NL269613A - - Google Patents

Info

Publication number
NL269613A
NL269613A NL269613DA NL269613A NL 269613 A NL269613 A NL 269613A NL 269613D A NL269613D A NL 269613DA NL 269613 A NL269613 A NL 269613A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL269613A publication Critical patent/NL269613A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/224Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/022Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12Protection against corrosion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01027Cobalt [Co]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Resistors (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
NL269613D 1960-09-27 NL269613A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58803A US3086149A (en) 1960-09-27 1960-09-27 Encapsulated assemblies

Publications (1)

Publication Number Publication Date
NL269613A true NL269613A (de)

Family

ID=22019025

Family Applications (1)

Application Number Title Priority Date Filing Date
NL269613D NL269613A (de) 1960-09-27

Country Status (5)

Country Link
US (1) US3086149A (de)
BE (1) BE608332A (de)
GB (1) GB961057A (de)
NL (1) NL269613A (de)
SE (1) SE303158B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3222450A (en) * 1963-06-20 1965-12-07 Vitramon Inc Encapsulating for electrical component and terminal means for use therewith
US3348568A (en) * 1966-04-22 1967-10-24 Mallory & Co Inc P R Coated ceramic capacitor
US3522493A (en) * 1968-07-10 1970-08-04 Aerovox Corp Tubular mica capacitor
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
US4198671A (en) * 1978-06-05 1980-04-15 Donigan Carolyn L Capacitor assembly
US4255779A (en) * 1978-12-28 1981-03-10 Western Electric Company, Inc. Package machine insertable rolled metallized film capacitor
JPS6311704Y2 (de) * 1979-06-11 1988-04-05
FR2519472A1 (fr) * 1981-12-31 1983-07-08 Europ Composants Electron Procede de fabrication d'un composant electronique revetu d'un boitier, composant ainsi obtenu et appareil de mise en oeuvre du procede
FR2519509A1 (fr) * 1981-12-31 1983-07-08 Europ Composants Electron Procede et dispositif pour la mise en boitier de composants electroniques
US4563659A (en) * 1982-07-28 1986-01-07 Murata Manufacturing Co., Ltd. Noise filter
US4914547A (en) * 1988-05-06 1990-04-03 American Shizuki Corporation Process for making capacitors
JP4449999B2 (ja) * 2007-03-12 2010-04-14 Tdk株式会社 電子部品及びその実装構造並びにインバータ装置
US9916932B1 (en) * 2011-08-24 2018-03-13 The Boeing Company Spacer for cast capacitors
KR20170111678A (ko) * 2016-03-29 2017-10-12 삼성전자주식회사 전자부품
TW202110302A (zh) * 2019-08-26 2021-03-01 和碩聯合科技股份有限公司 雙埠電子組件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2899611A (en) * 1959-08-11 Capacitor
US2017842A (en) * 1934-11-16 1935-10-22 Harold B Conant Unidirectional current-carrying device and process of producing the same
US2698372A (en) * 1951-04-23 1954-12-28 Louis J Patla Electrical resistor and method of making same
US2935669A (en) * 1954-10-14 1960-05-03 Cornell Dubilier Electric Encapsulated mica capacitor
US2894316A (en) * 1955-01-21 1959-07-14 Chicago Condenser Corp Method of spacing capacitor leads
US2830698A (en) * 1955-04-25 1958-04-15 Erie Resistor Corp Condenser
DE1057693B (de) * 1956-10-05 1959-05-21 Josef Neuberger Flachkondensator

Also Published As

Publication number Publication date
SE303158B (de) 1968-08-19
US3086149A (en) 1963-04-16
BE608332A (fr) 1962-03-19
GB961057A (en) 1964-06-17

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