NL122607C - - Google Patents
Info
- Publication number
- NL122607C NL122607C NL122607DA NL122607C NL 122607 C NL122607 C NL 122607C NL 122607D A NL122607D A NL 122607DA NL 122607 C NL122607 C NL 122607C
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
- H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
- H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/012—Bonding, e.g. electrostatic for strain gauges
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2686961 | 1961-07-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL122607C true NL122607C (fr) | 1900-01-01 |
Family
ID=12205283
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL281360D NL281360A (fr) | 1961-07-26 | ||
NL122607D NL122607C (fr) | 1961-07-26 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL281360D NL281360A (fr) | 1961-07-26 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3239908A (fr) |
DE (1) | DE1193169B (fr) |
NL (2) | NL122607C (fr) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3320485A (en) * | 1964-03-30 | 1967-05-16 | Trw Inc | Dielectric isolation for monolithic circuit |
US3393349A (en) * | 1964-04-30 | 1968-07-16 | Motorola Inc | Intergrated circuits having isolated islands with a plurality of semiconductor devices in each island |
US3383760A (en) * | 1965-08-09 | 1968-05-21 | Rca Corp | Method of making semiconductor devices |
DE1230915B (de) * | 1965-03-26 | 1966-12-22 | Siemens Ag | Verfahren zum Herstellen von integrierten Halbleiterbauelementen |
US3355636A (en) * | 1965-06-29 | 1967-11-28 | Rca Corp | High power, high frequency transistor |
US3387193A (en) * | 1966-03-24 | 1968-06-04 | Mallory & Co Inc P R | Diffused resistor for an integrated circuit |
JPS6051700A (ja) * | 1983-08-31 | 1985-03-23 | Toshiba Corp | シリコン結晶体の接合方法 |
EP0161740B1 (fr) * | 1984-05-09 | 1991-06-12 | Kabushiki Kaisha Toshiba | Procédé pour la formation d'un substrat semi-conducteur |
US4649627A (en) * | 1984-06-28 | 1987-03-17 | International Business Machines Corporation | Method of fabricating silicon-on-insulator transistors with a shared element |
JPS6173345A (ja) * | 1984-09-19 | 1986-04-15 | Toshiba Corp | 半導体装置 |
JPH0770474B2 (ja) * | 1985-02-08 | 1995-07-31 | 株式会社東芝 | 化合物半導体装置の製造方法 |
JP2559700B2 (ja) * | 1986-03-18 | 1996-12-04 | 富士通株式会社 | 半導体装置の製造方法 |
US4704785A (en) * | 1986-08-01 | 1987-11-10 | Texas Instruments Incorporated | Process for making a buried conductor by fusing two wafers |
US5266135A (en) * | 1990-02-07 | 1993-11-30 | Harris Corporation | Wafer bonding process employing liquid oxidant |
DE69114531T2 (de) * | 1990-02-07 | 1996-04-25 | Harris Corp | Löten von Wafern unter Verwendung von eingeschlossenem oxydierendem Dampf. |
US5747857A (en) * | 1991-03-13 | 1998-05-05 | Matsushita Electric Industrial Co., Ltd. | Electronic components having high-frequency elements and methods of manufacture therefor |
US5668057A (en) * | 1991-03-13 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | Methods of manufacture for electronic components having high-frequency elements |
US6909146B1 (en) | 1992-02-12 | 2005-06-21 | Intersil Corporation | Bonded wafer with metal silicidation |
JPH06291587A (ja) * | 1992-07-08 | 1994-10-18 | Matsushita Electric Ind Co Ltd | 圧電振動子 |
JPH06350371A (ja) * | 1993-06-10 | 1994-12-22 | Matsushita Electric Ind Co Ltd | 圧電デバイスの製造方法 |
US5521434A (en) * | 1994-10-17 | 1996-05-28 | International Business Machines Corporation | Semiconductor chip and electronic module with integrated surface interconnects/components |
US6525335B1 (en) | 2000-11-06 | 2003-02-25 | Lumileds Lighting, U.S., Llc | Light emitting semiconductor devices including wafer bonded heterostructures |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2996799A (en) * | 1953-05-21 | 1961-08-22 | Hans Sickinger | Method of manufacturing multi-layered tube |
NL219101A (fr) * | 1956-10-31 | 1900-01-01 | ||
US2995686A (en) * | 1959-03-02 | 1961-08-08 | Sylvania Electric Prod | Microelectronic circuit module |
US2990500A (en) * | 1959-03-16 | 1961-06-27 | Square D Co | Electronic module |
US3050843A (en) * | 1959-04-15 | 1962-08-28 | Bell Telephone Labor Inc | Method of bonding metallic members |
US3091849A (en) * | 1959-09-14 | 1963-06-04 | Pacific Semiconductors Inc | Method of bonding materials |
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0
- NL NL281360D patent/NL281360A/xx unknown
- NL NL122607D patent/NL122607C/xx active
-
1962
- 1962-05-30 DE DEN21646A patent/DE1193169B/de active Pending
- 1962-07-03 US US207242A patent/US3239908A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
NL281360A (fr) | 1900-01-01 |
US3239908A (en) | 1966-03-15 |
DE1193169B (de) | 1965-05-20 |