NL123901C - - Google Patents

Info

Publication number
NL123901C
NL123901C NL123901DA NL123901C NL 123901 C NL123901 C NL 123901C NL 123901D A NL123901D A NL 123901DA NL 123901 C NL123901 C NL 123901C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL123901C publication Critical patent/NL123901C/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • Y10T29/49893Peripheral joining of opposed mirror image parts to form a hollow body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NL123901D 1960-04-29 NL123901C (US08197722-20120612-C00093.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR825725A FR1269094A (fr) 1960-04-29 1960-04-29 Diode à semi-conducteur

Publications (1)

Publication Number Publication Date
NL123901C true NL123901C (US08197722-20120612-C00093.png)

Family

ID=8730346

Family Applications (2)

Application Number Title Priority Date Filing Date
NL123901D NL123901C (US08197722-20120612-C00093.png) 1960-04-29
NL264049D NL264049A (US08197722-20120612-C00093.png) 1960-04-29

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL264049D NL264049A (US08197722-20120612-C00093.png) 1960-04-29

Country Status (6)

Country Link
US (1) US3234437A (US08197722-20120612-C00093.png)
CH (1) CH392701A (US08197722-20120612-C00093.png)
DE (1) DE1194503B (US08197722-20120612-C00093.png)
FR (1) FR1269094A (US08197722-20120612-C00093.png)
GB (1) GB928436A (US08197722-20120612-C00093.png)
NL (2) NL264049A (US08197722-20120612-C00093.png)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484660A (en) * 1963-09-20 1969-12-16 Gen Electric Sealed electrical device
US3373335A (en) * 1964-12-22 1968-03-12 Electronic Devices Inc Stacked assembly of rectifier units incorporating shunt capacitors
US3413532A (en) * 1965-02-08 1968-11-26 Westinghouse Electric Corp Compression bonded semiconductor device
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3735211A (en) * 1971-06-21 1973-05-22 Fairchild Camera Instr Co Semiconductor package containing a dual epoxy and metal seal between a cover and a substrate, and method for forming said seal
FR2182791B1 (US08197722-20120612-C00093.png) * 1972-05-03 1977-12-30 Siemens Ag
US4021839A (en) * 1975-10-16 1977-05-03 Rca Corporation Diode package
JP2841940B2 (ja) * 1990-12-19 1998-12-24 富士電機株式会社 半導体素子
WO2020081448A1 (en) * 2018-10-15 2020-04-23 Semtech Corporation Semiconductor package for providing mechanical isolation of assembled diodes

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2423091A (en) * 1942-10-03 1947-07-01 Standard Telephones Cables Ltd Contact rectifier
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
NL94441C (US08197722-20120612-C00093.png) * 1951-09-15
FR1108663A (fr) * 1953-10-19 1956-01-16 Licentia Gmbh Système conducteur électrique asymétrique
GB815289A (en) * 1954-11-12 1959-06-24 British Thomson Houston Co Ltd Improvements in rectifiers utilising semi-conducting material
NL100659C (US08197722-20120612-C00093.png) * 1954-12-27
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
US3017550A (en) * 1959-08-07 1962-01-16 Motorola Inc Semiconductor device
US3023346A (en) * 1959-11-27 1962-02-27 Westinghouse Electric Corp Rectifier structure

Also Published As

Publication number Publication date
CH392701A (fr) 1965-05-31
US3234437A (en) 1966-02-08
NL264049A (US08197722-20120612-C00093.png)
GB928436A (en) 1963-06-12
DE1194503B (de) 1965-06-10
FR1269094A (fr) 1961-08-11

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