NL2000625A1 - Kap voor immersielithografie. - Google Patents
Kap voor immersielithografie.Info
- Publication number
- NL2000625A1 NL2000625A1 NL2000625A NL2000625A NL2000625A1 NL 2000625 A1 NL2000625 A1 NL 2000625A1 NL 2000625 A NL2000625 A NL 2000625A NL 2000625 A NL2000625 A NL 2000625A NL 2000625 A1 NL2000625 A1 NL 2000625A1
- Authority
- NL
- Netherlands
- Prior art keywords
- hood
- immersion lithography
- lithography
- immersion
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79744306P | 2006-05-04 | 2006-05-04 | |
US79744306 | 2006-05-04 | ||
US42743406 | 2006-06-29 | ||
US11/427,434 US7675604B2 (en) | 2006-05-04 | 2006-06-29 | Hood for immersion lithography |
Publications (2)
Publication Number | Publication Date |
---|---|
NL2000625A1 true NL2000625A1 (nl) | 2007-11-06 |
NL2000625C2 NL2000625C2 (nl) | 2009-02-25 |
Family
ID=38660880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL2000625A NL2000625C2 (nl) | 2006-05-04 | 2007-05-03 | Kap voor immersielithografie. |
Country Status (3)
Country | Link |
---|---|
US (1) | US7675604B2 (nl) |
KR (1) | KR100903823B1 (nl) |
NL (1) | NL2000625C2 (nl) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2131241B1 (en) * | 2008-05-08 | 2019-07-31 | ASML Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
EP2136250A1 (en) * | 2008-06-18 | 2009-12-23 | ASML Netherlands B.V. | Lithographic apparatus and method |
SG166747A1 (en) | 2009-05-26 | 2010-12-29 | Asml Netherlands Bv | Fluid handling structure, lithographic apparatus and device manufacturing method |
NL2004808A (en) | 2009-06-30 | 2011-01-12 | Asml Netherlands Bv | Fluid handling structure, lithographic apparatus and device manufacturing method. |
NL2009272A (en) * | 2011-08-31 | 2013-03-04 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
EP2602663A1 (en) | 2011-12-09 | 2013-06-12 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | System and method for overlay control |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6686570B2 (en) * | 2000-02-10 | 2004-02-03 | Tokyo Electron Limited | Hot plate unit |
TWI232357B (en) * | 2002-11-12 | 2005-05-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
AU2003302830A1 (en) * | 2002-12-10 | 2004-06-30 | Nikon Corporation | Exposure apparatus and method for manufacturing device |
JP4492239B2 (ja) | 2003-07-28 | 2010-06-30 | 株式会社ニコン | 露光装置及びデバイス製造方法、並びに露光装置の制御方法 |
EP1510867A1 (en) * | 2003-08-29 | 2005-03-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1524558A1 (en) * | 2003-10-15 | 2005-04-20 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006013130A (ja) * | 2004-06-25 | 2006-01-12 | Nikon Corp | 露光装置、露光方法、及びデバイスの製造方法 |
US7304715B2 (en) * | 2004-08-13 | 2007-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR20060124906A (ko) * | 2005-06-01 | 2006-12-06 | 매그나칩 반도체 유한회사 | 이머젼 리소그라피 장치 |
KR20070047132A (ko) * | 2005-11-01 | 2007-05-04 | 주식회사 하이닉스반도체 | 이머젼 리소그래피의 기포 제거방법 |
US20070209433A1 (en) * | 2006-03-10 | 2007-09-13 | Honeywell International Inc. | Thermal mass gas flow sensor and method of forming same |
-
2006
- 2006-06-29 US US11/427,434 patent/US7675604B2/en not_active Expired - Fee Related
-
2007
- 2007-05-03 NL NL2000625A patent/NL2000625C2/nl active Search and Examination
- 2007-05-04 KR KR1020070043651A patent/KR100903823B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US20070258060A1 (en) | 2007-11-08 |
KR20070108085A (ko) | 2007-11-08 |
KR100903823B1 (ko) | 2009-06-25 |
NL2000625C2 (nl) | 2009-02-25 |
US7675604B2 (en) | 2010-03-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AD1A | A request for search or an international type search has been filed | ||
RD2N | Patents in respect of which a decision has been taken or a report has been made (novelty report) |
Effective date: 20081224 |
|
PD2B | A search report has been drawn up |