NL6701294A - - Google Patents

Info

Publication number
NL6701294A
NL6701294A NL6701294A NL6701294A NL6701294A NL 6701294 A NL6701294 A NL 6701294A NL 6701294 A NL6701294 A NL 6701294A NL 6701294 A NL6701294 A NL 6701294A NL 6701294 A NL6701294 A NL 6701294A
Authority
NL
Netherlands
Application number
NL6701294A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6701294A priority Critical patent/NL6701294A/xx
Priority to DE1968N0031981 priority patent/DE1285581C2/de
Priority to GB3678/68A priority patent/GB1211412A/en
Priority to AT71268A priority patent/AT286416B/de
Priority to CH115068A priority patent/CH483774A/de
Priority to BE709891D priority patent/BE709891A/xx
Priority to FR1553301D priority patent/FR1553301A/fr
Publication of NL6701294A publication Critical patent/NL6701294A/xx

Links

Classifications

    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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NL6701294A 1967-01-27 1967-01-27 NL6701294A (xx)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL6701294A NL6701294A (xx) 1967-01-27 1967-01-27
DE1968N0031981 DE1285581C2 (de) 1967-01-27 1968-01-18 Traeger mit einer Mikroschaltung und Verfahren zu seiner Herstellung
GB3678/68A GB1211412A (en) 1967-01-27 1968-01-24 Improvements in and relating to semiconductor devices
AT71268A AT286416B (de) 1967-01-27 1968-01-24 Träger mit einer oder mehreren Mikroschaltungen und Verfahren zu dessen Herstellung
CH115068A CH483774A (de) 1967-01-27 1968-01-24 Träger mit mindestens einer Mikroschaltanordnung und Verfahren zu seiner Herstellung
BE709891D BE709891A (xx) 1967-01-27 1968-01-25
FR1553301D FR1553301A (xx) 1967-01-27 1968-01-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6701294A NL6701294A (xx) 1967-01-27 1967-01-27

Publications (1)

Publication Number Publication Date
NL6701294A true NL6701294A (xx) 1968-07-29

Family

ID=19799151

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6701294A NL6701294A (xx) 1967-01-27 1967-01-27

Country Status (7)

Country Link
AT (1) AT286416B (xx)
BE (1) BE709891A (xx)
CH (1) CH483774A (xx)
DE (1) DE1285581C2 (xx)
FR (1) FR1553301A (xx)
GB (1) GB1211412A (xx)
NL (1) NL6701294A (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68921115T2 (de) * 1988-07-25 1995-10-12 Asahi Glass Co Ltd Fensterscheibenantenne für ein Kraftfahrzeug.
US4933812A (en) * 1989-10-11 1990-06-12 Hewlett-Packard Company Package and circuit arrangement for housing and connecting polarized electrical components and method of manufacture

Also Published As

Publication number Publication date
DE1285581C2 (de) 1973-08-23
CH483774A (de) 1969-12-31
BE709891A (xx) 1968-07-25
GB1211412A (en) 1970-11-04
DE1285581B (de) 1968-12-19
FR1553301A (xx) 1969-01-10
AT286416B (de) 1970-12-10

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