NL274434A - - Google Patents
Info
- Publication number
- NL274434A NL274434A NL274434DA NL274434A NL 274434 A NL274434 A NL 274434A NL 274434D A NL274434D A NL 274434DA NL 274434 A NL274434 A NL 274434A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US87136A US3176201A (en) | 1961-02-06 | 1961-02-06 | Heavy-base semiconductor rectifier |
US94800A US3199004A (en) | 1961-02-06 | 1961-03-10 | Connections in semiconductor devices |
US261535A US3176382A (en) | 1961-02-06 | 1963-02-27 | Method for making semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
NL274434A true NL274434A (fr) | 1900-01-01 |
Family
ID=27375626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL274434D NL274434A (fr) | 1961-02-06 |
Country Status (4)
Country | Link |
---|---|
US (3) | US3176201A (fr) |
DE (1) | DE1250005B (fr) |
GB (1) | GB941640A (fr) |
NL (1) | NL274434A (fr) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3307088A (en) * | 1962-03-13 | 1967-02-28 | Fujikawa Kyoichi | Silver-lead alloy contacts containing dopants for semiconductors |
US3230464A (en) * | 1962-09-26 | 1966-01-18 | Airtron Inc | High frequency parametric amplifier with integral construction |
US3295089A (en) * | 1963-10-11 | 1966-12-27 | American Mach & Foundry | Semiconductor device |
US3281922A (en) * | 1963-10-24 | 1966-11-01 | Trw Semiconductors Inc | Method for assembly of semiconductor devices |
US3325701A (en) * | 1964-04-02 | 1967-06-13 | Solitron Devices | Semiconductor device |
US3375415A (en) * | 1964-07-17 | 1968-03-26 | Motorola Inc | High current rectifier |
DE1279200B (de) * | 1964-10-31 | 1968-10-03 | Siemens Ag | Halbleiterbauelement |
DE1489097B1 (de) * | 1964-12-16 | 1970-10-22 | Licentia Gmbh | Halbleiter-Gleichrichterzelle |
US3417300A (en) * | 1965-12-15 | 1968-12-17 | Texas Instruments Inc | Economy high power package |
US3444614A (en) * | 1966-01-12 | 1969-05-20 | Bendix Corp | Method of manufacturing semiconductor devices |
US3576474A (en) * | 1968-02-23 | 1971-04-27 | Gen Motors Corp | Passivated power rectifier |
US3893226A (en) * | 1970-03-06 | 1975-07-08 | Gkn Floform Ltd | Method of making semi-conductor mounts |
US3925809A (en) * | 1973-07-13 | 1975-12-09 | Ford Motor Co | Semi-conductor rectifier heat sink |
GB1489603A (en) * | 1974-01-18 | 1977-10-26 | Lucas Electrical Ltd | Semi-conductor assemblies |
GB1525431A (en) * | 1976-01-08 | 1978-09-20 | Gkn Floform Ltd | Method of making semi-conductor mounts |
US4349692A (en) * | 1981-02-23 | 1982-09-14 | Motorola, Inc. | Glass hermetic seal |
US4506108A (en) * | 1983-04-01 | 1985-03-19 | Sperry Corporation | Copper body power hybrid package and method of manufacture |
DE3717489A1 (de) * | 1987-05-23 | 1988-12-01 | Asea Brown Boveri | Leistungshalbleitermodul und verfahren zur herstellung des moduls |
US5148264A (en) * | 1990-05-02 | 1992-09-15 | Harris Semiconductor Patents, Inc. | High current hermetic package |
JPH0547812A (ja) * | 1991-08-19 | 1993-02-26 | Mitsubishi Electric Corp | 半導体装置 |
US5248901A (en) * | 1992-01-21 | 1993-09-28 | Harris Corporation | Semiconductor devices and methods of assembly thereof |
US6157076A (en) * | 1997-06-30 | 2000-12-05 | Intersil Corporation | Hermetic thin pack semiconductor device |
US20040263007A1 (en) * | 2003-05-19 | 2004-12-30 | Wetherill Associates, Inc. | Thermal transfer container for semiconductor component |
TW200941734A (en) * | 2008-03-20 | 2009-10-01 | Sung Jung Minute Industry Co Ltd | A packaging structure of a rectifier diode |
CN103837145B (zh) * | 2012-11-26 | 2018-12-28 | 精工爱普生株式会社 | 电子器件及其制造方法、盖体、电子设备以及移动体 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2837703A (en) * | 1958-06-03 | Lidow | ||
US2178969A (en) * | 1937-05-24 | 1939-11-07 | Ruben Samuel | Potential producing cell |
US2693022A (en) * | 1950-10-06 | 1954-11-02 | Gen Electric | Method of manufacturing whisker electrodes |
US2900701A (en) * | 1953-04-07 | 1959-08-25 | Sylvania Electric Prod | Semiconductor devices and methods |
BE541624A (fr) * | 1954-08-23 | 1900-01-01 | ||
US2762001A (en) * | 1955-03-23 | 1956-09-04 | Globe Union Inc | Fused junction transistor assemblies |
US2906932A (en) * | 1955-06-13 | 1959-09-29 | Sprague Electric Co | Silicon junction diode |
US2830238A (en) * | 1955-09-30 | 1958-04-08 | Hughes Aircraft Co | Heat dissipating semiconductor device |
US2806187A (en) * | 1955-11-08 | 1957-09-10 | Westinghouse Electric Corp | Semiconductor rectifier device |
US3060553A (en) * | 1955-12-07 | 1962-10-30 | Motorola Inc | Method for making semiconductor device |
BE564064A (fr) * | 1957-03-01 | 1900-01-01 | ||
DE1057694B (de) * | 1957-08-01 | 1959-05-21 | Siemens Ag | Gekapseltes Halbleitergeraet mit einem oder mehreren p-n-UEbergaengen |
US3089067A (en) * | 1957-09-30 | 1963-05-07 | Gen Motors Corp | Semiconductor device |
US3037155A (en) * | 1957-10-12 | 1962-05-29 | Bosch Gmbh Robert | Semi-conductor device |
CH357471A (de) * | 1958-01-30 | 1961-10-15 | Oerlikon Maschf | Gleichrichtereinheit mit luftgekühlten Halbleiter-Gleichrichterelementen |
DE1054585B (de) * | 1958-03-18 | 1959-04-09 | Eberle & Co Appbau Ges | Halbleiterbauelement, z. B. Diode oder Transistor |
NL101704C (fr) * | 1958-07-02 | |||
GB859025A (en) * | 1958-08-13 | 1961-01-18 | Gen Electric Co Ltd | Improvements in or relating to electrical devices having hermetically sealed envelopes |
US2993153A (en) * | 1958-09-25 | 1961-07-18 | Westinghouse Electric Corp | Seal |
US2946935A (en) * | 1958-10-27 | 1960-07-26 | Sarkes Tarzian | Diode |
US3030558A (en) * | 1959-02-24 | 1962-04-17 | Fansteel Metallurgical Corp | Semiconductor diode assembly and housing therefor |
US3025435A (en) * | 1959-05-15 | 1962-03-13 | Tung Sol Electric Inc | Casing for semiconductor diode |
US3015760A (en) * | 1959-06-10 | 1962-01-02 | Philips Corp | Semi-conductor devices |
US3005867A (en) * | 1959-10-30 | 1961-10-24 | Westinghouse Electric Corp | Hermetically sealed semiconductor devices |
DE1105526B (de) * | 1959-12-29 | 1961-04-27 | Siemens Ag | Verfahren zur Herstellung einer Halbleiteranordnung |
US3010057A (en) * | 1960-09-06 | 1961-11-21 | Westinghouse Electric Corp | Semiconductor device |
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0
- DE DENDAT1250005D patent/DE1250005B/de active Pending
- NL NL274434D patent/NL274434A/xx unknown
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1961
- 1961-02-06 US US87136A patent/US3176201A/en not_active Expired - Lifetime
- 1961-03-10 US US94800A patent/US3199004A/en not_active Expired - Lifetime
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1962
- 1962-02-02 GB GB4135/62A patent/GB941640A/en not_active Expired
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1963
- 1963-02-27 US US261535A patent/US3176382A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB941640A (en) | 1963-11-13 |
US3176382A (en) | 1965-04-06 |
US3176201A (en) | 1965-03-30 |
US3199004A (en) | 1965-08-03 |
DE1250005B (fr) | 1967-09-14 |