NL281894A - - Google Patents

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Publication number
NL281894A
NL281894A NL281894DA NL281894A NL 281894 A NL281894 A NL 281894A NL 281894D A NL281894D A NL 281894DA NL 281894 A NL281894 A NL 281894A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL281894A publication Critical patent/NL281894A/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K17/00—Arrangement or mounting of transmissions in vehicles
    • B60K17/04—Arrangement or mounting of transmissions in vehicles characterised by arrangement, location, or kind of gearing
    • B60K17/10—Arrangement or mounting of transmissions in vehicles characterised by arrangement, location, or kind of gearing of fluid gearing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K5/00—Arrangement or mounting of internal-combustion or jet-propulsion units
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    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
NL281894D 1962-08-08 NL281894A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL281894 1962-08-08

Publications (1)

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NL281894A true NL281894A (de)

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ID=19754033

Family Applications (1)

Application Number Title Priority Date Filing Date
NL281894D NL281894A (de) 1962-08-08

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Country Link
US (1) US3364064A (de)
DE (1) DE1521401C3 (de)
GB (1) GB1031436A (de)
NL (1) NL281894A (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489266A (en) * 1963-09-23 1970-01-13 Sylvania Electric Prod Hermetic seal for a thin-walled container
US3516075A (en) * 1965-10-04 1970-06-02 Ncr Co Bistable magnetic thin film rod having a conductive overcoating
US3451030A (en) * 1966-07-01 1969-06-17 Gen Electric Solder-bonded semiconductor strain gauges
US3634048A (en) * 1968-02-14 1972-01-11 Mallory & Co Inc P R Solderable stainless steel
US3675310A (en) * 1971-04-20 1972-07-11 Us Interior Soldering method
US3963455A (en) * 1973-01-12 1976-06-15 Lea-Ronal, Inc. Electrodeposited gold plating
US3878065A (en) * 1974-01-30 1975-04-15 Buckbee Mears Co Process for forming solderable coating on alloys
US4361470A (en) * 1974-09-03 1982-11-30 Micro-Plate, Inc. Connector contact point
DE2742922C2 (de) * 1977-09-23 1984-03-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zum mittelbaren Verbinden zweier Teile
DE2742921C2 (de) * 1977-09-23 1985-07-11 Siemens AG, 1000 Berlin und 8000 München Verfahren zum mittelbaren Verbinden zweier Teile durch Verschweißung zweier Metallauflagen
US4300959A (en) * 1979-08-22 1981-11-17 United Technologies Corporation Impermeable electroform for hot isostatic pressing
US4411965A (en) * 1980-10-31 1983-10-25 Occidental Chemical Corporation Process for high speed nickel and gold electroplate system and article having improved corrosion resistance
US4418857A (en) * 1980-12-31 1983-12-06 International Business Machines Corp. High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
US4397086A (en) * 1981-01-26 1983-08-09 The Bendix Corporation Method of fabricating a socket type electrical contact
US4331258A (en) * 1981-03-05 1982-05-25 Raychem Corporation Sealing cover for an hermetically sealed container
US4505060A (en) * 1983-06-13 1985-03-19 Inco Limited Process for obtaining a composite material and composite material obtained by said process
US4551184A (en) * 1983-06-13 1985-11-05 Inco Limited Process for obtaining a composite material and composite material obtained by said process
US4666796A (en) * 1984-09-26 1987-05-19 Allied Corporation Plated parts and their production
US4601958A (en) * 1984-09-26 1986-07-22 Allied Corporation Plated parts and their production
US4737418A (en) * 1986-12-22 1988-04-12 Advanced Materials Technology Corp. Nickel clad corrosion resistant lid for semiconductor package
US4895291A (en) * 1989-05-04 1990-01-23 Eastman Kodak Company Method of making a hermetic seal in a solid-state device
US5466540A (en) * 1994-02-14 1995-11-14 Ceridian Corporation Mark of an electronic component lid
CA2370770A1 (en) 1999-04-16 2000-10-26 Edison Welding Institute Soldering alloy
US20070039826A1 (en) * 2005-08-18 2007-02-22 Chia-Hua Chang Thickening method of an electroforming shim
CN113529146B (zh) * 2021-05-27 2022-06-07 中国航发南方工业有限公司 航空发动机扩压器刷镀镍工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2429222A (en) * 1943-06-05 1947-10-21 Bell Telephone Labor Inc Method of making contact wires
GB872785A (en) * 1957-04-17 1961-07-12 Engelhard Ind Inc Immersion plating with noble metals
US2969295A (en) * 1958-05-05 1961-01-24 Pacific Semiconductors Inc Chemical gold plating

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DE1521401C3 (de) 1975-05-15
US3364064A (en) 1968-01-16
DE1521401A1 (de) 1969-12-11
GB1031436A (en) 1966-06-02
DE1521401B2 (de) 1972-03-02

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