NL261280A - - Google Patents

Info

Publication number
NL261280A
NL261280A NL261280DA NL261280A NL 261280 A NL261280 A NL 261280A NL 261280D A NL261280D A NL 261280DA NL 261280 A NL261280 A NL 261280A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL261280A publication Critical patent/NL261280A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H10W72/07333—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
NL261280D 1960-02-25 NL261280A (Direct)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10952A US3051826A (en) 1960-02-25 1960-02-25 Method of and means for ultrasonic energy bonding

Publications (1)

Publication Number Publication Date
NL261280A true NL261280A (Direct) 1900-01-01

Family

ID=21748196

Family Applications (1)

Application Number Title Priority Date Filing Date
NL261280D NL261280A (Direct) 1960-02-25

Country Status (7)

Country Link
US (1) US3051826A (Direct)
BE (1) BE600188A (Direct)
CH (1) CH398799A (Direct)
DE (1) DE1294559B (Direct)
FR (1) FR1280491A (Direct)
GB (1) GB921845A (Direct)
NL (1) NL261280A (Direct)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH364733A (fr) * 1960-11-09 1962-09-30 Vogt Andre Procédé de soudage de signes sur un cadran d'horlogerie
US3477119A (en) * 1964-11-23 1969-11-11 Bunker Ramo Method and apparatus for forming an electric bond between two metallic members
US3507033A (en) * 1965-01-06 1970-04-21 Western Electric Co Ultrasonic bonding method
US3488466A (en) * 1965-10-07 1970-01-06 Illinois Tool Works Method and apparatus for welding rivet type metallic fasteners
US3444619A (en) * 1966-05-16 1969-05-20 Robert B Lomerson Method of assembling leads in an apertured support
US3543383A (en) * 1967-02-20 1970-12-01 Gen Electrodynamics Corp Indium seal
US3617682A (en) * 1969-06-23 1971-11-02 Gen Electric Semiconductor chip bonder
US3609283A (en) * 1969-10-29 1971-09-28 Argus Eng Co Method and apparatus for soldering insulated wire
US3674975A (en) * 1969-11-06 1972-07-04 Time Research Lab Inc Apparatus for assembling stacks
US3666907A (en) * 1969-11-06 1972-05-30 Time Research Lab Inc Apparatus for assembling flat packs
US3790738A (en) * 1972-05-30 1974-02-05 Unitek Corp Pulsed heat eutectic bonder
US11387373B2 (en) * 2019-07-29 2022-07-12 Nxp Usa, Inc. Low drain-source on resistance semiconductor component and method of fabrication

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2426650A (en) * 1943-12-27 1947-09-02 Bell Telephone Labor Inc Method of soldering a terminal to a piezoelectric crystal
BE517459A (Direct) * 1952-02-07
US2877283A (en) * 1955-09-02 1959-03-10 Siemens Ag Thermoelectric couples, particularly for the production of cold, and method of their manufacture
BE546668A (Direct) * 1956-03-31
US2946119A (en) * 1956-04-23 1960-07-26 Aeroprojects Inc Method and apparatus employing vibratory energy for bonding metals
NL216614A (Direct) * 1956-05-15
DE1064638B (de) * 1956-08-28 1959-09-03 Intermetall Verfahren zur Herstellung von Flaechentransistoren aus drei einkristallinen Schichten
US2847556A (en) * 1956-09-07 1958-08-12 Welding Industry Res & Patent Method and apparatus for breaking up oxide on, and welding, metal
GB845111A (en) * 1956-11-02 1960-08-17 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US3064341A (en) * 1956-12-26 1962-11-20 Ibm Semiconductor devices
DE1073125B (de) * 1958-07-24 1966-01-13 Siemens-Schuckertwerke Aktiengesellschaft Berlin Und Erlangen Verfahren zum Verlöten von thermoelektnschen Kombinationen

Also Published As

Publication number Publication date
GB921845A (en) 1963-03-27
FR1280491A (fr) 1961-12-29
BE600188A (fr) 1961-05-29
CH398799A (de) 1966-03-15
DE1294559B (de) 1969-05-08
US3051826A (en) 1962-08-28

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