NL171943C - Bedradingsinrichting, voor het aanbrengen van draadverbindingen van micro-electronische elementen. - Google Patents

Bedradingsinrichting, voor het aanbrengen van draadverbindingen van micro-electronische elementen.

Info

Publication number
NL171943C
NL171943C NLAANVRAGE7601636,A NL7601636A NL171943C NL 171943 C NL171943 C NL 171943C NL 7601636 A NL7601636 A NL 7601636A NL 171943 C NL171943 C NL 171943C
Authority
NL
Netherlands
Prior art keywords
micro
electronic elements
wiring device
wire connections
applying wire
Prior art date
Application number
NLAANVRAGE7601636,A
Other languages
English (en)
Dutch (nl)
Other versions
NL7601636A (nl
NL171943B (nl
Inventor
Takekazu Yoshida
Yoshiaki Makizawa
Tamotsu Tanaka
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of NL7601636A publication Critical patent/NL7601636A/xx
Publication of NL171943B publication Critical patent/NL171943B/xx
Application granted granted Critical
Publication of NL171943C publication Critical patent/NL171943C/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/481—Disposition
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    • H01L2224/852—Applying energy for connecting
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
NLAANVRAGE7601636,A 1975-02-18 1976-02-18 Bedradingsinrichting, voor het aanbrengen van draadverbindingen van micro-electronische elementen. NL171943C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2050975A JPS555853B2 (de) 1975-02-18 1975-02-18

Publications (3)

Publication Number Publication Date
NL7601636A NL7601636A (nl) 1976-08-20
NL171943B NL171943B (nl) 1983-01-03
NL171943C true NL171943C (nl) 1983-06-01

Family

ID=12029120

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7601636,A NL171943C (nl) 1975-02-18 1976-02-18 Bedradingsinrichting, voor het aanbrengen van draadverbindingen van micro-electronische elementen.

Country Status (4)

Country Link
US (1) US4039114A (de)
JP (1) JPS555853B2 (de)
GB (1) GB1524462A (de)
NL (1) NL171943C (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4795518A (en) * 1984-02-17 1989-01-03 Burr-Brown Corporation Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus
US4619395A (en) * 1985-10-04 1986-10-28 Kulicke And Soffa Industries, Inc. Low inertia movable workstation
US4844324A (en) * 1987-09-29 1989-07-04 Todd Thomas W Solder system and method of using same
JPH0235743A (ja) * 1988-07-26 1990-02-06 Mitsubishi Electric Corp 半導体装置の製造装置
DE10133885A1 (de) * 2000-07-21 2002-03-21 Esec Trading Sa Vorrichtung zur Herstellung von Drahtverbindungen
US6808102B1 (en) * 2000-08-28 2004-10-26 Asm Assembly Automation Ltd. Wire-bonding apparatus with improved XY-table orientation
US6588646B2 (en) * 2001-11-24 2003-07-08 Delphi Technologies, Inc. Ultrasonic welding of wires through the insulation jacket thereof
US6837751B2 (en) 2002-07-25 2005-01-04 Delphi Technologies, Inc. Electrical connector incorporating terminals having ultrasonically welded wires
JP2004134578A (ja) * 2002-10-10 2004-04-30 Hamamatsu Photonics Kk 光検出装置及びその製造方法
US20070181645A1 (en) * 2006-01-13 2007-08-09 Ho Wing Cheung J Wire bonding method and apparatus
US7654436B2 (en) * 2007-09-20 2010-02-02 Asm Assembly Automation Ltd. Wire bonding system utilizing multiple positioning tables

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2352113B2 (de) * 1973-10-17 1975-08-14 Eggert 8035 Gauting Herrmann Maschine zum automatischen Befestigen von Verbindungsdrähten an den Anschlußstellen eines Halbleiterkristalls
US3946931A (en) * 1974-11-27 1976-03-30 Western Electric Company, Inc. Methods of and apparatus for bonding an article to a substrate

Also Published As

Publication number Publication date
NL7601636A (nl) 1976-08-20
JPS555853B2 (de) 1980-02-12
US4039114A (en) 1977-08-02
NL171943B (nl) 1983-01-03
GB1524462A (en) 1978-09-13
JPS5194766A (de) 1976-08-19

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V1 Lapsed because of non-payment of the annual fee