NL6614974A - - Google Patents

Info

Publication number
NL6614974A
NL6614974A NL6614974A NL6614974A NL6614974A NL 6614974 A NL6614974 A NL 6614974A NL 6614974 A NL6614974 A NL 6614974A NL 6614974 A NL6614974 A NL 6614974A NL 6614974 A NL6614974 A NL 6614974A
Authority
NL
Netherlands
Application number
NL6614974A
Other versions
NL151659B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6614974A publication Critical patent/NL6614974A/xx
Publication of NL151659B publication Critical patent/NL151659B/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for devices being provided for in H01L29/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/035Opposed plunger
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49163Manufacturing circuit on or in base with sintering of base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4998Combined manufacture including applying or shaping of fluent material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12188All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528Semiconductor component

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
NL666614974A 1965-10-22 1966-10-21 Vorm voor het met kunststof omhullen van halfgeleiders. NL151659B (nl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50155065A 1965-10-22 1965-10-22
US504402A US3391426A (en) 1965-10-22 1965-10-24 Molding apparatus
US69239667A 1967-12-21 1967-12-21

Publications (2)

Publication Number Publication Date
NL6614974A true NL6614974A (de) 1967-04-25
NL151659B NL151659B (nl) 1976-12-15

Family

ID=27414177

Family Applications (2)

Application Number Title Priority Date Filing Date
NL666612902A NL154873B (nl) 1965-10-22 1966-09-13 Metalen orgaan voor het monteren van een halfgeleiderelement, alsmede halfgeleiderinrichting voorzien van het gemonteerde halfgeleiderelement.
NL666614974A NL151659B (nl) 1965-10-22 1966-10-21 Vorm voor het met kunststof omhullen van halfgeleiders.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL666612902A NL154873B (nl) 1965-10-22 1966-09-13 Metalen orgaan voor het monteren van een halfgeleiderelement, alsmede halfgeleiderinrichting voorzien van het gemonteerde halfgeleiderelement.

Country Status (4)

Country Link
US (2) US3391426A (de)
DE (1) DE1564354C3 (de)
GB (2) GB1162163A (de)
NL (2) NL154873B (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539675A (en) * 1965-10-22 1970-11-10 Motorola Inc Method for encapsulating semiconductor devices
US3571920A (en) * 1965-12-16 1971-03-23 Berg Electronics Inc Method for transistor manufacture
US3471900A (en) * 1967-05-24 1969-10-14 Trw Inc Mold for encapsulating electrical components
US3490141A (en) * 1967-10-02 1970-01-20 Motorola Inc High voltage rectifier stack and method for making same
US3530541A (en) * 1968-06-13 1970-09-29 Trw Inc Mold for encapsulating electrical components
GB1271833A (en) * 1968-07-10 1972-04-26 Hitachi Ltd Improvements in or relating to encapsulation processes
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3691654A (en) * 1969-05-29 1972-09-19 Gen Electric Metal foil lead manufacture
US3963822A (en) * 1969-09-12 1976-06-15 Noma Lites Canada Limited Method of molding electrical lamp sockets
US3694902A (en) * 1970-08-31 1972-10-03 Bell Telephone Labor Inc Electroluminescent display apparatus
US3718969A (en) * 1970-09-21 1973-03-06 Motorola Inc Plastic encapsulated semiconductor assemblies
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
NL7018378A (de) * 1970-12-17 1972-06-20
US3808673A (en) * 1971-03-17 1974-05-07 Monsanto Co Opto-isolator devices and method for the fabrication thereof
US3719969A (en) * 1971-04-21 1973-03-13 Goodrich Co B F Plastic encapsulated semiconductor assemblies
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US3729817A (en) * 1971-09-30 1973-05-01 Bourns Inc Method of making rotatable element potentiometer
US3795049A (en) * 1972-02-22 1974-03-05 Trw Inc Method of making a printed circuit edge connector
US3869789A (en) * 1974-05-31 1975-03-11 Spectrol Electronics Corp Method of manufacturing variable resistance device
US4170444A (en) * 1975-11-19 1979-10-09 Bactomatic, Inc. Mold for making impedance measuring module
US4084312A (en) * 1976-01-07 1978-04-18 Motorola, Inc. Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies
JPS5326670A (en) * 1976-08-25 1978-03-11 Hitachi Ltd Manufacture of semiconductor device
FR2368868A7 (fr) * 1976-10-21 1978-05-19 Ates Componenti Elettron Dispositif a semi conducteurs en forme de boitier
US4231628A (en) * 1978-12-14 1980-11-04 Amp Incorporated Electrical connector receptacles
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS57178352A (en) * 1981-04-28 1982-11-02 Matsushita Electronics Corp Manufacture of resin sealing type semiconductor device and lead frame employed thereon
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
CA1195782A (en) * 1981-07-06 1985-10-22 Mikio Nishikawa Lead frame for plastic encapsulated semiconductor device
JPH01150512A (ja) * 1987-12-09 1989-06-13 Honda Motor Co Ltd 可撓性回路体を備えた樹脂発泡体の成形方法
EP0923129A1 (de) * 1997-12-11 1999-06-16 Siemens Aktiengesellschaft Leitrrahmen für elektronische Halbleiteranordnungen
DE10110138A1 (de) * 2001-03-02 2002-09-05 Schwarzbich Joerg Verfahren zur Herstellung einer Lordosenstütze

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2158044A (en) * 1929-05-18 1939-05-09 Hygrade Sylvanla Corp Method of making contactor bases for electric lamps, tubes, and the like
US2120502A (en) * 1936-01-08 1938-06-14 Fnf Ltd Mold for parts of knitting machinery
US2252054A (en) * 1939-10-05 1941-08-12 American Fork & Hoe Co Fishing rod handle
US2306732A (en) * 1941-05-08 1942-12-29 Bell Telephone Labor Inc Molding fixture
US2369291A (en) * 1942-09-29 1945-02-13 Western Electric Co Molding
US2465656A (en) * 1945-01-03 1949-03-29 Louis H Morin Method of forming die castings on mountings or carrier members
US2500546A (en) * 1946-03-20 1950-03-14 Whitney Blake Co Apparatus for molding terminals on electric conductors
US2479350A (en) * 1947-10-03 1949-08-16 Jr John C Haggart Apparatus for molding reflector devices
DE1077790B (de) * 1955-03-10 1960-03-17 Texas Instruments Inc AEtzverfahren zur Herstellung von Halbleiteranordnungen
US3004298A (en) * 1957-02-11 1961-10-17 Federal Mogul Bower Bearings Method for making fluid seals
US3092893A (en) * 1958-02-13 1963-06-11 Texas Instruments Inc Fabrication of semiconductor devices
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
US3063097A (en) * 1959-12-04 1962-11-13 Chicago Rawhide Mfg Co Apparatus for forming seals
US3175028A (en) * 1960-10-27 1965-03-23 Waldes Kohinoor Inc Slide fastener manufacture
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3207832A (en) * 1962-10-18 1965-09-21 Western Electric Co Method of making plastic article having metallic insert
US3307221A (en) * 1963-11-12 1967-03-07 Thiokol Chemical Corp Mold for making insulated rocket motor nozzles
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
DE1439349B2 (de) 1964-03-26 1971-02-25 Siemens AG, 1000 Berlin u 8000 München Verfahren zur serienfertigung von halbleiterbauelementen
DE1292755B (de) * 1964-03-26 1969-04-17 Siemens Ag Verfahren zum serienmaessigen Sockeln und Gehaeuseeinbau von Halbleiterbauelementen
US3315316A (en) * 1965-03-05 1967-04-25 Victor Mfg & Gasket Co Apparatus for molding fluid seal elements

Also Published As

Publication number Publication date
DE1604640B2 (de) 1975-09-18
GB1166603A (en) 1969-10-08
US3431092A (en) 1969-03-04
US3391426A (en) 1968-07-09
DE1564354B2 (de) 1975-01-09
NL154873B (nl) 1977-10-17
GB1162163A (en) 1969-08-20
DE1564354A1 (de) 1969-09-11
DE1604640A1 (de) 1970-12-03
NL6612902A (de) 1967-04-24
DE1564354C3 (de) 1982-04-29
NL151659B (nl) 1976-12-15

Similar Documents

Publication Publication Date Title
FI45093B (de)
JPS4324675Y1 (de)
JPS457778Y1 (de)
JPS4411038Y1 (de)
JPS4423598Y1 (de)
CS160966B1 (de)
BE669587A (de)
BE674301A (de)
BE674950A (de)
BE674857A (de)
BE674842A (de)
BE663662A (de)
BE674758A (de)
BE670451A (de)
BE674746A (de)
BE674658A (de)
BE663169A (de)
NL6614974A (de)
BE674653A (de)
BE674609A (de)
BE674466A (de)
BE674362A (de)
BE670134A (de)
BE670000A (de)
BE665745A (de)

Legal Events

Date Code Title Description
NL80 Abbreviated name of patent owner mentioned of already nullified patent

Owner name: MOTOROLA

V4 Lapsed because of reaching the maximum lifetime of a patent