NL6714336A - - Google Patents

Info

Publication number
NL6714336A
NL6714336A NL6714336A NL6714336A NL6714336A NL 6714336 A NL6714336 A NL 6714336A NL 6714336 A NL6714336 A NL 6714336A NL 6714336 A NL6714336 A NL 6714336A NL 6714336 A NL6714336 A NL 6714336A
Authority
NL
Netherlands
Application number
NL6714336A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6714336A priority Critical patent/NL6714336A/xx
Priority to US767062A priority patent/US3579056A/en
Priority to DE19681803138 priority patent/DE1803138A1/de
Priority to FR1591647D priority patent/FR1591647A/fr
Priority to SE14114/68A priority patent/SE352480B/xx
Priority to GB1250815D priority patent/GB1250815A/en
Priority to CH1565468A priority patent/CH496322A/de
Priority to BR203288/68A priority patent/BR6803288D0/pt
Priority to ES359345A priority patent/ES359345A1/es
Priority to BE722669D priority patent/BE722669A/xx
Publication of NL6714336A publication Critical patent/NL6714336A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips
NL6714336A 1967-10-21 1967-10-21 NL6714336A (cg-RX-API-DMAC7.html)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL6714336A NL6714336A (cg-RX-API-DMAC7.html) 1967-10-21 1967-10-21
US767062A US3579056A (en) 1967-10-21 1968-10-10 Semiconductor circuit having active devices embedded in flexible sheet
DE19681803138 DE1803138A1 (de) 1967-10-21 1968-10-15 Halbleitervorrichtung
FR1591647D FR1591647A (cg-RX-API-DMAC7.html) 1967-10-21 1968-10-17
SE14114/68A SE352480B (cg-RX-API-DMAC7.html) 1967-10-21 1968-10-18
GB1250815D GB1250815A (cg-RX-API-DMAC7.html) 1967-10-21 1968-10-18
CH1565468A CH496322A (de) 1967-10-21 1968-10-18 Halbleitervorrichtung
BR203288/68A BR6803288D0 (pt) 1967-10-21 1968-10-18 Dispositivo semicondutor e processo para fazer o mesmo
ES359345A ES359345A1 (es) 1967-10-21 1968-10-19 Un dispositivo semiconductor.
BE722669D BE722669A (cg-RX-API-DMAC7.html) 1967-10-21 1968-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6714336A NL6714336A (cg-RX-API-DMAC7.html) 1967-10-21 1967-10-21

Publications (1)

Publication Number Publication Date
NL6714336A true NL6714336A (cg-RX-API-DMAC7.html) 1969-04-23

Family

ID=19801524

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6714336A NL6714336A (cg-RX-API-DMAC7.html) 1967-10-21 1967-10-21

Country Status (10)

Country Link
US (1) US3579056A (cg-RX-API-DMAC7.html)
BE (1) BE722669A (cg-RX-API-DMAC7.html)
BR (1) BR6803288D0 (cg-RX-API-DMAC7.html)
CH (1) CH496322A (cg-RX-API-DMAC7.html)
DE (1) DE1803138A1 (cg-RX-API-DMAC7.html)
ES (1) ES359345A1 (cg-RX-API-DMAC7.html)
FR (1) FR1591647A (cg-RX-API-DMAC7.html)
GB (1) GB1250815A (cg-RX-API-DMAC7.html)
NL (1) NL6714336A (cg-RX-API-DMAC7.html)
SE (1) SE352480B (cg-RX-API-DMAC7.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
JPS51150068A (en) * 1975-06-19 1976-12-23 Citizen Watch Co Ltd Electronic circuit block
JPS54158669A (en) * 1978-06-05 1979-12-14 Matsushita Electric Industrial Co Ltd Printed circuit board
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
DE20117575U1 (de) * 2001-10-26 2002-03-28 Moser, Helmut, Dipl.-Volkswirt, 76646 Bruchsal Sandwichplatte mit beidseitigen Leuchtfeldern
DE10153609C2 (de) * 2001-11-02 2003-10-16 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
DE10164800B4 (de) 2001-11-02 2005-03-31 Infineon Technologies Ag Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
DE10250621B4 (de) * 2002-10-30 2004-09-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips
TW200507131A (en) * 2003-07-02 2005-02-16 North Corp Multi-layer circuit board for electronic device
US7768117B2 (en) * 2007-05-30 2010-08-03 Tessera, Inc. Microelectronic package having interconnected redistribution paths
US8237259B2 (en) 2007-06-13 2012-08-07 Infineon Technologies Ag Embedded chip package
US7968378B2 (en) * 2008-02-06 2011-06-28 Infineon Technologies Ag Electronic device
DE102010039156A1 (de) 2010-08-10 2012-02-16 Robert Bosch Gmbh Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung
DE102010040704A1 (de) 2010-09-14 2012-03-15 Robert Bosch Gmbh Verfahren zum Aufbauen einer elektrischen Schaltung und elektrische Schaltung
WO2013091605A1 (de) 2011-12-19 2013-06-27 Inoviscoat Gmbh Leuchtbild
DE102012005192A1 (de) * 2011-12-19 2013-06-20 Inoviscoat Gmbh Leuchtbild
ES2648364T3 (es) 2011-12-19 2018-01-02 Inoviscoat Gmbh Elementos luminosos con una disposición electroluminiscente así como procedimiento para la producción de un elemento luminoso
US9129959B2 (en) 2012-08-21 2015-09-08 Infineon Technologies Ag Method for manufacturing an electronic module and an electronic module
CN106030781B (zh) 2013-12-19 2019-06-14 英特尔公司 柔软包裹的集成电路管芯

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040416A (en) * 1959-05-13 1962-06-26 Hoffman Electronics Corp Method of making a large area solar cell panel
US3121177A (en) * 1962-01-23 1964-02-11 Robert H Davis Active thin-film devices controlling current by modulation of a quantum mechanical potential barrier
DE1514460A1 (de) * 1965-05-11 1969-05-22 Siemens Ag Verfahren zum Herstellen von Halbleiterschaltungen
US3411050A (en) * 1966-04-28 1968-11-12 Air Force Usa Flexible storable solar cell array
US3402331A (en) * 1966-08-02 1968-09-17 Philips Corp Solid-state active electronic device and microcircuits containing same
US3483038A (en) * 1967-01-05 1969-12-09 Rca Corp Integrated array of thin-film photovoltaic cells and method of making same
US3433677A (en) * 1967-04-05 1969-03-18 Cornell Aeronautical Labor Inc Flexible sheet thin-film photovoltaic generator

Also Published As

Publication number Publication date
FR1591647A (cg-RX-API-DMAC7.html) 1970-05-04
ES359345A1 (es) 1970-08-16
BR6803288D0 (pt) 1973-01-04
SE352480B (cg-RX-API-DMAC7.html) 1972-12-27
US3579056A (en) 1971-05-18
DE1803138A1 (de) 1969-06-04
CH496322A (de) 1970-09-15
GB1250815A (cg-RX-API-DMAC7.html) 1971-10-20
BE722669A (cg-RX-API-DMAC7.html) 1969-04-21

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