NL170646C - Werkwijze voor het in een vlak oppervlak van een voorwerp vormen van verdiepte delen. - Google Patents

Werkwijze voor het in een vlak oppervlak van een voorwerp vormen van verdiepte delen.

Info

Publication number
NL170646C
NL170646C NLAANVRAGE7114349,A NL7114349A NL170646C NL 170646 C NL170646 C NL 170646C NL 7114349 A NL7114349 A NL 7114349A NL 170646 C NL170646 C NL 170646C
Authority
NL
Netherlands
Prior art keywords
deepen
article
forming
parts
flat surface
Prior art date
Application number
NLAANVRAGE7114349,A
Other languages
English (en)
Dutch (nl)
Other versions
NL7114349A (cg-RX-API-DMAC7.html
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL7114349A publication Critical patent/NL7114349A/xx
Application granted granted Critical
Publication of NL170646C publication Critical patent/NL170646C/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/2633—Bombardment with radiation with high-energy radiation for etching, e.g. sputteretching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Magnetic Heads (AREA)
NLAANVRAGE7114349,A 1970-10-19 1971-10-19 Werkwijze voor het in een vlak oppervlak van een voorwerp vormen van verdiepte delen. NL170646C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US081756A US3860783A (en) 1970-10-19 1970-10-19 Ion etching through a pattern mask

Publications (2)

Publication Number Publication Date
NL7114349A NL7114349A (cg-RX-API-DMAC7.html) 1972-04-21
NL170646C true NL170646C (nl) 1982-12-01

Family

ID=22166191

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7114349,A NL170646C (nl) 1970-10-19 1971-10-19 Werkwijze voor het in een vlak oppervlak van een voorwerp vormen van verdiepte delen.

Country Status (11)

Country Link
US (1) US3860783A (cg-RX-API-DMAC7.html)
JP (1) JPS5540665B1 (cg-RX-API-DMAC7.html)
KR (1) KR780000438B1 (cg-RX-API-DMAC7.html)
BE (1) BE773998A (cg-RX-API-DMAC7.html)
CA (1) CA926523A (cg-RX-API-DMAC7.html)
DE (1) DE2151200B2 (cg-RX-API-DMAC7.html)
FR (1) FR2111511A5 (cg-RX-API-DMAC7.html)
GB (1) GB1364735A (cg-RX-API-DMAC7.html)
IT (1) IT942719B (cg-RX-API-DMAC7.html)
NL (1) NL170646C (cg-RX-API-DMAC7.html)
SE (1) SE383280B (cg-RX-API-DMAC7.html)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3988564A (en) * 1972-07-17 1976-10-26 Hughes Aircraft Company Ion beam micromachining method
US4049944A (en) * 1973-02-28 1977-09-20 Hughes Aircraft Company Process for fabricating small geometry semiconductive devices including integrated components
DE2521543A1 (de) * 1974-05-16 1975-11-27 Crosfield Electronics Ltd Verfahren und vorrichtung zur wiedergabe von bildern
JPS5230851B2 (cg-RX-API-DMAC7.html) * 1974-10-11 1977-08-11
JPS5738897B2 (cg-RX-API-DMAC7.html) * 1974-11-19 1982-08-18
US3920483A (en) * 1974-11-25 1975-11-18 Ibm Method of ion implantation through a photoresist mask
US4207105A (en) * 1975-01-27 1980-06-10 Fuji Photo Film Co., Ltd. Plasma-etching image in exposed AgX emulsion
JPS51105821A (en) * 1975-03-14 1976-09-20 Fuji Photo Film Co Ltd Masukugazono keiseihoho
US4117301A (en) * 1975-07-21 1978-09-26 Rca Corporation Method of making a submicrometer aperture in a substrate
US4016062A (en) * 1975-09-11 1977-04-05 International Business Machines Corporation Method of forming a serrated surface topography
JPS5275341A (en) * 1975-12-19 1977-06-24 Rikagaku Kenkyusho Method of producing echelette grating
FR2354617A1 (fr) * 1976-06-08 1978-01-06 Electro Resistance Procede pour la fabrication de resistances electriques a partir de feuilles ou de films metalliques et resistances obtenues
US4045318A (en) * 1976-07-30 1977-08-30 Rca Corporation Method of transferring a surface relief pattern from a poly(olefin sulfone) layer to a metal layer
GB1585460A (en) * 1976-11-23 1981-03-04 Lucas Industries Ltd Method of manufacturing a lamp
DE2708792C3 (de) * 1977-03-01 1980-07-10 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verwendung des Ionenätzverf ahrens zum Strukturieren von Halbleiterschichten und Ionenätzverfahren für diese Verwendung
US4275286A (en) * 1978-12-04 1981-06-23 Hughes Aircraft Company Process and mask for ion beam etching of fine patterns
US4214966A (en) * 1979-03-20 1980-07-29 Bell Telephone Laboratories, Incorporated Process useful in the fabrication of articles with metallized surfaces
US4248688A (en) * 1979-09-04 1981-02-03 International Business Machines Corporation Ion milling of thin metal films
US4564997A (en) * 1981-04-21 1986-01-21 Nippon-Telegraph And Telephone Public Corporation Semiconductor device and manufacturing process thereof
US4426274A (en) 1981-06-02 1984-01-17 International Business Machines Corporation Reactive ion etching apparatus with interlaced perforated anode
US4359373A (en) * 1981-06-15 1982-11-16 Rca Corporation Method of formation of a blazed grating
IT1171401B (it) * 1981-07-20 1987-06-10 Selenia Ind Eletroniche Associ Aggiustamento a valore trimming diresistori a film sottile mediante erosione ionica
US4460434A (en) * 1982-04-15 1984-07-17 At&T Bell Laboratories Method for planarizing patterned surfaces
GB8319716D0 (en) * 1983-07-21 1983-08-24 Secr Defence Reactive ion etching
GB2148769A (en) * 1983-10-22 1985-06-05 Standard Telephones Cables Ltd Topographic feature formation by ion beam milling of a substrate
DE3509519A1 (de) * 1985-03-16 1986-09-18 Richard Heinze Kunststoff-Spritzgießwerke GmbH & Co, 4900 Herford Tastenkoerper sowie verfahren und vorrichtung zu seiner herstellung
US4906594A (en) * 1987-06-12 1990-03-06 Agency Of Industrial Science And Technology Surface smoothing method and method of forming SOI substrate using the surface smoothing method
DE4202194C2 (de) * 1992-01-28 1996-09-19 Fairchild Convac Gmbh Geraete Verfahren und Vorrichtung zum partiellen Entfernen von dünnen Schichten von einem Substrat
CA2097388A1 (en) * 1992-07-16 1994-01-17 Susan Nord Bohlke Topographical selective patterns
JP3394602B2 (ja) * 1993-07-05 2003-04-07 株式会社荏原製作所 高速原子線を用いた加工方法
US7150811B2 (en) * 2002-11-26 2006-12-19 Pei Company Ion beam for target recovery
KR100845004B1 (ko) * 2007-04-30 2008-07-09 삼성전자주식회사 나노 갭을 갖는 금속막 패턴의 형성 방법 및 이를 이용한분자크기의 소자 제조 방법
US20100021720A1 (en) * 2008-07-24 2010-01-28 Shembel Elena M Transparent coductive oxide and method of production thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3330696A (en) * 1967-07-11 Method of fabricating thin film capacitors
NL257531A (cg-RX-API-DMAC7.html) * 1960-03-30
US3118050A (en) * 1960-04-06 1964-01-14 Alloyd Electronics Corp Electron beam devices and processes
US3056881A (en) * 1961-06-07 1962-10-02 United Aircraft Corp Method of making electrical conductor device
BE630858A (cg-RX-API-DMAC7.html) * 1962-04-10 1900-01-01
US3398237A (en) * 1965-02-26 1968-08-20 Minnesota Mining & Mfg System for synchronizing a scanning electron beam with a rotating body
US3453723A (en) * 1966-01-03 1969-07-08 Texas Instruments Inc Electron beam techniques in integrated circuits
US3445926A (en) * 1967-02-28 1969-05-27 Electro Optical Systems Inc Production of semiconductor devices by use of ion beam implantation

Also Published As

Publication number Publication date
JPS5540665B1 (cg-RX-API-DMAC7.html) 1980-10-20
DE2151200B2 (de) 1979-10-04
DE2151200A1 (de) 1972-04-20
CA926523A (en) 1973-05-15
IT942719B (it) 1973-04-02
US3860783A (en) 1975-01-14
NL7114349A (cg-RX-API-DMAC7.html) 1972-04-21
FR2111511A5 (cg-RX-API-DMAC7.html) 1972-06-02
KR780000438B1 (en) 1978-10-14
BE773998A (fr) 1972-01-31
SE383280B (sv) 1976-03-08
GB1364735A (en) 1974-08-29

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Legal Events

Date Code Title Description
BC A request for examination has been filed
V4 Discontinued because of reaching the maximum lifetime of a patent