NL143369B - PROCEDURE FOR FITTING AN ELECTRICAL CONNECTION TO A SURFACE OF A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED IN ACCORDANCE WITH THIS PROCEDURE. - Google Patents

PROCEDURE FOR FITTING AN ELECTRICAL CONNECTION TO A SURFACE OF A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED IN ACCORDANCE WITH THIS PROCEDURE.

Info

Publication number
NL143369B
NL143369B NL6701217A NL6701217A NL143369B NL 143369 B NL143369 B NL 143369B NL 6701217 A NL6701217 A NL 6701217A NL 6701217 A NL6701217 A NL 6701217A NL 143369 B NL143369 B NL 143369B
Authority
NL
Netherlands
Prior art keywords
procedure
semiconductor device
fitting
accordance
electrical connection
Prior art date
Application number
NL6701217A
Other languages
Dutch (nl)
Other versions
NL6701217A (en
Inventor
Karel Jakobus Blok Van Ir Laer
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL6701217A priority Critical patent/NL143369B/en
Priority to DE19671614310 priority patent/DE1614310C3/en
Priority to CA010400A priority patent/CA918813A/en
Priority to ES349649A priority patent/ES349649A1/en
Priority to SE91568A priority patent/SE363191B/xx
Priority to CH99468A priority patent/CH468698A/en
Priority to GB351668A priority patent/GB1193373A/en
Priority to AT66868A priority patent/AT280351B/en
Priority to BE709837D priority patent/BE709837A/xx
Priority to FR1551826D priority patent/FR1551826A/fr
Publication of NL6701217A publication Critical patent/NL6701217A/xx
Priority to JP2400770A priority patent/JPS514631B1/ja
Publication of NL143369B publication Critical patent/NL143369B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
NL6701217A 1967-01-26 1967-01-26 PROCEDURE FOR FITTING AN ELECTRICAL CONNECTION TO A SURFACE OF A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED IN ACCORDANCE WITH THIS PROCEDURE. NL143369B (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
NL6701217A NL143369B (en) 1967-01-26 1967-01-26 PROCEDURE FOR FITTING AN ELECTRICAL CONNECTION TO A SURFACE OF A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED IN ACCORDANCE WITH THIS PROCEDURE.
DE19671614310 DE1614310C3 (en) 1967-01-26 1967-12-14 Method for attaching an electrical connection to a surface of an electronic component
CA010400A CA918813A (en) 1967-01-26 1968-01-22 Method of providing an electric connection to a surface of an electronic device and device obtained by said method
CH99468A CH468698A (en) 1967-01-26 1968-01-23 Electrical circuit arrangement with an electrical connection and method for its production
SE91568A SE363191B (en) 1967-01-26 1968-01-23
ES349649A ES349649A1 (en) 1967-01-26 1968-01-23 Improvements in and relating to Electronic Devices
GB351668A GB1193373A (en) 1967-01-26 1968-01-23 Improvements in and relating to Electronic Devices
AT66868A AT280351B (en) 1967-01-26 1968-01-23 Method for attaching an electrical connection to a surface of an electronic circuit arrangement
BE709837D BE709837A (en) 1967-01-26 1968-01-24
FR1551826D FR1551826A (en) 1967-01-26 1968-01-26
JP2400770A JPS514631B1 (en) 1967-01-26 1970-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6701217A NL143369B (en) 1967-01-26 1967-01-26 PROCEDURE FOR FITTING AN ELECTRICAL CONNECTION TO A SURFACE OF A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED IN ACCORDANCE WITH THIS PROCEDURE.

Publications (2)

Publication Number Publication Date
NL6701217A NL6701217A (en) 1968-07-29
NL143369B true NL143369B (en) 1974-09-16

Family

ID=19799131

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6701217A NL143369B (en) 1967-01-26 1967-01-26 PROCEDURE FOR FITTING AN ELECTRICAL CONNECTION TO A SURFACE OF A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED IN ACCORDANCE WITH THIS PROCEDURE.

Country Status (11)

Country Link
JP (1) JPS514631B1 (en)
AT (1) AT280351B (en)
BE (1) BE709837A (en)
CA (1) CA918813A (en)
CH (1) CH468698A (en)
DE (1) DE1614310C3 (en)
ES (1) ES349649A1 (en)
FR (1) FR1551826A (en)
GB (1) GB1193373A (en)
NL (1) NL143369B (en)
SE (1) SE363191B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2176938A (en) * 1985-06-24 1987-01-07 Nat Semiconductor Corp Pad metallization structure

Also Published As

Publication number Publication date
FR1551826A (en) 1968-12-27
DE1614310A1 (en) 1970-08-13
GB1193373A (en) 1970-05-28
CH468698A (en) 1969-02-15
SE363191B (en) 1974-01-07
AT280351B (en) 1970-04-10
ES349649A1 (en) 1969-10-01
NL6701217A (en) 1968-07-29
BE709837A (en) 1968-07-24
DE1614310C3 (en) 1975-05-28
DE1614310B2 (en) 1974-10-10
CA918813A (en) 1973-01-09
JPS514631B1 (en) 1976-02-13

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee
NL80 Abbreviated name of patent owner mentioned of already nullified patent

Owner name: PHILIPS