NL123240C - - Google Patents

Info

Publication number
NL123240C
NL123240C NL123240DA NL123240C NL 123240 C NL123240 C NL 123240C NL 123240D A NL123240D A NL 123240DA NL 123240 C NL123240 C NL 123240C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL123240C publication Critical patent/NL123240C/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D285/00—Heterocyclic compounds containing rings having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by groups C07D275/00 - C07D283/00
    • C07D285/01—Five-membered rings
    • C07D285/02—Thiadiazoles; Hydrogenated thiadiazoles
    • C07D285/04—Thiadiazoles; Hydrogenated thiadiazoles not condensed with other rings
    • C07D285/12—1,3,4-Thiadiazoles; Hydrogenated 1,3,4-thiadiazoles
    • C07D285/125—1,3,4-Thiadiazoles; Hydrogenated 1,3,4-thiadiazoles with oxygen, sulfur or nitrogen atoms, directly attached to ring carbon atoms, the nitrogen atoms not forming part of a nitro radical
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
NL123240D 1960-07-23 NL123240C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB25733/60A GB939997A (en) 1960-07-23 1960-07-23 Improvements in or relating to copper pyrophosphate electroplating solutions

Publications (1)

Publication Number Publication Date
NL123240C true NL123240C (zh)

Family

ID=10232403

Family Applications (2)

Application Number Title Priority Date Filing Date
NL267368D NL267368A (zh) 1960-07-23
NL123240D NL123240C (zh) 1960-07-23

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL267368D NL267368A (zh) 1960-07-23

Country Status (4)

Country Link
US (1) US3161575A (zh)
DE (1) DE1225938B (zh)
GB (1) GB939997A (zh)
NL (2) NL123240C (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1235101A (en) * 1967-05-01 1971-06-09 Albright & Wilson Mfg Ltd Improvements relating to electrodeposition of copper
CA898183A (en) * 1970-05-25 1972-04-18 R. Bharucha Nanabhai Method of plating copper on aluminum
CA1001581A (en) * 1971-11-10 1976-12-14 Canada Wire And Cable Limited Plating copper on aluminum
JPS4970834A (zh) * 1972-11-08 1974-07-09
JPS5167234A (ja) * 1974-12-09 1976-06-10 Hitachi Ltd Pirorinsandometsukizeikahimakuboshiho
US4517103A (en) * 1983-04-18 1985-05-14 R. T. Vanderbilt Company, Inc. Lubricating compositions containing 5,5'-dithiobis(1,3,4-thiadiazole-2-thiol)
US6379522B1 (en) 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
US6544399B1 (en) 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
US6620771B2 (en) * 1999-10-20 2003-09-16 R. T. Vanderbilt Company, Inc. Thiadiazole dimer additives and lubricating compositions containing the same
CN100383133C (zh) 1999-10-20 2008-04-23 R·T·范德比尔特公司 噻二唑二聚物添加剂和包含该添加剂的润滑组合物
WO2002068727A2 (en) * 2001-02-23 2002-09-06 Ebara Corporation Copper-plating solution, plating method and plating apparatus
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
DE102005004472A1 (de) * 2005-01-31 2006-08-10 Rhein Chemie Rheinau Gmbh Verfahren zur Herstellung von Bis-DMTD
US20120028073A1 (en) * 2009-02-12 2012-02-02 Technion Research & Development Foundation Ltd. Process for electroplating of copper
DE102009041250B4 (de) * 2009-09-11 2011-09-01 Umicore Galvanotechnik Gmbh Verfahren zur elektrolytischen Verkupferung von Zinkdruckguss mit verringerter Neigung zur Blasenbildung
US20110092465A1 (en) * 2009-10-21 2011-04-21 Syracuse University Monomeric pyrophosphate complexes and methods of treatment using the complexes
SE545031C2 (en) * 2021-07-15 2023-03-07 Seolfor Ab Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2462870A (en) * 1942-07-09 1949-03-01 Gen Motors Corp Electrodeposition of copper
US2437865A (en) * 1943-09-25 1948-03-16 United Chromium Inc Method of electrodepositing copper and baths and compositions therefor
US2493092A (en) * 1946-01-11 1950-01-03 United Chromium Inc Method of electrodepositing copper and baths therefor
US2609339A (en) * 1948-11-02 1952-09-02 United Chromium Inc Bright copper plating from cyanide baths
US2663684A (en) * 1952-06-02 1953-12-22 Houdaille Hershey Corp Method of and composition for plating copper
BE556801A (zh) * 1956-04-19
NL217034A (zh) * 1956-06-15
US2914535A (en) * 1956-12-31 1959-11-24 Monsanto Chemicals 5-carbalkoxy-4-alkyl-2-thiazole-sulfenamides

Also Published As

Publication number Publication date
DE1225938B (de) 1966-09-29
US3161575A (en) 1964-12-15
NL267368A (zh)
GB939997A (en) 1963-10-16

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