TW201627410A - Composition for electrically insulating polymer-inorganic hybrid material with high thermal conductivity - Google Patents

Abstract

A composition containing a continuous phase called sea phase and discrete, isolated dispersed domains in and surrounded by the continuous phase called island phase. The continuous phase contains thermally conductive, electrically insulative fillers and the isolated phase contains thermally conductive fillers that could be electrically conductive. A polymer composite material formed from the composition has high thermal conductivity with good electrical insulation suitable for a thermal management component.

Description

Composition for polymer-inorganic hybrid material for electrically insulating high thermal conductivity

The present invention relates to a composition for polymerizing a polymer-inorganic hybrid material having a high thermal conductivity suitable for a thermal management element of an electronic device, a polymer material, and an article containing the same.

Thermal management is in every aspect of the microelectronic space, such as integrated circuits (ICs), light-emitting diodes (LEDs), power electronics, displays, and photovoltaic devices. It is important. The performance of such devices can be directly affected by the operating temperature. Reducing the operating temperatures of such devices can extend life and improve performance compared to operating at higher temperatures.

In solid state lighting technology, there is a strong need to improve thermal management. Proper heat dissipation in LED devices is critical to their reliable long-term operation. Failure to adequately manage heat can have a negative impact on LED performance. Prolonged exposure to excessive operating temperatures can result in irreversible damage to the semiconductor components within the LED die, resulting in reduced light output, altered color rendering index, and significantly reduced LED lifetime. Therefore, materials having higher thermal conductivity properties are required for thermal management of LED devices.

The heat sink in the electronic system is made by dissipating heat into the surrounding air. Passive component for device cooling. The heat sink is used to cool electronic components or semiconductor components, such as high power semiconductor devices and optoelectronic devices such as higher power lasers and light emitting diodes (LEDs). Conventional heat sinks use aluminum fins and a number of copper heat pipes for cooling high heat dissipation processors. The heat sink is designed to increase the surface area in contact with its surrounding cooling medium, such as air. However, metals are heavy and difficult to handle complex forms. Therefore, it has been demanded to develop materials having higher thermal conductivity and lower specific gravity and lower processing costs as a substitute for metals.

Although the polymeric material is lightweight and easy to handle, its low thermal conductivity properties prevent its application to heat sinks. In order to increase the thermal conductivity of the polymer material, a large amount of a thermally conductive filler, such as boron nitride, is added to the polymer material. See, for example, EP2094772B, WO2013012685A, US20090069483A, WO2012114309A, WO2009043850A, WO2011106252A, WO2012114310A, US20080265202A, and US20120229981A. However, since the thermally conductive polymer material requires an extremely high filler loading, it causes handling difficulties because extremely high pressure is now required to mold the polymer.

Carbon based fillers, such as graphite, have much higher thermal conductivity than boron nitride. Some of the above references disclose the use of carbon-based fillers other than thermally conductive fillers. However, since the conductivity of the carbon-based filler is high, the electrical insulation of the polymer material containing the filler is not good.

Accordingly, there is a need for an electrically insulating polymer-based material suitable for thermal management elements of electronic devices that is easy to handle and has high thermal conductivity.

The inventors of the present invention have now discovered a technical method of maintaining electrical insulating properties while incorporating conductive fillers into polymeric materials. This method uses an island-sea polymer structure in a composition having at least two resins. One resin forms a continuous phase called sea phase, and another resin shape A discrete, isolated dispersion domain that is in the continuous phase and surrounded by the continuous phase. These domains can be referred to as island phases. A thermally conductive, electrically conductive filler is incorporated into the island phase resin, and a thermally conductive filler having low electrical conductivity (or electrical insulating properties) is incorporated into the marine resin. The discrete phases can be formed by phase separation of the two resins during melt blending. Alternatively, very small particles of the island phase material (eg, higher melting thermoplastics or solidified or partially cured thermoset particles) may be dispersed in the melt of the marine phase. The resulting polymer composite has high thermal conductivity and good electrical insulation properties.

Accordingly, one aspect of the invention relates to a composition comprising: (a) a continuous phase comprising a first resin and at least one thermally conductive, electrically insulating filler; and (b) a discontinuous phase comprising a second a resin and at least one thermally conductive, electrically conductive filler, wherein the continuous phase surrounds the discrete domains of the discontinuous phase.

Another aspect of the present invention relates to a method of preparing the composition, comprising the steps of: (a) separately preparing a first resin mixture comprising a first resin and at least one thermally conductive, electrically insulating filler, and comprising a second resin and a second resin mixture of at least one thermally conductive, electrically conductive filler; and (b) a condition of a second resin mixture for discrete domains of the phase separated from the first resin mixture and forming a discontinuous phase surrounded by the first resin mixture The first resin mixture and the second resin mixture are mixed down.

Another aspect of the invention pertains to a polymer composite formed from the above composition and an article comprising the polymer composite.

As used throughout this specification, unless the context clearly refers otherwise Otherwise, the abbreviations given below have the following meanings: g = grams; mg - milligrams; m = meters; mm = millimeters; cm = centimeters; min = minutes; s = seconds; hr. = hours; °C = °C = Degree Celsius; K = kelyin; W = watt; Ω = ohm; wt% = weight percent; vol% = volume percent. Throughout this specification, the words "resin" and "polymer" are used interchangeably.

<composition>

The composition of the present invention comprises a continuous phase and a discrete domain of discontinuous phases surrounded by the continuous phase. The continuous phase comprises a first resin (Resin A) and at least one thermally conductive, electrically insulating filler (Filler-1), and the discontinuous phase comprises a second resin (Resin B) and at least one thermally conductive, electrically conductive filler (Filler-2) . The structure of these resins is called an island-sea structure. The second resin is preferably separated from the first resin during blending. Alternatively, the small particles of the resin B may be dispersed in the melt of the resin A.

(a) Resin A and Resin B

The resin A and the resin B used in the present invention may be selected from various resins, and the restriction conditions are that the resins form an island-sea structure. Resin A and Resin B may be selected from thermoplastic resins, thermosetting resins or mixtures thereof. The cured or partially cured thermosetting resin can be used as the resin A and/or the resin B. The resin may also be selected from the group consisting of oligomers, homopolymers, copolymers, block copolymers, alternating block copolymers, random polymers, random copolymers, random block copolymers, graft copolymers, stars. a block copolymer, a dendrimer or the like, or a combination comprising at least one of the foregoing polymers.

Examples of such resins include polyamidamine, nylon, polyphenylene sulfide (PPS), polyolefin, polyacetal, polycarbonate (PC), polystyrene (PS) ), polyester, liquid crystal polyester (LCP), polyethylene terephthalate (PET), acrylonitrile-butyl Acrylonitrile-butadiene-stylene (ABS), polytetrafluoroethylene (PTFE), polyvinyl fluoride (PVF), polyoxymethylene (POM), polybutylene terephthalate (polybutadiene terephthalate; PBT), polyphenylene oxide (PPO), polyetheretherketone (PEEK), polyetherimide (PEI) and polymethyl methacrylate (PMMA) .

The volume of the resin A/resin B is preferably 99/1 or less, more preferably 70/30 or less. The volume of the resin A/resin B is preferably 60/40 or more, more preferably 65/35 or 65/35 or more.

The melting point of the resin A is preferably lower than the melting point of the resin B. The melting point of the resin A is preferably lower than the melting point of the resin B by 5 ° C, and the melting point of the resin A is further preferably 10 ° C lower than the melting point of the resin B. The melting point of Resin A is preferably lower than the melting point of Resin B by 20 °C.

At the processing temperature of the polymer composite, the viscosity of the resin A is preferably lower than the viscosity of the resin B. The viscosity of the resin can be measured in accordance with ASTM D2196-99.

(b) continuous phase (marine)

The continuous phase (sea phase) of the composition comprises a resin A and at least one thermally conductive, electrically insulating filler (filler-1).

Resin A has been disclosed above. Filler-1 has an intrinsic thermal conductivity (at room temperature) of 20 W/mK or more. The inherent thermal conductivity of the filler is more preferably 30 W/mK or more. The inherent thermal conductivity of the filler can be measured according to the ASTM E1461-01 method. Filler-1 has a resistivity of 10 ¹² Ω. Cm or 10 ¹² Ω. Above cm, preferably 10 ¹⁵ Ω. Cm or 10 ¹⁵ Ω. More than cm. The resistivity of the filler can be measured according to ASTM D257-01.

Examples of the filler-1 include boron nitride (BN), aluminum nitride (AIN), aluminum oxide (Al ₂ O ₃ ), magnesium oxide (MgO), cerium oxide (SiO ₂ ), lanthanum carbide (SiC), zinc oxide. (ZnO), cerium oxide (BeO), and graphene oxide. The filler is preferably selected from the group consisting of boron nitride, aluminum nitride, and graphene oxide. The filler can be used in the form of a mixture.

The filler has a particle diameter of 0.1 μm or more, preferably 10 μm or more. The larger the filler, the better the thermal conductivity. However, the particle diameter of the filler is 300 μm or less, preferably 100 μm or less, due to the influence of the mechanical properties and handleability of the composite. The particle size of the filler can be analyzed by a laser diffraction method. The "particle size" in this application means the median size (D50, 50% of the size of the sample containing smaller particles).

The content of the filler-1 in the continuous phase (sea phase) is preferably 20% by volume or more, more preferably 50% by volume or more, and most preferably 60% by volume or more, based on the total volume of the sea phase. 60% by volume or more. Meanwhile, the content of the filler is preferably 80% by volume or less based on the total volume of the sea phase, more preferably 70% by volume or less, and most preferably 65% by volume or less. Although the content of the filler-1 in the marine phase is disclosed in the form of vol%, the content of the filler-1 is preferably from 20 to 85% by weight based on the weight of the marine phase if its content is disclosed in the form of % by weight.

(c) discontinuous phase (island phase)

The discontinuous phase (island phase) of the composition comprises a resin B and at least one thermally conductive, electrically conductive filler (filler-2).

Resin B has been disclosed above. Filler-2 has 20W/m at room temperature. K or 20W/m. Intrinsic thermal conductivity above K. The inherent thermal conductivity of the filler is preferably 30 W/mK or more. At the same time, the resistivity of the filler is 10 ^-6 Ω. Cm or 10 ^-6 Ω. Below cm, preferably 10 ^-3 Ω. Cm or 10 ^-3 Ω. Below cm. The thermal conductivity and electrical resistivity of the filler can be measured in the same manner as above.

Examples of the filler include graphite, carbon nanotubes, carbon fibers, carbon black, metal particles, and graphene. Mixtures of two or more fillers may also be used. The filler is preferably graphite. The graphite may be produced synthetically or naturally, or may be expanded graphite. Naturally occurring graphite includes three types of graphite, namely crystalline scaly graphite, amorphous graphite, and crystalline vein graphite. Expanded graphite can be produced by sequentially immersing natural scaly graphite in a chromic acid bath and concentrated sulfuric acid, which forces the lattice planes to separate, thereby expanding the graphite. After expansion, the functional acid and the hydroxyl group are introduced, and thus the affinity of the expanded graphite for the organic compound and the polymer is promoted. In addition, expanded graphite is more thermally conductive when compared to conventional carbon materials such as standard graphite. Expanded graphite is preferred as the filler-2 of the present invention.

The particle diameter of the filler is preferably 0.05 μm or more, more preferably 0.1 μm or more, and most preferably 10 μm or more. The particle diameter of the filler is preferably 100 μm or less, more preferably 20 μm or less. The particle size of the filler can be analyzed by a laser diffraction method. The particle size means the median diameter (D50).

The content of the filler-2 in the discontinuous phase (island phase) is preferably 20% by volume or more, more preferably 60% by volume or more, and most preferably 65% by volume based on the total volume of the island phase. Or 65 vol% or more. Meanwhile, the content of the filler is preferably 80% by volume or less, more preferably 75% by volume or less, and most preferably 70% by volume or less by 70% by volume or less based on the total volume of the island phase. Although the content of the filler-2 in the island phase is disclosed in the form of volume %, if the content is disclosed in the form of % by weight, the filler-2 is preferably contained in an amount of 40 to 90% by weight based on the weight of the island phase.

The dispersed size of the island phase in the composition is preferably 10 micrometers or more. More preferably 50 microns or more. The dispersed size of the island phase in the composition is preferably 500 μm or less, more preferably 200 μm or less.

The composition used in the present invention may contain other additives such as a flame retardant, an antioxidant, a UV stabilizer, a plasticizer, a coupling agent, a mold release agent, a pigment, and a dye. These additives may be added to at least one of the marine phase or the island phase.

Examples of the flame retardant used for the composition include cerium oxide, a halogenated hydrocarbon, a halogenated ester, a halogenated ether, a brominated flame retardant, and a halogen-free compound such as an organic phosphorus compound, an organic nitrogen compound, and an intumescent flame retardant.

Examples of the antioxidant used in the composition include sodium sulfite, sodium metabisulfite, sodium hydrogen sulfite, sodium thiosulfate, and dibutyl phenol.

Examples of the UV stabilizer for the composition include benzophenone, benzotriazole, substituted acrylate, aryl ester, and a compound containing a nickel or cobalt salt.

Examples of plasticizers for the composition include phthalate benzoate, dibenzoate, thermoplastic polyurethane plasticizer, phthalate, naphthalene sulfonate, Trimellitic acid ester, adipate, sebacate, maleate, sulfonamide, organic phosphate, polybutene.

Examples of the coupling agent for the composition include a chromium complex, a decane coupling agent, a titanate coupling agent, a zirconium coupling agent, a magnesium coupling agent, and a tin coupling agent.

Examples of the release agent for the composition include inorganic release agents such as talc, mica powder, clay and clay; organic mold release agents such as aliphatic acid soap, fatty acid, paraffin, glycerin and petrolatum; Agents such as polyoxyphthalic acid, polyethylene glycol and polyethylene.

Examples of the pigment or dye used in the composition of the present invention include chromate, sulfuric acid Salts, citrates, borates, molybdates, phosphates, vanadates, cyanates, sulfides, azo pigments, phthalocyanine pigments, hydrazine, indigo, quinacridones and dioxazine dyes.

<Method of preparing a composition>

The method for preparing the composition of the present invention comprises the steps of: (a) separately preparing a first resin mixture comprising a first resin (Resin A) and at least one thermally conductive, electrically insulating filler (Filler-1) and comprising a second resin (Resin) B) and a second resin mixture of at least one thermally conductive, electrically conductive filler (filler-2); and (b) conditions for the domain of the second resin mixture forming a discrete phase of the discontinuous phase surrounded by the first resin mixture The first resin mixture and the second resin mixture are mixed down.

The blending of Resin A and Filler-1 or the blending of Resin B and Filler-2 can be carried out by any known method such as melt blending or solution blending. Melt blending can be carried out using a melt mixer (such as a HAAKE Rheomix mixer), a single screw or twin screw extruder, a kneader, a Banbury mixer until homogeneous. For example, Filler-1 (BN) and Resin A (PA) can be melt blended by using a Haake mixer (Polylab brand) at 270 to 300 ° C at a mixing speed of 20 to 60 rpm/min for 5 to 25 minutes.

The mixing of the first resin mixture and the second resin mixture is carried out at a temperature higher than the melting point of the resin A. It is preferred to carry out the mixing at a temperature higher than the melting point of the resin A and lower than the melting point of the resin B. The conditions for mixing the two resin mixtures are critical in the process of the invention. The inventors of the present invention have found that the larger island phase size increases the thermal conductivity of the cured polymeric material formed from the composition. Therefore, the conditions for mixing the two resin mixtures are controlled such that the island phase size is 10 micrometers or more. More preferably, the conditions for mixing the two resin mixtures are controlled such that the island phase size is 20 micrometers or more, more preferably 30 micrometers or more.

In order to obtain a larger-sized island phase, mixing should not be sufficiently and thoroughly, as thorough mixing results in a much smaller island phase. The mixing speed should be slower and the mixing time should be shorter than the conditions in which the composition is sufficiently and thoroughly mixed. The mixing speed is preferably 80% or less, and the mixing speed is more preferably 70% or less, as compared with the condition of sufficiently and thoroughly mixing the composition. The mixing time is preferably 50% or less, more preferably 30% or less, as compared with the condition of sufficiently and thoroughly mixing the composition. For example, when the Haake mixer is used to mix the resin mixture, the mixing speed is preferably 30 rpm or less, and the mixing time is 10 minutes or 10 minutes, compared to the conditions of sufficient and thorough mixing (20 minutes at 50 rpm). the following.

<Polymer composite>

The polymer composite of the present invention can be formed from the compositions disclosed above. The polymer material is obtained by pouring or pouring the composition into a mold and then cooling the composition. If at least one of the resin A and the resin B is a thermosetting resin, the curing step is further added to the above process. For example, a thermoplastic resin is used as the resin A, and a pre-cured thermosetting resin is used as the resin B, and the composition is poured into a mold at a temperature higher than the melting point of the resin A, followed by heating to a temperature at which the resin B is sufficiently cured. Since the filler-2 incorporated into the discontinuous phase is less likely to diffuse out of the discontinuous phase, the polymer composite formed by the process has the advantage of more electrical insulation.

The cured polymeric material has a high thermal conductivity as well as good insulating properties. The coplanar thermal conductivity of the cured thermoset is 8W/m. K or 8W/m. K or more, preferably 10 W/m. K or 10W/m. K or more. The thermal conductivity of the cured thermoset is preferably 12 W/m. K or 12W/m. K or more. The resistivity (volume resistance) of the material is preferably 1 × 10 ¹² Ω. Cm or 1 x 10 ¹² Ω. More than cm, more preferably 1 × 10 ¹³ Ω. Cm or 1×10 ¹³ Ω. More than cm.

<item>

The articles of the present invention comprise a heat source and a thermal management component located adjacent the heat source. The thermal management component comprises a polymer composite formed from the compositions described above. Since the polymer composite used in the present invention has a high thermal conductivity, the heat generated by the heat source is sufficiently transferred and removed from the heat source.

Examples of such heat sources include integrated circuit (IC) wafers, light emitting diodes (LEDs), power electronics, displays, and photovoltaic devices.

The thermal management assembly of the present invention can be a heat sink or a material that is coupled to a heat source and a heat sink. As disclosed above, the heat sink is used to cool electronic components or semiconductor components, such as high power semiconductor devices, and optoelectronic devices, such as higher power lasers and light emitting diodes (LEDs). Since the polymer composite of our invention has a high thermal conductivity, the heat generated by the heat source is effectively transferred and removed from the heat source.

Other examples of thermal management components are electronic encapsulants, sealants, adhesives, electrical switches, printed circuit boards, and wire coatings.

The article of the present invention may be a substrate having an electronic component or a semiconductor component such as an IC chip or a power electronic device (heat source) and a plastic substrate or plastic film (thermal management component) in contact with the heat source. IC chips or other electronic components are typically mounted on a laminated plastic substrate such as an epoxy or polyimide resin. Ceramic substrates, such as aluminum or aluminum nitrate, are also used as substrates for power electronics because of the thermal management that is required by power electronics. Since the ceramic substrate is difficult to laminate or process, a plastic substrate having a high thermal conductivity is required. The polymer composite of our invention can be used for this purpose.

The article of the present invention may be a system comprising an electronic device (heat source) and a thermosetting resin (thermal management component) covering the device. In order to protect electronic devices from mechanical damage, electronics The device can be covered with a material such as a thermosetting resin. Since the electronic device generates heat, it is necessary to thermally manage the material. A polymer composite of the invention of the invention having a higher thermal conductivity can be used for this purpose. An example of such an article is an LED illumination system having an LED lamp encapsulated by a cured thermoset.

The article of the present invention may be a solid state lighting system comprising an LED lamp (heat source) and a pedestal (thermal management component) on which the LED lamp is mounted. In solid state lighting systems, LED lights are mounted on a pedestal and surrounded by side walls. Since the LED lamps generate heat, thermal management of the solid state lighting system is required. A polymer composite of the invention of the invention having a higher thermal conductivity can be used for this purpose.

Example Embodiment 1 of the present invention

29.60 g (29.60 g) of nylon 66 (product name Zytel 101F, supplied from Dupont) was charged into a mixer (Haake mixer), and mixed at 290 ° C for 2 minutes, and melted in a clear manner. 57.20 g (57.20 g) of boron nitride (BN: product name: PT110, particle size 40 μm, supplied from Momentive) was added to the molten resin, and mixed at 290 ° C for 20 minutes. The mixing rotor speed was 50 rpm. The mixture (composite A-1) was collected and used as a "sea" phase that is thermally conductive but electrically insulating.

Expanded graphite (40.04 g, product name C-THERM 011, particle size 20 to 30 microns, supplied from Timcal) was incorporated into 45.63 g of polyphenylene sulfide by mixing with the same Haake (Polylab brand) as above. (PPS: supplied from Sihuan Deyang Chemical). The rotor speed was 50 rpm. The mixture (composite B-1) was collected and used as an "island" phase for electrical insulation.

17.16 grams (17.16 g) of composite B-1 was incorporated into 69.47 g of composite A-1 by mixing at 290 °C for 5 minutes using a Haake mixer. The rotor speed of the hybrid composite B-1 and the composite A-1 was 30 rpm. The mixture was collected and placed in a mold and compressed at 290 ° C into a plate having a thickness of 2 mm. Next, the molded sample was cooled at room temperature. Analyze thermal conductivity and volume resistivity. The thermal conductivity of the coplanar and through plane directions is 11.6 and 3.1 W/mK, respectively. The volume resistance is 2.15×10 ¹⁵ Ω. Cm.

analysis Thermal conductivity

The thermal diffusivity α (mm ² /s) of the samples was measured with a Netzsch Nanoflash LFA 447 instrument in accordance with ASTM D1461-01 in the plane of the plane of the sheet. The experimental parameters used to collect the data were: temperature 25 ° C, sample diameter 12.67 mm. A laser light absorbing spray was applied to the surface of the disc-shaped sample to dry the disc-shaped sample. Four flash shots were taken and then the alpha mean and standard deviation were obtained. The density ρ (g/cm ³ ) of the sample at room temperature was measured by hydrostatic weighing, which measured the density of the object using the displacement of water due to the immersion of the article. The heat capacity CP of the sample at 25 ° C was measured by DSC (DSC-Q2000) according to ASTM E1269-11 using Standard Test Method for Determining Specific Heat Capacity by Differential Scanning Calorimetry (J/ g C). The thermal conductivity (W/m.K) is calculated according to the following equation: TC = α × ρ × Cp.

2. Electrical properties

The volume/surface resistivity of the cured sample was measured using a 6517B electrometer/high resistance meter (Keithley Instruments). The sample was clamped using an electrode holder (8009 resistivity test fixture), which was then automatically measured according to ASTM D257-07.

Embodiment 2 of the present invention

BN (66.00 g) was incorporated into 22.80 g of nylon 66 (Zytel 101F) by the same process as disclosed in Example 1 of the present invention. The mixture (composite A-2) was collected and used as a "sea" phase that is thermally conductive but electrically insulating.

34.58 grams (34.58 g) of expanded graphite was incorporated into 45.63 g of PPS by the same process as disclosed in Example 1 of the present invention. The mixture (composite B-2) was collected and used as an "island" phase for electrical insulation.

Composite B-2 (26.95 g) was incorporated into Composite A-2 (57.72 g) by the same procedure as disclosed in Example 1 of the present invention. The mixing speed was 30 rpm. The same molded sample as in Example 1 was formed. The thermal conductivity of the coplanar and through plane directions is 14.9 and 3.6 W/mK. The volume resistance of composite material C was measured to be 3.3 × 10 ¹³ Ω. Cm. Element mapping was performed by using field emission scanning electron microscopy (FESEM) equipped with energy-dispersive spectroscopy (EDS) analysis to obtain an elemental map image with an acceleration voltage of 20 kV. From the elemental mapping of the sample, BN is in the nylon 66 phase and the graphite is in the PPS phase.

Embodiment 3 of the present invention

BN (80.08 g) was incorporated into 21.06 g PPS by the same process as disclosed in Example 1 of the present invention. The mixture (composite A-3) is used as a "sea" phase that is thermally conductive but electrically insulating.

Expanded graphite (49.40 g) was incorporated into 29.64 g of nylon 66 by the same process as disclosed in Example 1 of the present invention. The mixture (composite B-3) is used as an "island" phase for electrical insulation.

Composite B-3 (27.66 g) was incorporated into 65.74 g of composite A-3 by the same process as disclosed in Example 1 of the present invention. The mixing speed was 30 rpm. The same molded sample as in Example 1 was formed. The thermal conductivity in the coplanar and through plane directions was 15.2 and 2.7 W/mK, respectively. The volume resistance of composite material C was measured to be 1.76 × 10 ¹² Ω. Cm. From the SEM observation of the cross section of the sample, a clear phase separation between the PPS phase and the nylon 66 phase was observed. From the elemental mapping of the sample, BN is in the PPS phase and the graphite is in the nylon phase.

Comparative Example 1

BN (45.76 g) and graphite (8.02 g) were incorporated into a blend of 23.71 g of nylon 66 and 9.14 g of PPS by mixing with Haake (Polylab brand) at a speed of 50 rpm at 290 °C. The cured sample was formed by the same process as Example 1 of the present invention. The thermal conductivity through the plane direction was 2.9 W/mK. The volume resistivity of the composite material is less than 1000Ω. Cm.

Comparative Example 2

BN (42.90 g) and graphite (11.62 g) were incorporated into a blend of 14.28 g of nylon 66 and 15.33 g of PPS by mixing with Haake (Polylab brand) at a speed of 50 rpm at 290 °C. The cured sample was formed by the same process as Example 1 of the present invention. The thermal conductivity through the plane direction was 3.5 W/mK. The volume resistivity of the composite material is less than 1000Ω. Cm.

The formulations are summarized in Tables 1 and 2 and the results are shown in Table 3.

Claims (10)

A composition comprising (a) a continuous phase comprising a first resin and at least one thermally conductive, electrically insulating filler, and (b) a discontinuous phase comprising a second resin and at least one thermally conductive, electrically conductive filler, wherein the continuous A discrete domain that surrounds the discontinuous phase. The composition of claim 1, wherein the thermally conductive and electrically insulating filler is selected from the group consisting of zinc oxide, magnesium oxide, cerium oxide, cerium carbide, aluminum nitride, boron nitride, and aluminum oxide. The composition of claim 1 or 2, wherein the thermally conductive and electrically conductive filler is selected from the group consisting of graphite, graphene and metal particles. The composition of claim 1 or 2, wherein the first resin/the second resin has a volume ratio of from 99/1 to 60/40. The composition of claim 1 or 2, wherein the melting point of the first resin is lower than the melting point of the second resin. The composition of claim 1 or 2, wherein the viscosity of the first resin is lower than the viscosity of the second resin measured at the processing temperature of the composition. A method of preparing a composition according to any one of claims 1 to 6, comprising the steps of: (a) separately preparing a first resin comprising the first resin and at least one thermally conductive, electrically insulating filler; a mixture and a second resin mixture comprising the second resin and at least one thermally conductive, electrically conductive filler; and (b) discrete for separating the phase from the first resin mixture and forming a discontinuous phase surrounded by the first resin mixture The first resin mixture and the second resin mixture are mixed under the conditions of the second resin mixture of the domains. The method of claim 7, wherein the mixing the first resin mixture and the first The two resin mixture is carried out at a temperature higher than the melting point of the resin A and lower than the melting point of the resin B. A polymer composite material formed from the composition according to any one of claims 1 to 6. An article comprising a heat source and an electrically insulating thermal management component positioned adjacent the heat source, wherein the thermal management component comprises a polymer composite as in claim 9 of the patent application.