NL145395B - Werkwijze voor het vervaardigen van een ondersteuning voor een halfgeleiderinrichting. - Google Patents

Werkwijze voor het vervaardigen van een ondersteuning voor een halfgeleiderinrichting.

Info

Publication number
NL145395B
NL145395B NL707006122A NL7006122A NL145395B NL 145395 B NL145395 B NL 145395B NL 707006122 A NL707006122 A NL 707006122A NL 7006122 A NL7006122 A NL 7006122A NL 145395 B NL145395 B NL 145395B
Authority
NL
Netherlands
Prior art keywords
manufacturing
support
semiconductor device
semiconductor
Prior art date
Application number
NL707006122A
Other languages
English (en)
Other versions
NL7006122A (nl
Inventor
Sydney Jackson
Joseph Bell Titterington
Original Assignee
Ferranti Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti Ltd filed Critical Ferranti Ltd
Publication of NL7006122A publication Critical patent/NL7006122A/xx
Publication of NL145395B publication Critical patent/NL145395B/nl

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
NL707006122A 1969-04-26 1970-04-27 Werkwijze voor het vervaardigen van een ondersteuning voor een halfgeleiderinrichting. NL145395B (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB21401/69A GB1255832A (en) 1969-04-26 1969-04-26 Improvements relating to the manufacture of supports for semiconductor devices
GB4646772A GB1356879A (en) 1969-04-26 1972-10-09 Manufacture of supports for semiconductor devices

Publications (2)

Publication Number Publication Date
NL7006122A NL7006122A (nl) 1970-10-28
NL145395B true NL145395B (nl) 1975-03-17

Family

ID=62527852

Family Applications (1)

Application Number Title Priority Date Filing Date
NL707006122A NL145395B (nl) 1969-04-26 1970-04-27 Werkwijze voor het vervaardigen van een ondersteuning voor een halfgeleiderinrichting.

Country Status (4)

Country Link
DE (2) DE2017499A1 (nl)
FR (1) FR2045377A5 (nl)
GB (2) GB1255832A (nl)
NL (1) NL145395B (nl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486725A1 (fr) * 1980-07-09 1982-01-15 Gleizes Raymond Procede et appareil de presoudage de billes de soudure sur des pattes de connexion
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.

Also Published As

Publication number Publication date
NL7006122A (nl) 1970-10-28
FR2045377A5 (nl) 1971-02-26
DE2017499A1 (de) 1970-11-05
GB1255832A (en) 1971-12-01
GB1356879A (en) 1974-06-19
DE7006122U (nl) 1900-01-01

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