NL6607334A - - Google Patents
Info
- Publication number
- NL6607334A NL6607334A NL6607334A NL6607334A NL6607334A NL 6607334 A NL6607334 A NL 6607334A NL 6607334 A NL6607334 A NL 6607334A NL 6607334 A NL6607334 A NL 6607334A NL 6607334 A NL6607334 A NL 6607334A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEC0028250 | 1965-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6607334A true NL6607334A (enFirst) | 1966-12-02 |
Family
ID=59579360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6607334A NL6607334A (enFirst) | 1965-06-01 | 1966-05-26 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3491435A (enFirst) |
| DE (1) | DE1514015A1 (enFirst) |
| ES (1) | ES327388A1 (enFirst) |
| FR (1) | FR1498361A (enFirst) |
| GB (1) | GB1079399A (enFirst) |
| NL (1) | NL6607334A (enFirst) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3672046A (en) * | 1970-01-14 | 1972-06-27 | Technitrol Inc | The method of making an electrical component |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL222168A (enFirst) * | 1957-11-05 | |||
| US3121279A (en) * | 1957-12-31 | 1964-02-18 | Philips Corp | Method of fastening connecting wires to electrical component parts |
| US3176191A (en) * | 1960-05-10 | 1965-03-30 | Columbia Broadcasting Syst Inc | Combined circuit and mount and method of manufacture |
| DE1199408B (de) * | 1961-06-28 | 1965-08-26 | Siemens Ag | Verfahren zum Herstellen von Halbleiterbau-elementen und nach diesem Verfahren hergestelltes Halbleiterbauelement |
| US3171187A (en) * | 1962-05-04 | 1965-03-02 | Nippon Electric Co | Method of manufacturing semiconductor devices |
| US3264712A (en) * | 1962-06-04 | 1966-08-09 | Nippon Electric Co | Semiconductor devices |
| US3271625A (en) * | 1962-08-01 | 1966-09-06 | Signetics Corp | Electronic package assembly |
| US3341649A (en) * | 1964-01-17 | 1967-09-12 | Signetics Corp | Modular package for semiconductor devices |
| DE1514822A1 (de) * | 1964-08-14 | 1969-06-26 | Telefunken Patent | Verfahren zur Herstellung einer Halbleiteranordnung |
-
1965
- 1965-06-01 DE DE19651514015 patent/DE1514015A1/de active Pending
-
1966
- 1966-05-25 US US552876A patent/US3491435A/en not_active Expired - Lifetime
- 1966-05-26 NL NL6607334A patent/NL6607334A/xx unknown
- 1966-05-31 ES ES0327388A patent/ES327388A1/es not_active Expired
- 1966-06-01 FR FR63672A patent/FR1498361A/fr not_active Expired
- 1966-06-01 GB GB24439/66A patent/GB1079399A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1079399A (en) | 1967-08-16 |
| US3491435A (en) | 1970-01-27 |
| FR1498361A (fr) | 1967-10-20 |
| DE1514015A1 (de) | 1970-08-20 |
| ES327388A1 (es) | 1967-03-16 |