NL125803C - - Google Patents

Info

Publication number
NL125803C
NL125803C NL125803DA NL125803C NL 125803 C NL125803 C NL 125803C NL 125803D A NL125803D A NL 125803DA NL 125803 C NL125803 C NL 125803C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL125803C publication Critical patent/NL125803C/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
NL125803D 1961-01-16 NL125803C (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82895A US3116443A (en) 1961-01-16 1961-01-16 Semiconductor device

Publications (1)

Publication Number Publication Date
NL125803C true NL125803C (en:Method)

Family

ID=22174140

Family Applications (2)

Application Number Title Priority Date Filing Date
NL125803D NL125803C (en:Method) 1961-01-16
NL270369D NL270369A (en:Method) 1961-01-16

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL270369D NL270369A (en:Method) 1961-01-16

Country Status (8)

Country Link
US (1) US3116443A (en:Method)
BE (1) BE612543A (en:Method)
CH (1) CH389785A (en:Method)
DE (1) DE1300165B (en:Method)
ES (1) ES273893A1 (en:Method)
FR (1) FR1307591A (en:Method)
GB (1) GB992963A (en:Method)
NL (2) NL270369A (en:Method)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE636316A (en:Method) * 1962-08-23 1900-01-01
US3331995A (en) * 1964-02-25 1967-07-18 Hughes Aircraft Co Housed semiconductor device with thermally matched elements
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3297921A (en) * 1965-04-15 1967-01-10 Int Rectifier Corp Controlled rectifier having shunted emitter formed by a nickel layer underneath an aluminum layer
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
FR2328286A1 (fr) 1975-10-14 1977-05-13 Thomson Csf Procede de fabrication de dispositifs a semiconducteurs, presentant une tres faible resistance thermique, et dispositifs obtenus par ledit procede
DE2855972C2 (de) * 1978-12-23 1984-09-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung mit zwei integrierten und antiparallel geschalteten Dioden sowie Verfahren zu ihrer Herstellung
US4392577A (en) * 1981-04-10 1983-07-12 Shionogi & Co., Ltd. Glass vial with diagonal cut line
US5416354A (en) * 1989-01-06 1995-05-16 Unitrode Corporation Inverted epitaxial process semiconductor devices
JPH10501656A (ja) * 1992-01-27 1998-02-10 ハリス・コーポレーション 半導体デバイス及びその量産方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2874340A (en) * 1953-06-26 1959-02-17 Sprague Electric Co Rectifying contact
US2789258A (en) * 1955-06-29 1957-04-16 Raytheon Mfg Co Intrinsic coatings for semiconductor junctions
NL210518A (en:Method) * 1955-09-12
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device
US3110080A (en) * 1958-01-20 1963-11-12 Westinghouse Electric Corp Rectifier fabrication
US2921245A (en) * 1958-10-08 1960-01-12 Int Rectifier Corp Hermetically sealed junction means
NL244815A (en:Method) * 1959-02-09
NL254726A (en:Method) * 1959-08-11
NL256633A (en:Method) * 1959-10-09

Also Published As

Publication number Publication date
FR1307591A (fr) 1962-10-26
CH389785A (de) 1965-03-31
BE612543A (fr) 1962-05-02
ES273893A1 (es) 1962-06-01
GB992963A (en) 1965-05-26
DE1300165B (de) 1969-07-31
US3116443A (en) 1963-12-31
NL270369A (en:Method)

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