NL2012988B1 - Thermal conductive high modules organic polymeric fibers. - Google Patents

Thermal conductive high modules organic polymeric fibers. Download PDF

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Publication number
NL2012988B1
NL2012988B1 NL2012988A NL2012988A NL2012988B1 NL 2012988 B1 NL2012988 B1 NL 2012988B1 NL 2012988 A NL2012988 A NL 2012988A NL 2012988 A NL2012988 A NL 2012988A NL 2012988 B1 NL2012988 B1 NL 2012988B1
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fibers
thermally conductive
high modulus
organic polymer
modulus organic
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NL2012988A
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Dutch (nl)
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Hermans Ko
Clemens Kranz Bart
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Olympic Holding B V
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Priority to PCT/NL2015/050435 priority patent/WO2015190930A1/en
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Publication of NL2012988B1 publication Critical patent/NL2012988B1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention relates to thermal conductive high modules organic polymeric fibers and to a polymeric carrier comprising these thermal conductive high modules organic polymeric fibers. In addition, the present invention relates to a method for manufacturing such thermal conductive high modules organic polymeric fibers and to a method for manufacturing a polymeric carrier comprising thermal conductive high modules organic polymeric fibers. The present invention also relates to a specific use of the carrier comprising thermal conductive high modules organic polymeric fibers.

Description

Thermal conductive high modules organic polymeric fibers
The present invention relates to thermal conductive high modules organic polymeric fibers and to a polymeric carrier comprising these thermal conductive high modules organic polymeric fibers. In addition, the present invention relates to a method for manufacturing such thermal conductive high modules organic polymeric fibers and to a method for manufacturing a polymeric carrier comprising thermal conductive high modules organic polymeric fibers. The present invention also relates to a specific use of the carrier comprising thermal conductive high modules organic polymeric fibers.
Thermal conductive fibers as such are known in the art. For example a publication by Dean N. and Pinter M. “Novel thermal interface material with aligned conductive fibers” proposed to use carbon graphite fibers. Carbon graphite fibers are made via carbonization of fibers that are spun from a mixture of a resin (like methyl acrylate or methyl methacrylate) and a polymer (like polyacrylonitrile). During the carbonization the spun fibers are completely stripped of their non-carbon atoms and what is left are oriented crystals of tightly bonded carbon atoms; a fiber of carbon or carbon fiber. These high aspect ratio fibers have the advantage that they can bridge the gap between two surfaces resulting in very high thermal conductivity. Extremely high thermal conductivities of 50-90 W/nvK have been shown by using this method. However, carbon graphite fibers are also electrically conductive and are therefore not suitable for the majority of thermal conductive applications. The electrical conductive properties of carbon graphite fibers come from their crystalline carbon structure which almost exclusively exists of, a hexagonal array of carbon atoms.
Thermal management is important for a variety of electrical components such as for example Light Emitting Diodes (LEDs), Integrated Circuit (1C) boards and solar cells. For all these components temperature has a negative impact on the performance and/or life time. For example it is known from literature that the output of solar cells is reduced by 0.4-0.5% per degree Celsius temperature increase. Another example is the life time of an LED which is reduced more than 5 times by only a moderate increase in temperature of 30 degree Celsius.
To reduce the temperature of these electrical components, the generated heat has to be removed via a heat sink. A heat sink is a passive heat exchanger that cools a device by dissipating heat into the surrounding medium. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the basic device is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal conductive adhesive or grease improves the heat sink's performance by filling air gaps between the heat sink and the device.
Thermal conductive adhesives, lacquers, grease and paints are primarily based on materials which are not intrinsically thermal conductive. The thermal conductive properties actually come from inorganic filler materials being either metal or ceramic materials. Examples of metallic thermal conductive filler materials are flakes or powders from silver, copper, aluminum. Examples of ceramic fillers are powders based on boron nitride (BN), carbon nanotubes (CNT), Zinc Oxide (ZnO), graphite, silicon carbide (SiC), aluminum oxide (AI203) and silicon oxide (SiO). Most, but not all, of these filler materials fillers are characterized in that they are thermally conductive, but electrically isolating. The latter is extremely important since connecting electrical components to a (metal) heat sink can easily result in short circuiting and malfunctioning of the total product.
Current thermal conductive fillers are usually based on powders that consist of small particles. The thermal conductivity of these fillers can be extremely high. E.g. cubic BN has a thermal conductivity of 700 W/nvK. A normal glue a thermal conductivity of around 0.1-0.3 W/nvK. When mixing in large volumes (e.g. 60-70%) of BN this can increase the thermal conductivity of the glue to 1-5 W/nvK. Although high volumes of extremely thermal conductive particles are mixed into glue, the overall thermal conductivity of the glue is still low. First of all, it is important to realize that the thermal conductivity of the filler only affects the overall conductivity of the glue (or other matrix material for that matter) to a very limited extent. Basically it does not really matter a lot if the thermal conductivity of the filler is 40 or 4000 W/nvK. A disadvantage of the currently used thermal conductive particles however is that they are only suitable for transferring heat over small distances (i.e. microns). As soon as the distances become too large the conduction of heat within the interfacial material (i.e. from particle to particle) dominates the interfacial thermal resistance and poor performance. The point contact (or no contact at all) between the thermal conductive particles limits heat transport.
The present invention aims to overcome one or more of the problems mentioned above.
The present invention relates thus to thermal conductive high modules organic polymeric fibres wherein the weight average length of the fibres is in the range of from 15 pm and 10 cm.
According to a preferred embodiment of the present invention the weight average length of the fibres is in the range of from 250 pm and 1 cm, preferably in the range of from 0.5-5 mm. The present inventors found that a weight average length below 15 pm is very difficult to handle. In addition, the present inventors assume that a weight average length below 15 pm will not have additional effects on the heat sink performance when used in a polymeric carrier. A weight average length above 10 cm will cause an inefficient distribution of the fibres in a polymeric carrier resulting in inefficient heat sink performance.
The term “weight average length” as used herein means that the length of the fibres is calculated on basis on the composition of the fibres. One can assume that small size fibres form a mixture in cooperation with medium size fibres and long size fibres. In order to prevent that small size fibres dominate the calculation of the length of the fibres containing mixture the weight average length is used here. An example will explain what is exactly meant with term “weight average length”. In a mixture of fibres there are 100 fibres having a length of 1 pm and 10 fibres having a length of 1000 pm. The mass unit of the 100 fibres having a length of 1 pm is set on 100*1=100, and the mass unit of the 10 fibres having a length of 1000 pm is set on 1000*10=10.000. The “weight average length” of this mixture of fibres is (100/(100+10.000) * 1 pm) + (10.000/(10.000+100)*1000 pm) = 990 pm. This calculation clearly demonstrates that the “weight average length” is dominated by the long size fibres, i.e. fibres having a length of 1000 pm.
The present inventors found that the length of the fibres is of importance when using the fibres for heat sink purposes. The thermal conductive high modules organic polymeric fibres allow heat to transfer directly from the heat source to the heat sink. This unlike particles, where frequent transfer of energy between the particles is required to transfer heat from the heat source to the heat sink. Although the thermal conductive high modules organic polymeric fibres should have a certain minimal length, they also have a certain maximum length. For example it will be impossible to homogenously disperse extremely long fibres into the polymeric carrier. Those fibres will cluster and homogenous dispersion is difficult, moreover, those fibres could also get entangled around a mechanical rotating component (e.g. a mixer) during dispersion. The present inventors assume that an optimal length of the fibres depends, inter alia, on the size of the gap between the heat source and heat sink that needs to be overcome.
According to a preferred embodiment of the present invention the thermal conductivity of the thermal conductive high modules organic polymeric fibres is at least 5 W/nvK, preferably at least 10 W/nvK and even more preferably at least 20 W/nvK.
The high modules organic polymeric fibres have a unique property. These fibres have a low electrical conductivity which is in the order of 1010 - 1014 Ohm*mm2/m, but high thermal conductivity. The latter is, depending on the draw ratio, approximately 10 - 45 W/nvK. This makes highly drawn high modules organic polymeric fibres an excellent electrical isolator, but surprisingly also an excellent thermal conductor.
To achieve the preferred thermal conductivity it is necessary to use highly drawn high modules organic polymeric fibres. The draw ratio is important for getting high modules, but at the same time influences the thermal conductivity. The higher the draw ratio, the higher the thermal conductivity. The draw ratio should be at least be 5, (i.e. ratio between length of fibre/sheet after stretching and original length of fibre/sheet before stretching), preferably more than 15, most preferably more than 50.
The thermal conductive high modules organic polymeric fibres are preferably chosen from the group of Ultra High Molecular Weight Polyethylene (UHMW-PE), polybenzobisoxazole (PBO), polyhydroquinone diimidazopyridine (PIPD) and poly(phenylene benzobisthiazole) (PBT).
In a preferred embodiment of the present invention the thermal conductive high modules organic polymeric fibres are electric isolators as well. A preferred embodiment of the thermal conductive high modules organic polymeric fibres is Ultra High Molecular Weight Polyethylene (UHMW-PE). ). Commercial available fibres are for example Endumax® (Teijin), Dyneema (DSM) and Spectra (Honeywell). A preferred embodiment of the thermal conductive high modules organic polymeric fibres of the type polybenzobisoxazole is Zylon (Toyobo Corporation).
The present invention furthermore relates to a polymeric carrier comprising thermal conductive high modules organic polymeric fibres as discussed above, wherein the amount of the thermal conductive high modules organic polymeric fibres is preferably 3-70 wt.%, on basis of the total weight of the polymeric carrier.
Examples of polymeric carriers, which can be a liquid as well as a solid, are those chosen from the group of (silicon) grease, pastes, paints, lacquers and adhesives. Preferred examples of adhesives are pressure sensitive adhesives, 2 component adhesives, low temperature hot-melt adhesives, 1 component adhesives and UV curable adhesives.
The polymeric carrier according to the present invention can further comprise one or more fillers and/or additives chosen from the group of calcium carbonate, clay, rubber particles, fibres, or glass particles, UV stabilizers, thermal stabilizers, anti-oxidants, levelling agents, flow agents, anti-static additives and anti-fog additives. The thermal conductive filler according to the invention is used as filler for polymeric carriers. Since the high modules organic polymeric fibres are thermally stable up their melting point. It is important that the thermal conductive high modules organic polymeric fibres according to the invention can be dispersed into the polymeric carrier at temperature below the melting point of the fibres.
The present invention furthermore relates to a method for manufacturing thermal conductive high modules organic polymeric fibres , wherein the method comprises the following steps: i) providing thermal conductive high modules organic polymeric fibres, and ii)reducing the size of the thermal conductive high modules organic polymeric fibres such that the weight average length of the fibres is in the range of from 15 pm and 10 cm by means of one or more of cutting using scissors, cutting using rotating discs and slicing using a sharp knife. Highly drawn high modules organic polymeric fibres are commercially available/produced as “endless” fibres and need to be shortened to small fibres such that they can be used as thermal conductive filler. The high modules, and extreme strength, of the fibres, make it very difficult to cut them. E.g. highly drawn fibres from UHMWPE are known to be 12 times stronger than steel and extremely cut resistant. The present inventors found that it is possible to cut these fibres by using special blades. For example it is possible to cut the fibres by using sharp rotating discs, slicing with a sharp knife or by using scissors with specially designed corrugated edges. However, due to the strength and toughness of the fibres the blades dull easily and frequent need to be used for cutting, and frequent sharpening of the blades is required.
The present invention provides also another method for manufacturing thermal conductive high modules organic polymeric fibres comprising the following steps: i) providing thermal conductive high modules organic polymeric fibres, and iii) exposing the fibres to a cooling medium for reducing their temperature below the glass transition temperature of the fibres and reducing the size of the to fibres such that the weight average length of the fibres is in the range of from 15 pm and 10 cm. According to this preferred method the size of the fibres is mechanically reduced by first exposing the fibres to liquid nitrogen and reducing their temperature to below the glass transition temperature of the fibres. By doing so, the fibres become brittle and are much easier to mechanically reduce their size. For example UHMWPE fibres become brittle at temperatures below -150 degrees Celsius. By exposing these fibres to liquid nitrogen, which has a boiling point of -196 degrees Celsius, the fibres become brittle and can be reduced to size much easier. Such a reduction can be carried out by cutting or by exerting a force.
The present invention also relates to a method for manufacturing a polymeric carrier comprising the present thermal conductive high modules organic polymeric fibres, wherein the method comprises the following steps: iii) providing thermal conductive high modules organic polymeric fibres wherein the weight average length of the fibres is in the range of from 15pm and 10 cm, and iv)dispersing the thermal conductive high modules organic polymeric fibres in a polymeric carrier at a temperature below the melting point of the fibres.
In a preferred embodiment step iv) is carried such the amount of the thermal conductive high modules organic polymeric fibres is 3-70 wt.%, on basis of the total weight of the polymeric carrier.
The present invention furthermore relates to an electrical component comprising the present polymeric carrier as discussed above and/or the polymeric carrier manufactured according to the present method as discussed above.
Examples of electrical components are those chosen from the group of Integrated Circuit (IC) boards, solar cells, high-power semiconductor devices, such as power transistors and optoelectronics, such as lasers and light emitting diodes (LEDs).
The present invention furthermore relates to the use of the present thermal conductive high modules organic polymeric fibres for dissipating heat generated by an electrical component into the surrounding medium.
The present invention is further elucidated by the following example which is by no means meant to limit the scope of the invention.
Example
Endumax (trademark) as a 13.3 cm wide tape based on fibres of high modulus organic polymeric UHMWPE is cut by using a rotating disc into large segments of about 30 cm. The segments thus cut are placed into a container provided with liquid nitrogen having a boiling temperature of -196 degrees Celsius. When the UHMWPE fibres are cooled to -196 degrees Celsius, a rotating cutter is used to further shorten the length of the fibres. After cutting sieves are used to select the fibres with the desired length, which is between about 15 pm and about 10 cm, and the fibres thus selected are mixed via stirring into silicon grease for preparing a thermal conductive grease.

Claims (16)

1. Thermisch geleidende, hoge modulus organische polymeervezels, waarbij de gewichtsgemiddelde lengte van voornoemde vezels zich bevindt in het gebied van 15 μηι en 10 cm.A thermally conductive, high modulus organic polymer fiber, wherein the weight average length of said fibers is in the range of 15 μηι and 10 cm. 2. Thermisch geleidende, hoge modulus organische polymeervezels volgens conclusie 1, waarbij de gewichtsgemiddelde lengte van voornoemde vezels zich bevindt in het gebied van 250 μηι en 1 cm, bij voorkeur in het gebied van 0,5-5 mm.The thermally conductive, high modulus organic polymer fibers according to claim 1, wherein the weight average length of said fibers is in the range of 250 μηι and 1 cm, preferably in the range of 0.5-5 mm. 3. Thermisch geleidende, hoge modulus organische polymeervezels volgens een of meer van de voorgaande conclusies, waarbij de thermische geleidbaarheid van voornoemde, thermisch geleidende, hoge modulus organisch polymeervezels ten minste 5 W/nvK bedraagt, bij voorkeur ten minste 10 W/m»K bedraagt en met name bij voorkeur ten minste 20 W/nvK bedraagt.Thermally conductive, high modulus organic polymer fibers according to one or more of the preceding claims, wherein the thermal conductivity of said thermally conductive, high modulus organic polymer fibers is at least 5 W / nvK, preferably at least 10 W / m »K and in particular preferably at least 20 W / nvK. 4. Thermisch geleidende, hoge modulus organische polymeervezels volgens een of meer van de voorgaande conclusies, waarbij voornoemde, thermisch geleidende, hoge modulus organisch polymeervezels zijn gekozen uit de groep van zeer hoog molecuulgewicht polyetheen (UHMW-PE), polybenzobisoxazool (PBO), polyhydrochinon diimidazopyridine (PI PD) en poly(fenyleenbenzobisthiazool) (PBT).Thermally conductive, high modulus organic polymer fibers according to one or more of the preceding claims, wherein said thermally conductive, high modulus organic polymer fibers are selected from the group of very high molecular weight polyethylene (UHMW-PE), polybenzobisoxazole (PBO), polyhydroquinone diimidazopyridine (PI PD) and poly (phenylene benzobisthiazole) (PBT). 5. Thermisch geleidende, hoge modulus organische polymeervezels volgens conclusie 4, waarbij voornoemde, thermisch geleidende hoge modulus organisch polymeervezels zeer hoog molecuulgewicht polyetheen (UHW-PE) zijn.The thermally conductive, high modulus organic polymer fibers according to claim 4, wherein said thermally conductive high modulus organic polymer fibers are very high molecular weight polyethylene (UHW-PE). 6. Polymeerdrager, omvattende thermisch geleidende, hoge modulus organisch polymeervezels volgens een of meer van de voorafgaande conclusies.A polymer carrier comprising thermally conductive, high modulus organic polymer fibers according to one or more of the preceding claims. 7. Polymeerdrager volgens conclusie 6, waarbij de hoeveelheid van voornoemde, thermisch geleidende, hoge modulus organisch polymeervezels 3-70 gew.% bedraagt, op basis van het totale gewicht van voornoemde polymeerdrager.The polymer support according to claim 6, wherein the amount of said thermally conductive, high modulus organic polymer fibers is 3-70% by weight based on the total weight of said polymer support. 8. Polymeerdrager volgens een of meer van de conclusies 6-7, waarbij voornoemde polymeerdrager is gekozen uit de groep van (siliconen) vet, pasta’s, verven, lakken en hechtmiddelen.Polymer carrier according to one or more of claims 6-7, wherein said polymer carrier is selected from the group of (silicone) grease, pastes, paints, lacquers and adhesives. 9. Polymeerdrager volgens een of meer van de conclusies 6-8, verder omvattende een of meer vulmiddelen en/of toevoegmiddelen, gekozen uit de groep van calciumcarbonaat, klei, rubberdeeltjes, vezels of glasdeeltjes, UV-stabilisatiemiddelen, thermische stabilisatiemiddelen, antioxidanten, vloeimiddelen, stromingsmiddelen, antistatische additieven en anticondensadditieven.9. Polymer support according to one or more of claims 6-8, further comprising one or more fillers and / or additives selected from the group of calcium carbonate, clay, rubber particles, fibers or glass particles, UV-stabilizers, thermal stabilizers, antioxidants, flow agents , flow agents, antistatic additives and anti-condens additives. 10. Werkwijze ter vervaardiging van thermisch geleidende, hoge modulus organische polymeervezels volgens een of meer van de conclusies 1-5, welke werkwijze de volgende stappen omvat: i) het verschaffen van thermisch geleidende, hoge modulus organische polymeervezels, en ii) het verlagen van de afmeting van voornoemde, thermisch geleidende, hoge modulus organische polymeervezels zodat de gewichtsgemiddelde lengte van voornoemde vezels zich bevindt in het gebied van 15 μιη en 10 cm door middel van een of meer snijmethoden onder toepassing van scharen, snijmiddelen onder toepassing van roterende schijven en snijden onder toepassing van een scherp mes.A method of producing thermally conductive, high modulus organic polymer fibers according to one or more of claims 1-5, which method comprises the steps of: i) providing thermally conductive, high modulus organic polymer fibers, and ii) lowering the size of said thermally conductive, high modulus organic polymer fibers so that the weight average length of said fibers is in the range of 15 μιη and 10 cm by means of one or more cutting methods using scissors, cutting means using rotating discs and cutting using a sharp knife. 11. Werkwijze ter vervaardiging van thermisch geleidende, hoge modulus organische polymeervezels volgens een of meer van de conclusies 1-5, welke werkwijze de volgende stappen omvat: i) het verschaffen van thermisch geleidende, hoge modulus organische polymeervezels, en ii) het blootstellen van voornoemde vezels aan een koelmedium voor het verlagen van de temperatuur hiervan tot een waarde beneden de glasovergangstemperatuur van voornoemde vezels en het reduceren van de afmeting van voornoemde vezels zodanig dat die zich bevindt in het gebied van 15 pm en 10 cm.A method of manufacturing thermally conductive, high modulus organic polymer fibers according to one or more of claims 1-5, which method comprises the steps of: i) providing thermally conductive, high modulus organic polymer fibers, and ii) exposing said fibers to a cooling medium for lowering their temperature to a value below the glass transition temperature of said fibers and reducing the size of said fibers so that it is in the range of 15 µm and 10 cm. 12. Werkwijze ter vervaardiging van een polymeerdrager, omvattende thermisch geleidende, hoge modulus organische polymeervezels, welke werkwijze de volgende stappen omvat: iii) het verschaffen van thermisch geleidende, hoge modulus organische polymeervezels waarbij de gewichtsgemiddelde lengte van voornoemde vezels zich bevindt in het gebied van 15 μηι en 10 cm; iv) het dispergeren van voornoemde, thermisch geleidende, hoge modulus organische polymeervezels in een polymeerdrager bij een temperatuur beneden het smeltpunt van voornoemde vezels.A method of manufacturing a polymer carrier comprising thermally conductive, high modulus organic polymer fibers, the method comprising the steps of: iii) providing thermally conductive, high modulus organic polymer fibers wherein the weight average length of said fibers is in the range of 15 μηι and 10 cm; iv) dispersing said thermally conductive, high modulus organic polymer fibers in a polymer carrier at a temperature below the melting point of said fibers. 13. Werkwijze volgens conclusie 12, waarbij stap iv) zodanig wordt uitgevoerd dat de hoeveelheid van voornoemde, thermisch geleidende, hoge modulus organische polymeervezels 3-70 gew.% bedraagt, op basis van het totale gewicht van voornoemde polymeerdrager.A method according to claim 12, wherein step iv) is carried out such that the amount of said thermally conductive, high modulus organic polymer fibers is 3-70% by weight, based on the total weight of said polymer carrier. 14. Elektrische component, omvattende een polymeerdrager volgens een of meer van de conclusies 6-9 en/of een polymeerdrager vervaardigd volgens een werkwijze volgens een of meer van de conclusies 12-13.An electrical component comprising a polymer carrier according to one or more of claims 6-9 and / or a polymer carrier manufactured according to a method according to one or more of claims 12-13. 15. Elektrische component volgens conclusie 14, waarbij voornoemd elektrische component is gekozen uit de groep van geïntegreerde schakel(IC)borden, zonnecellen, hoogvermogen halfgeleiderorganen, zoals krachttransistoren en opto-elektronica, zoals lasers en licht-emitterende dioden (LED’s).The electrical component of claim 14, wherein said electrical component is selected from the group of integrated circuit boards (IC) boards, solar cells, high power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs). 16. Het gebruik van thermisch geleidende, hoge modulus organische polymeervezels met een gewichtsgemiddelde lengte in het gebied van 15 μηη en 10 cm voor het afgeven van warmte gegenereerd door een elektrisch component aan het omringende medium.16. The use of thermally conductive, high modulus organic polymer fibers with a weight average length in the range of 15 μηη and 10 cm for delivering heat generated by an electrical component to the surrounding medium.
NL2012988A 2014-06-12 2014-06-12 Thermal conductive high modules organic polymeric fibers. NL2012988B1 (en)

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WO2019168038A1 (en) * 2018-03-01 2019-09-06 日立化成株式会社 Anisotropic thermal conductive resin member and manufacturing method thereof
JP7388348B2 (en) * 2018-03-01 2023-11-29 株式会社レゾナック Anisotropically thermally conductive resin fiber, anisotropically thermally conductive resin member, and manufacturing method thereof
WO2020158826A1 (en) * 2019-01-30 2020-08-06 日立化成株式会社 Anisotropic heat-conducting resin member and heat-transmitting substrate

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