Classifications

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  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
  • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
  • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
  • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
  • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
  • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
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  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
  • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
  • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
  • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
  • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
  • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
• • H—ELECTRICITY
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  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
  • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
  • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
  • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
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  • H01L2924/01—Chemical elements
  • H01L2924/01005—Boron [B]
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  • H01L2924/01—Chemical elements
  • H01L2924/01006—Carbon [C]
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  • H01L2924/01—Chemical elements
  • H01L2924/01011—Sodium [Na]
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  • H01L2924/01—Chemical elements
  • H01L2924/01013—Aluminum [Al]
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  • H01L2924/01014—Silicon [Si]
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  • H01L2924/01015—Phosphorus [P]
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  • H01L2924/01018—Argon [Ar]
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  • H01L2924/01019—Potassium [K]
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  • H01L2924/01023—Vanadium [V]
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  • H01L2924/01027—Cobalt [Co]
• • H—ELECTRICITY
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  • H01L2924/01—Chemical elements
  • H01L2924/01029—Copper [Cu]
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  • H01L2924/01032—Germanium [Ge]
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  • H01L2924/01—Chemical elements
  • H01L2924/01033—Arsenic [As]
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  • H01L2924/01042—Molybdenum [Mo]
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  • H01L2924/01047—Silver [Ag]
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  • H01L2924/01049—Indium [In]
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  • H01L2924/01068—Erbium [Er]
• • H—ELECTRICITY
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  • H01L2924/01074—Tungsten [W]
• • H—ELECTRICITY
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  • H01L2924/01—Chemical elements
  • H01L2924/01075—Rhenium [Re]
• • H—ELECTRICITY
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  • H01L2924/30—Technical effects
  • H01L2924/301—Electrical effects
  • H01L2924/3025—Electromagnetic shielding

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• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Connection Of Batteries Or Terminals (AREA)
• Ceramic Products (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=23897505

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Country Status (7)

Families Citing this family (21)

• 0
  • NL NL100659D patent/NL100659C/xx active
  • BE BE543951D patent/BE543951A/xx unknown
  • NL NL203133D patent/NL203133A/xx unknown
• 1954
  • 1954-12-27 US US477822A patent/US2756374A/en not_active Expired - Lifetime
• 1955
  • 1955-12-22 GB GB36801/55A patent/GB784899A/en not_active Expired
  • 1955-12-24 DE DEG18667A patent/DE1010186B/de active Pending
  • 1955-12-27 FR FR1143327D patent/FR1143327A/fr not_active Expired
  • 1955-12-27 CH CH347900D patent/CH347900A/de unknown

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