NL225331A - - Google Patents

Info

Publication number
NL225331A
NL225331A NL225331DA NL225331A NL 225331 A NL225331 A NL 225331A NL 225331D A NL225331D A NL 225331DA NL 225331 A NL225331 A NL 225331A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL225331A publication Critical patent/NL225331A/xx

Links

Classifications

    • H10W76/138—
    • H10W72/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
NL225331D 1957-03-01 NL225331A (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US643209A US2897419A (en) 1957-03-01 1957-03-01 Semiconductor diode

Publications (1)

Publication Number Publication Date
NL225331A true NL225331A (index.php) 1900-01-01

Family

ID=24579822

Family Applications (2)

Application Number Title Priority Date Filing Date
NL111799D NL111799C (index.php) 1957-03-01
NL225331D NL225331A (index.php) 1957-03-01

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL111799D NL111799C (index.php) 1957-03-01

Country Status (7)

Country Link
US (1) US2897419A (index.php)
BE (1) BE564064A (index.php)
CH (1) CH356539A (index.php)
DE (1) DE1767112U (index.php)
FR (1) FR1191310A (index.php)
GB (1) GB881833A (index.php)
NL (2) NL225331A (index.php)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3030558A (en) * 1959-02-24 1962-04-17 Fansteel Metallurgical Corp Semiconductor diode assembly and housing therefor
US3018425A (en) * 1959-09-25 1962-01-23 Westinghouse Electric Corp Current rectifier assembly
US3030557A (en) * 1960-11-01 1962-04-17 Gen Telephone & Elect High frequency tunnel diode
NL274434A (index.php) * 1961-02-06 1900-01-01
DE1172378B (de) * 1961-07-14 1964-06-18 Siemens Ag Verfahren zur Herstellung einer elektrisch unsymmetrisch leitenden Halbleiteranordnung
US3484660A (en) * 1963-09-20 1969-12-16 Gen Electric Sealed electrical device
US3286340A (en) * 1964-02-28 1966-11-22 Philco Corp Fabrication of semiconductor units
US3333324A (en) * 1964-09-28 1967-08-01 Rca Corp Method of manufacturing semiconductor devices
US3514849A (en) * 1964-12-31 1970-06-02 Texas Instruments Inc Method for making a glass-to-metal seal
GB1132847A (en) * 1965-04-27 1968-11-06 Lucas Industries Ltd Full wave rectifier assemblies
US3460002A (en) * 1965-09-29 1969-08-05 Microwave Ass Semiconductor diode construction and mounting
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
US3686540A (en) * 1970-08-03 1972-08-22 Gen Motors Corp Cold welded-ceramic semiconductor package
US3772764A (en) * 1970-08-03 1973-11-20 Gen Motors Corp Method of making enclosure for a semiconductor device
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
US3751800A (en) * 1970-08-04 1973-08-14 Gen Motors Corp Method of fabricating a semiconductor enclosure
NL7203094A (index.php) * 1971-03-11 1972-09-13
US3823468A (en) * 1972-05-26 1974-07-16 N Hascoe Method of fabricating an hermetically sealed container
US4021839A (en) * 1975-10-16 1977-05-03 Rca Corporation Diode package
US4190176A (en) * 1979-01-23 1980-02-26 Semi-Alloys, Inc. Sealing cover unit for a container for a semiconductor device
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4611238A (en) * 1982-05-05 1986-09-09 Burroughs Corporation Integrated circuit package incorporating low-stress omnidirectional heat sink
CA1209719A (en) * 1982-05-05 1986-08-12 Terrence E. Lewis Low-stress-inducing omnidirectional heat sink
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US6622786B1 (en) 2002-04-17 2003-09-23 International Business Machines Corporation Heat sink structure with pyramidic and base-plate cut-outs

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL94441C (index.php) * 1951-09-15
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting
NL203133A (index.php) * 1954-12-27

Also Published As

Publication number Publication date
NL111799C (index.php) 1900-01-01
CH356539A (de) 1961-08-31
US2897419A (en) 1959-07-28
GB881833A (en) 1961-11-08
FR1191310A (fr) 1959-10-19
DE1767112U (de) 1958-05-22
BE564064A (index.php) 1900-01-01

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