NL144667B - Werkwijze ter bereiding van waterige oplossingen voor stroomloos bekleden met metaal. - Google Patents
Werkwijze ter bereiding van waterige oplossingen voor stroomloos bekleden met metaal.Info
- Publication number
- NL144667B NL144667B NL717105020A NL7105020A NL144667B NL 144667 B NL144667 B NL 144667B NL 717105020 A NL717105020 A NL 717105020A NL 7105020 A NL7105020 A NL 7105020A NL 144667 B NL144667 B NL 144667B
- Authority
- NL
- Netherlands
- Prior art keywords
- currentless
- covering
- preparation
- metal
- aqueous solutions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3950370A | 1970-05-21 | 1970-05-21 | |
NL7007510A NL7007510A (nl) | 1970-05-21 | 1970-05-25 | |
NL7007511A NL7007511A (nl) | 1970-05-25 | 1970-05-25 | |
FR7019372A FR2088202B1 (nl) | 1970-05-21 | 1970-05-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
NL7105020A NL7105020A (nl) | 1971-11-23 |
NL144667B true NL144667B (nl) | 1975-01-15 |
Family
ID=27446064
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7007510A NL7007510A (nl) | 1970-05-21 | 1970-05-25 | |
NL717105020A NL144667B (nl) | 1970-05-21 | 1971-04-15 | Werkwijze ter bereiding van waterige oplossingen voor stroomloos bekleden met metaal. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7007510A NL7007510A (nl) | 1970-05-21 | 1970-05-25 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3649308A (nl) |
DE (2) | DE2124330B2 (nl) |
FR (2) | FR2088202B1 (nl) |
GB (2) | GB1324827A (nl) |
NL (2) | NL7007510A (nl) |
SE (1) | SE366069B (nl) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4005229A (en) * | 1975-06-23 | 1977-01-25 | Ppg Industries, Inc. | Novel method for the rapid deposition of gold films onto non-metallic substrates at ambient temperatures |
US4167601A (en) * | 1976-11-15 | 1979-09-11 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
US4228213A (en) * | 1979-08-13 | 1980-10-14 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
DE3622090C1 (nl) * | 1986-07-02 | 1990-02-15 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | |
US7410899B2 (en) * | 2005-09-20 | 2008-08-12 | Enthone, Inc. | Defectivity and process control of electroless deposition in microelectronics applications |
EP2639335B1 (en) * | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
EP2671969A1 (en) * | 2012-06-04 | 2013-12-11 | ATOTECH Deutschland GmbH | Plating bath for electroless deposition of nickel layers |
CN103820773A (zh) * | 2014-03-11 | 2014-05-28 | 上海贺鸿电子有限公司 | 用于镭射天线lds沉厚铜的溶液及其使用方法 |
TWI707061B (zh) * | 2015-11-27 | 2020-10-11 | 德商德國艾托特克公司 | 鈀之電鍍浴組合物及無電電鍍方法 |
US10060034B2 (en) | 2017-01-23 | 2018-08-28 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
RU2671988C1 (ru) * | 2017-10-02 | 2018-11-08 | Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" | Способ нанесения медного покрытия на полиэфирэфиркетон |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1254935B (de) * | 1960-12-31 | 1967-11-23 | Bayer Ag | Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen |
DE1621352C3 (de) * | 1967-02-03 | 1975-05-28 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Stabilisiertes alkalisches Kupferbad zur stromlosen Abscheidung von Kupfer |
-
1970
- 1970-05-21 US US39503A patent/US3649308A/en not_active Expired - Lifetime
- 1970-05-25 NL NL7007510A patent/NL7007510A/xx unknown
- 1970-05-27 FR FR7019372A patent/FR2088202B1/fr not_active Expired
-
1971
- 1971-04-15 NL NL717105020A patent/NL144667B/nl unknown
- 1971-05-14 FR FR7117546A patent/FR2091636A5/fr not_active Expired
- 1971-05-17 DE DE19712124330 patent/DE2124330B2/de not_active Withdrawn
- 1971-05-17 DE DE2124331A patent/DE2124331C3/de not_active Expired
- 1971-05-18 SE SE06452/71A patent/SE366069B/xx unknown
- 1971-05-21 GB GB1643571A patent/GB1324827A/en not_active Expired
- 1971-05-21 GB GB1643771A patent/GB1324895A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1324895A (en) | 1973-07-25 |
SE366069B (nl) | 1974-04-08 |
FR2088202B1 (nl) | 1975-01-10 |
DE2124330B2 (de) | 1976-05-20 |
GB1324827A (en) | 1973-07-25 |
NL7007510A (nl) | 1971-11-29 |
NL7105020A (nl) | 1971-11-23 |
DE2124331B2 (de) | 1976-05-20 |
FR2091636A5 (nl) | 1972-01-14 |
US3649308A (en) | 1972-03-14 |
DE2124330A1 (de) | 1971-12-02 |
DE2124331A1 (de) | 1971-12-02 |
DE2124331C3 (de) | 1982-11-11 |
FR2088202A1 (nl) | 1972-01-07 |
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