NL165355B - Werkwijze voor het maken van elektrische verbindingen. - Google Patents
Werkwijze voor het maken van elektrische verbindingen.Info
- Publication number
- NL165355B NL165355B NL7703929.A NL7703929A NL165355B NL 165355 B NL165355 B NL 165355B NL 7703929 A NL7703929 A NL 7703929A NL 165355 B NL165355 B NL 165355B
- Authority
- NL
- Netherlands
- Prior art keywords
- electrical connections
- making electrical
- making
- connections
- electrical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49181—Assembling terminal to elongated conductor by deforming
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Stroboscope Apparatuses (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/675,617 US4028798A (en) | 1976-04-09 | 1976-04-09 | Method of making electrical connections |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7703929A NL7703929A (nl) | 1977-10-11 |
NL165355B true NL165355B (nl) | 1980-10-15 |
NL165355C NL165355C (nl) | 1981-03-16 |
Family
ID=24711282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7703929.A NL165355C (nl) | 1976-04-09 | 1977-04-07 | Werkwijze voor het maken van elektrische verbindingen. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4028798A (nl) |
JP (1) | JPS52124169A (nl) |
BE (1) | BE853378A (nl) |
CA (1) | CA1079939A (nl) |
DE (1) | DE2715660C3 (nl) |
GB (1) | GB1571545A (nl) |
NL (1) | NL165355C (nl) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4241387A (en) * | 1977-12-09 | 1980-12-23 | General Electric Company | Lamp lead to wire attachment for integral string sets |
US4243371A (en) * | 1978-03-13 | 1981-01-06 | General Electric Company | Flash lamp array construction |
JPS569978A (en) * | 1979-05-04 | 1981-01-31 | Gen Electric | Electric connecting socket |
US4253233A (en) * | 1979-05-04 | 1981-03-03 | General Electric Company | Rapidly formed electrical connection |
US4242719A (en) * | 1979-06-01 | 1980-12-30 | Interconnection Technology, Inc. | Solder-weld P.C. board apparatus |
US4249230A (en) * | 1979-09-04 | 1981-02-03 | Gte Products Corporation | Photoflash unit utilizing circuit board having flashlamps clamped thereto |
US4394709A (en) * | 1980-03-19 | 1983-07-19 | Gte Products Corporation | Die-stamped circuit board assembly having relief means to prevent total switch deformation |
US4353109A (en) * | 1980-09-02 | 1982-10-05 | General Electric Company | Flash lamp array having combined shield and connector |
US4344108A (en) * | 1980-09-29 | 1982-08-10 | General Electric Company | Flash lamp array having printed circuit |
US4344109A (en) * | 1980-09-29 | 1982-08-10 | General Electric Company | Flash lamp array having printed circuit |
US4493667A (en) * | 1982-03-18 | 1985-01-15 | Gte Products Corporation | Multilamp photoflash array fabrication |
DE3631947A1 (de) * | 1986-09-19 | 1988-04-07 | Ruf Kg Wilhelm | Leiterbahnplatte |
US4897919A (en) * | 1986-10-27 | 1990-02-06 | Black & Decker Inc. | Method for producing a stamped substrate |
US5229548A (en) * | 1986-10-27 | 1993-07-20 | Black & Decker Inc. | Circuit board having a stamped substrate |
US5035049A (en) * | 1986-10-27 | 1991-07-30 | Black & Decker Inc. | Method for producing a stamped substrate |
DE19531970A1 (de) * | 1995-08-30 | 1997-03-06 | Siemens Ag | Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Trägersubstrat angeordnet ist |
US5783008A (en) * | 1997-03-31 | 1998-07-21 | Ford Global Technologies, Inc. | Apparatus and method for embedding conductors in a non-planar substrate |
US6019271A (en) * | 1997-07-11 | 2000-02-01 | Ford Motor Company | Method for ultrasonic bonding flexible circuits |
US7066628B2 (en) | 2001-03-29 | 2006-06-27 | Fiber Optic Designs, Inc. | Jacketed LED assemblies and light strings containing same |
US7056414B2 (en) * | 1999-10-07 | 2006-06-06 | Aisin Seiki Kabushiki Kaisha | Connecting method for metal material and electric conductive plastic material and product thereby |
JP2004045805A (ja) * | 2002-07-12 | 2004-02-12 | Yazaki Corp | 光ファイバ接続用のフェルール及び光ファイバとフェルールの溶着方法 |
US7407079B2 (en) * | 2003-10-23 | 2008-08-05 | Orthodyne Electronics Corporation | Automated filament attachment system for vacuum fluorescent display |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3384958A (en) * | 1965-06-30 | 1968-05-28 | Ibm | Method of brazing |
US3300851A (en) * | 1964-01-02 | 1967-01-31 | Gen Electric | Method of making bonded wire circuits |
US3674602A (en) * | 1969-10-09 | 1972-07-04 | Photocircuits Corp | Apparatus for making wire scribed circuit boards |
JPS4985563A (nl) * | 1972-12-22 | 1974-08-16 | ||
US3883213A (en) * | 1974-01-07 | 1975-05-13 | Chomerics Inc | Connectors |
US3894226A (en) * | 1974-09-26 | 1975-07-08 | Gen Electric | Photoflash lamp array having means for preventing electrical shorting |
-
1976
- 1976-04-09 US US05/675,617 patent/US4028798A/en not_active Expired - Lifetime
-
1977
- 1977-03-18 CA CA274,254A patent/CA1079939A/en not_active Expired
- 1977-04-06 JP JP3861177A patent/JPS52124169A/ja active Pending
- 1977-04-06 GB GB14499/77A patent/GB1571545A/en not_active Expired
- 1977-04-07 DE DE2715660A patent/DE2715660C3/de not_active Expired
- 1977-04-07 NL NL7703929.A patent/NL165355C/nl not_active IP Right Cessation
- 1977-04-07 BE BE176534A patent/BE853378A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE2715660C3 (de) | 1980-11-20 |
BE853378A (fr) | 1977-10-07 |
NL7703929A (nl) | 1977-10-11 |
DE2715660A1 (de) | 1977-10-20 |
GB1571545A (en) | 1980-07-16 |
JPS52124169A (en) | 1977-10-18 |
CA1079939A (en) | 1980-06-24 |
NL165355C (nl) | 1981-03-16 |
US4028798A (en) | 1977-06-14 |
DE2715660B2 (de) | 1980-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
V1 | Lapsed because of non-payment of the annual fee |