MY8600010A - Etching composition and process - Google Patents

Etching composition and process

Info

Publication number
MY8600010A
MY8600010A MY10/86A MY8600010A MY8600010A MY 8600010 A MY8600010 A MY 8600010A MY 10/86 A MY10/86 A MY 10/86A MY 8600010 A MY8600010 A MY 8600010A MY 8600010 A MY8600010 A MY 8600010A
Authority
MY
Malaysia
Prior art keywords
etching composition
etching
composition
Prior art date
Application number
MY10/86A
Other languages
English (en)
Inventor
Philip David Readio
John Leslie Hugh Allan
Original Assignee
Dart Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dart Ind Inc filed Critical Dart Ind Inc
Publication of MY8600010A publication Critical patent/MY8600010A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacture And Refinement Of Metals (AREA)
MY10/86A 1977-11-08 1986-12-30 Etching composition and process MY8600010A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/849,574 US4141850A (en) 1977-11-08 1977-11-08 Dissolution of metals

Publications (1)

Publication Number Publication Date
MY8600010A true MY8600010A (en) 1986-12-31

Family

ID=25306033

Family Applications (1)

Application Number Title Priority Date Filing Date
MY10/86A MY8600010A (en) 1977-11-08 1986-12-30 Etching composition and process

Country Status (11)

Country Link
US (1) US4141850A (xx)
JP (1) JPS5468740A (xx)
CA (1) CA1136026A (xx)
CH (1) CH642676A5 (xx)
DE (1) DE2848453C2 (xx)
FR (1) FR2407975A1 (xx)
GB (1) GB2007165B (xx)
IT (1) IT1100466B (xx)
MX (1) MX149715A (xx)
MY (1) MY8600010A (xx)
NL (1) NL7811108A (xx)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4140772A (en) * 1978-02-21 1979-02-20 Dart Industries Inc. Stabilized hydrogen peroxide solutions
JPS5841102U (ja) * 1981-09-10 1983-03-18 株式会社クボタ 耕起砕土用走行作業機
JPS5841101U (ja) * 1981-09-10 1983-03-18 株式会社クボタ 前装用ロ−タリ装置
US4437932A (en) * 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals utilizing a furan derivative
US4437931A (en) 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals
US4522683A (en) * 1984-01-12 1985-06-11 Plastic Specialties And Technologies, Inc. Dissolution of metals utilizing tungsten-diol combinations
US4510018A (en) * 1984-02-21 1985-04-09 The Lea Manufacturing Company Solution and process for treating copper and copper alloys
US4695348A (en) * 1986-09-15 1987-09-22 Psi Star Copper etching process and product
US4850729A (en) * 1987-04-07 1989-07-25 David N. Kramer Decontaminating composition and delivery system therefor
US4880495A (en) * 1987-04-13 1989-11-14 The Harshaw Chemical Company Regeneration of copper etch bath
US4875972A (en) * 1988-07-27 1989-10-24 E. I. Du Pont De Nemours And Company Hydrogen peroxide compositions containing a substituted oxybenzene compound
US4915781A (en) * 1988-07-27 1990-04-10 E. I. Du Pont De Nemours And Company Stabilized hydrogen peroxide compositions
US4875973A (en) * 1988-07-27 1989-10-24 E. I. Du Pont De Nemours And Company Hydrogen peroxide compositions containing a substituted aminobenzaldehyde
US5248752A (en) * 1991-11-12 1993-09-28 Union Carbide Chemicals & Plastics Technology Corporation Polyurethane (meth)acrylates and processes for preparing same
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
WO2001004231A1 (en) * 1999-07-13 2001-01-18 Kao Corporation Polishing liquid composition
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
KR102421116B1 (ko) * 2017-06-22 2022-07-15 삼성디스플레이 주식회사 식각액 조성물 및 식각액 조성물을 이용한 배선 형성 방법
US11678433B2 (en) 2018-09-06 2023-06-13 D-Wave Systems Inc. Printed circuit board assembly for edge-coupling to an integrated circuit
US11647590B2 (en) 2019-06-18 2023-05-09 D-Wave Systems Inc. Systems and methods for etching of metals
US12033996B2 (en) 2019-09-23 2024-07-09 1372934 B.C. Ltd. Systems and methods for assembling processor systems

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556883A (en) * 1967-07-21 1971-01-19 Mitsubishi Edogawa Kagaku Kk Method for chemically polishing copper or copper alloy
FR1539960A (fr) * 1967-08-11 1968-09-20 Mitsubishi Edogawa Kagaku Kk Procédé de polissage du cuivre ou des alliages de cuivre
US3597290A (en) * 1968-03-25 1971-08-03 Mitsubishi Edogawa Kagaku Kk Method for chemically dissolving metal
BE791457A (fr) * 1971-11-18 1973-05-16 Du Pont Solutions acides stabilisees d'eau oxygenee
US3869401A (en) * 1972-12-04 1975-03-04 Du Pont Stabilized acidic hydrogen peroxide solutions
US3945865A (en) * 1974-07-22 1976-03-23 Dart Environment And Services Company Metal dissolution process
SE400581B (sv) * 1974-12-13 1978-04-03 Nordnero Ab Bad for kemisk polering av koppar och dess legeringar
FR2297906A1 (fr) * 1975-01-14 1976-08-13 Ugine Kuhlmann Stabilisation du peroxyde d'hydrogene dans les bains acides pour le decapage des metaux
US4048006A (en) * 1975-08-05 1977-09-13 M&T Chemicals Inc. Stripping of electroplated nickel-iron alloys
US4052254A (en) * 1975-08-05 1977-10-04 M & T Chemicals Inc. Stripping of electroplated nickel-iron alloys from ferrous substrates
SE425007B (sv) * 1976-01-05 1982-08-23 Shipley Co Stabil etslosning omfattande svavelsyra och veteperoxid samt anvendning av densamma
JPS5286933A (en) * 1976-01-14 1977-07-20 Tokai Electro Chemical Co Method of treating surface of copper and copper alloy

Also Published As

Publication number Publication date
CA1136026A (en) 1982-11-23
CH642676A5 (de) 1984-04-30
GB2007165B (en) 1982-03-24
JPS5639711B2 (xx) 1981-09-16
FR2407975B1 (xx) 1984-12-28
DE2848453C2 (de) 1987-04-23
IT7829580A0 (it) 1978-11-08
MX149715A (es) 1983-12-14
NL7811108A (nl) 1979-05-10
US4141850A (en) 1979-02-27
IT1100466B (it) 1985-09-28
FR2407975A1 (fr) 1979-06-01
GB2007165A (en) 1979-05-16
JPS5468740A (en) 1979-06-02
DE2848453A1 (de) 1979-05-17

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