NL120008C - - Google Patents
Info
- Publication number
- NL120008C NL120008C NL120008DA NL120008C NL 120008 C NL120008 C NL 120008C NL 120008D A NL120008D A NL 120008DA NL 120008 C NL120008 C NL 120008C
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81355259A | 1959-05-15 | 1959-05-15 | |
| US43699A US3199000A (en) | 1959-05-15 | 1960-07-11 | Mount for semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL120008C true NL120008C (pt) |
Family
ID=26720738
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL266908D NL266908A (pt) | 1959-05-15 | ||
| NL120008D NL120008C (pt) | 1959-05-15 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL266908D NL266908A (pt) | 1959-05-15 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3199000A (pt) |
| CH (1) | CH393544A (pt) |
| DE (1) | DE1280419B (pt) |
| NL (2) | NL120008C (pt) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL129350C (pt) * | 1962-12-26 | |||
| US3268779A (en) * | 1963-11-06 | 1966-08-23 | Int Rectifier Corp | Hermetically sealed semiconductor device |
| US3524350A (en) * | 1969-01-27 | 1970-08-18 | Hartley Gove Sons Inc | Card-mounted thermometer and method of making the same |
| US3918625A (en) * | 1974-10-03 | 1975-11-11 | Nippert Co | Method of making a double extruded semiconductor joint |
| US4192063A (en) * | 1975-12-10 | 1980-03-11 | Yoshio Sato | Method for manufacturing a base of a semi-conductor device |
| JPS5271176A (en) * | 1975-12-11 | 1977-06-14 | Sato Tokuo | Method of manufacturing base for pressure contact type semiconductor |
| US4049185A (en) * | 1977-03-11 | 1977-09-20 | The Nippert Company | Method of forming double extruded mount |
| US4149310A (en) * | 1978-03-27 | 1979-04-17 | The Nippert Company | Method of making a heat sink mounting |
| US4193445A (en) * | 1978-06-29 | 1980-03-18 | International Business Machines Corporation | Conduction cooled module |
| US4206896A (en) * | 1978-11-28 | 1980-06-10 | Cadillac John G | Mount for a power rescue tool |
| US4285003A (en) * | 1979-03-19 | 1981-08-18 | Motorola, Inc. | Lower cost semiconductor package with good thermal properties |
| JP3971296B2 (ja) * | 2002-12-27 | 2007-09-05 | Ｄｏｗａホールディングス株式会社 | 金属−セラミックス接合基板およびその製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2707252A (en) * | 1955-04-26 | Metal rectifier assemblies | ||
| US2754393A (en) * | 1952-02-14 | 1956-07-10 | Koldweld Corp | Electrical contact and method of making same |
| CH170577A (de) * | 1933-09-01 | 1934-07-15 | Rau Fa G | Verfahren zur Herstellung von Nieten für Kontaktzwecke. |
| DE682313C (de) * | 1937-05-01 | 1939-10-12 | Fr Kammerer A G | Verfahren zur Herstellung von Kontaktnieten mit an der Kontaktstelle verdickter Auflage aus edlerem Metall |
| US2320993A (en) * | 1941-01-31 | 1943-06-08 | Taylor Instr Compagnies | Thermometer construction |
| US2471663A (en) * | 1944-11-13 | 1949-05-31 | Int Nickel Co | Method for producing cladded metal cooking utensils |
| US2473371A (en) * | 1945-12-29 | 1949-06-14 | Mallory & Co Inc P R | Method of making contacts |
| US2549424A (en) * | 1947-03-29 | 1951-04-17 | Rca Corp | Filter element useful in radio circuits |
| US2667526A (en) * | 1951-08-29 | 1954-01-26 | Max J Stumbock | Method of making nickel-cadmium batteries |
| US2739369A (en) * | 1952-03-28 | 1956-03-27 | Metals & Controls Corp | Method of making electrical contacts |
| US2726357A (en) * | 1952-10-22 | 1955-12-06 | Columbia Broadcasting Syst Inc | Semiconductor device |
| US2817797A (en) * | 1953-11-23 | 1957-12-24 | United Carr Fastener Corp | Rectifier |
| NL101591C (pt) * | 1956-03-22 | |||
| NL217849A (pt) * | 1956-06-12 | |||
| US2834102A (en) * | 1956-09-28 | 1958-05-13 | Metals & Controls Corp | Solid-phase bonding of metals |
| US2964830A (en) * | 1957-01-31 | 1960-12-20 | Westinghouse Electric Corp | Silicon semiconductor devices |
| US2922092A (en) * | 1957-05-09 | 1960-01-19 | Westinghouse Electric Corp | Base contact members for semiconductor devices |
| US2864980A (en) * | 1957-06-10 | 1958-12-16 | Gen Electric | Sealed current rectifier |
| FR1258800A (fr) * | 1959-06-10 | 1961-04-14 | Philips Nv | Procédé de fabrication de dispositifs à semi-conducteurs |
-
0
- NL NL266908D patent/NL266908A/xx unknown
- NL NL120008D patent/NL120008C/xx active
-
1960
- 1960-07-11 US US43699A patent/US3199000A/en not_active Expired - Lifetime
-
1961
- 1961-07-07 DE DEN20301A patent/DE1280419B/de active Pending
- 1961-07-11 CH CH810161A patent/CH393544A/de unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1280419B (de) | 1968-10-17 |
| CH393544A (de) | 1965-06-15 |
| US3199000A (en) | 1965-08-03 |
| NL266908A (pt) |