NL6701294A - - Google Patents

Info

Publication number
NL6701294A
NL6701294A NL6701294A NL6701294A NL6701294A NL 6701294 A NL6701294 A NL 6701294A NL 6701294 A NL6701294 A NL 6701294A NL 6701294 A NL6701294 A NL 6701294A NL 6701294 A NL6701294 A NL 6701294A
Authority
NL
Netherlands
Application number
NL6701294A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6701294A priority Critical patent/NL6701294A/xx
Priority to DE1968N0031981 priority patent/DE1285581C2/de
Priority to GB3678/68A priority patent/GB1211412A/en
Priority to AT71268A priority patent/AT286416B/de
Priority to CH115068A priority patent/CH483774A/de
Priority to BE709891D priority patent/BE709891A/xx
Priority to FR1553301D priority patent/FR1553301A/fr
Publication of NL6701294A publication Critical patent/NL6701294A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
NL6701294A 1967-01-27 1967-01-27 NL6701294A (en:Method)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL6701294A NL6701294A (en:Method) 1967-01-27 1967-01-27
DE1968N0031981 DE1285581C2 (de) 1967-01-27 1968-01-18 Traeger mit einer Mikroschaltung und Verfahren zu seiner Herstellung
GB3678/68A GB1211412A (en) 1967-01-27 1968-01-24 Improvements in and relating to semiconductor devices
AT71268A AT286416B (de) 1967-01-27 1968-01-24 Träger mit einer oder mehreren Mikroschaltungen und Verfahren zu dessen Herstellung
CH115068A CH483774A (de) 1967-01-27 1968-01-24 Träger mit mindestens einer Mikroschaltanordnung und Verfahren zu seiner Herstellung
BE709891D BE709891A (en:Method) 1967-01-27 1968-01-25
FR1553301D FR1553301A (en:Method) 1967-01-27 1968-01-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6701294A NL6701294A (en:Method) 1967-01-27 1967-01-27

Publications (1)

Publication Number Publication Date
NL6701294A true NL6701294A (en:Method) 1968-07-29

Family

ID=19799151

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6701294A NL6701294A (en:Method) 1967-01-27 1967-01-27

Country Status (7)

Country Link
AT (1) AT286416B (en:Method)
BE (1) BE709891A (en:Method)
CH (1) CH483774A (en:Method)
DE (1) DE1285581C2 (en:Method)
FR (1) FR1553301A (en:Method)
GB (1) GB1211412A (en:Method)
NL (1) NL6701294A (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0355424B1 (en) * 1988-07-25 1995-02-15 Asahi Glass Company Ltd. Glass antenna device for an automobile
US4933812A (en) * 1989-10-11 1990-06-12 Hewlett-Packard Company Package and circuit arrangement for housing and connecting polarized electrical components and method of manufacture

Also Published As

Publication number Publication date
DE1285581B (de) 1968-12-19
GB1211412A (en) 1970-11-04
AT286416B (de) 1970-12-10
DE1285581C2 (de) 1973-08-23
BE709891A (en:Method) 1968-07-25
CH483774A (de) 1969-12-31
FR1553301A (en:Method) 1969-01-10

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