NL110454C - - Google Patents
Info
- Publication number
- NL110454C NL110454C NL110454DA NL110454C NL 110454 C NL110454 C NL 110454C NL 110454D A NL110454D A NL 110454DA NL 110454 C NL110454 C NL 110454C
- Authority
- NL
- Netherlands
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DED27038A DE1055912B (de) | 1957-12-17 | 1957-12-17 | Saure galvanische Kupferbaeder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL110454C true NL110454C (xx) |
Family
ID=7039098
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL110454D NL110454C (xx) | 1957-12-17 | ||
| NL234197D NL234197A (xx) | 1957-12-17 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL234197D NL234197A (xx) | 1957-12-17 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US2950235A (xx) |
| BE (1) | BE572186A (xx) |
| CH (1) | CH369948A (xx) |
| DE (1) | DE1055912B (xx) |
| FR (1) | FR1208880A (xx) |
| GB (1) | GB857409A (xx) |
| NL (2) | NL234197A (xx) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL238490A (xx) * | 1958-04-26 | |||
| DE1133610B (de) * | 1959-06-06 | 1962-07-19 | Dehydag Gmbh | Saure galvanische Kupferbaeder |
| DE1184172B (de) * | 1961-08-31 | 1964-12-23 | Dehydag Gmbh | Verfahren zum galvanischen Abscheiden festhaftender und hochglaenzender Kupferueberzuege |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| JP5952093B2 (ja) * | 2012-05-31 | 2016-07-13 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| CN114277413A (zh) * | 2021-12-29 | 2022-04-05 | 广东利尔化学有限公司 | 一种用于电路板的铜镀敷液 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE556462A (xx) * | 1956-06-15 |
-
0
- NL NL110454D patent/NL110454C/xx active
- NL NL234197D patent/NL234197A/xx unknown
- BE BE572186D patent/BE572186A/xx unknown
-
1957
- 1957-12-17 DE DED27038A patent/DE1055912B/de active Pending
-
1958
- 1958-09-18 CH CH6407658A patent/CH369948A/de unknown
- 1958-10-29 GB GB34608/58A patent/GB857409A/en not_active Expired
- 1958-11-26 FR FR1208880D patent/FR1208880A/fr not_active Expired
- 1958-12-04 US US778075A patent/US2950235A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CH369948A (de) | 1963-06-15 |
| FR1208880A (fr) | 1960-02-26 |
| GB857409A (en) | 1960-12-29 |
| DE1055912B (de) | 1959-04-23 |
| US2950235A (en) | 1960-08-23 |
| NL234197A (xx) | |
| BE572186A (xx) |