE725859A (https=)
CH (1) CH485322A (https=)
DE (1) DE1812942C3 (https=)
FR (1) FR1595201A (https=)
GB (1) GB1245610A (https=)
NL (1) NL6717634A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671793A (en) * 1969-09-16 1972-06-20 Itt High frequency transistor structure having an impedance transforming network incorporated on the semiconductor chip
US3649872A (en) * 1970-07-15 1972-03-14 Trw Inc Packaging structure for high-frequency semiconductor devices
DE2203892C3 (de) * 1971-02-08 1982-05-27 TRW Inc., Los Angeles, Calif. Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
JPS52120768A (en) * 1976-04-05 1977-10-11 Nec Corp Semiconductor device
US4107728A (en) * 1977-01-07 1978-08-15 Varian Associates, Inc. Package for push-pull semiconductor devices
US4193083A (en) * 1977-01-07 1980-03-11 Varian Associates, Inc. Package for push-pull semiconductor devices
EP1237189A1 (en) 2001-02-28 2002-09-04 Motorola, Inc. Arrangement and method for impedance matching
US8410601B2 (en) * 2009-11-15 2013-04-02 Microsemi Corporation RF package
US8034666B2 (en) * 2009-11-15 2011-10-11 Microsemi Corporation Multi-layer thick-film RF package
US10137789B2 (en) * 2016-07-20 2018-11-27 Ford Global Technologies, Llc Signal pin arrangement for multi-device power module
JP6541859B1 (ja) * 2018-11-01 2019-07-10 三菱電機株式会社 電力変換装置

Also Published As

Publication number Publication date
DE1812942A1 (de) 1969-07-03
GB1245610A (en) 1971-09-08
DE1812942B2 (de) 1980-04-24
DE1812942C3 (de) 1981-01-08
FR1595201A (https=) 1970-06-08
CH485322A (de) 1970-01-31
US3555375A (en) 1971-01-12
BE725859A (https=) 1969-06-20
AT302418B (de) 1972-10-10

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