NL6717634A - - Google Patents

Info

Publication number
NL6717634A
NL6717634A NL6717634A NL6717634A NL6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A NL 6717634 A NL6717634 A NL 6717634A
Authority
NL
Netherlands
Application number
NL6717634A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6717634A priority Critical patent/NL6717634A/xx
Priority to US780085A priority patent/US3555375A/en
Priority to DE1812942A priority patent/DE1812942C3/de
Priority to FR1595201D priority patent/FR1595201A/fr
Priority to CH1899468A priority patent/CH485322A/de
Priority to AT1235268A priority patent/AT302418B/de
Priority to GB60379/68A priority patent/GB1245610A/en
Priority to BE725859D priority patent/BE725859A/xx
Publication of NL6717634A publication Critical patent/NL6717634A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Amplifiers (AREA)
  • Junction Field-Effect Transistors (AREA)
NL6717634A 1967-12-22 1967-12-22 NL6717634A (OSRAM)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL6717634A NL6717634A (OSRAM) 1967-12-22 1967-12-22
US780085A US3555375A (en) 1967-12-22 1968-11-29 High frequency power transistor having crossing input and output leads
DE1812942A DE1812942C3 (de) 1967-12-22 1968-12-05 Halbleiteranordnung und Schaltungsanordnung mit einer solchen Halbleiteranordnung
FR1595201D FR1595201A (OSRAM) 1967-12-22 1968-12-17
CH1899468A CH485322A (de) 1967-12-22 1968-12-19 Halbleitervorrichtung
AT1235268A AT302418B (de) 1967-12-22 1968-12-19 Halbleitervorrichtung, insbesondere Transistor
GB60379/68A GB1245610A (en) 1967-12-22 1968-12-19 Improvements in and relating to semiconductor devices
BE725859D BE725859A (OSRAM) 1967-12-22 1968-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6717634A NL6717634A (OSRAM) 1967-12-22 1967-12-22

Publications (1)

Publication Number Publication Date
NL6717634A true NL6717634A (OSRAM) 1969-06-24

Family

ID=19802087

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6717634A NL6717634A (OSRAM) 1967-12-22 1967-12-22

Country Status (8)

Country Link
US (1) US3555375A (OSRAM)
AT (1) AT302418B (OSRAM)
BE (1) BE725859A (OSRAM)
CH (1) CH485322A (OSRAM)
DE (1) DE1812942C3 (OSRAM)
FR (1) FR1595201A (OSRAM)
GB (1) GB1245610A (OSRAM)
NL (1) NL6717634A (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671793A (en) * 1969-09-16 1972-06-20 Itt High frequency transistor structure having an impedance transforming network incorporated on the semiconductor chip
US3649872A (en) * 1970-07-15 1972-03-14 Trw Inc Packaging structure for high-frequency semiconductor devices
DE2203892C3 (de) * 1971-02-08 1982-05-27 TRW Inc., Los Angeles, Calif. Transistoranordnung mit mehreren zur Leistungserhöhung bei hohen Frequenzen parallel geschalteten Transistorelementen
JPS52120768A (en) * 1976-04-05 1977-10-11 Nec Corp Semiconductor device
US4193083A (en) * 1977-01-07 1980-03-11 Varian Associates, Inc. Package for push-pull semiconductor devices
US4107728A (en) * 1977-01-07 1978-08-15 Varian Associates, Inc. Package for push-pull semiconductor devices
EP1237189A1 (en) * 2001-02-28 2002-09-04 Motorola, Inc. Arrangement and method for impedance matching
US8034666B2 (en) * 2009-11-15 2011-10-11 Microsemi Corporation Multi-layer thick-film RF package
US8410601B2 (en) * 2009-11-15 2013-04-02 Microsemi Corporation RF package
US10137789B2 (en) * 2016-07-20 2018-11-27 Ford Global Technologies, Llc Signal pin arrangement for multi-device power module
JP6541859B1 (ja) * 2018-11-01 2019-07-10 三菱電機株式会社 電力変換装置

Also Published As

Publication number Publication date
DE1812942A1 (de) 1969-07-03
GB1245610A (en) 1971-09-08
CH485322A (de) 1970-01-31
DE1812942C3 (de) 1981-01-08
FR1595201A (OSRAM) 1970-06-08
AT302418B (de) 1972-10-10
BE725859A (OSRAM) 1969-06-20
US3555375A (en) 1971-01-12
DE1812942B2 (de) 1980-04-24

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