MY7300355A - Interconnection system for complex semiconductor arrays - Google Patents

Interconnection system for complex semiconductor arrays

Info

Publication number
MY7300355A
MY7300355A MY7300355A MY7300355A MY7300355A MY 7300355 A MY7300355 A MY 7300355A MY 7300355 A MY7300355 A MY 7300355A MY 7300355 A MY7300355 A MY 7300355A MY 7300355 A MY7300355 A MY 7300355A
Authority
MY
Malaysia
Prior art keywords
interconnection system
complex semiconductor
semiconductor arrays
arrays
complex
Prior art date
Application number
MY7300355A
Other languages
English (en)
Inventor
Ernest Gerald Bylander
Original Assignee
Texas Instructions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instructions Inc filed Critical Texas Instructions Inc
Publication of MY7300355A publication Critical patent/MY7300355A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
MY7300355A 1967-06-30 1973-12-30 Interconnection system for complex semiconductor arrays MY7300355A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65049767A 1967-06-30 1967-06-30

Publications (1)

Publication Number Publication Date
MY7300355A true MY7300355A (en) 1973-12-31

Family

ID=24609171

Family Applications (1)

Application Number Title Priority Date Filing Date
MY7300355A MY7300355A (en) 1967-06-30 1973-12-30 Interconnection system for complex semiconductor arrays

Country Status (5)

Country Link
US (1) US3474297A (https=)
FR (1) FR1571222A (https=)
GB (1) GB1225668A (https=)
MY (1) MY7300355A (https=)
NL (1) NL6808931A (https=)

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* Cited by examiner, † Cited by third party
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GB1152809A (en) * 1968-05-07 1969-05-21 Standard Telephones Cables Ltd Electric Circuit Assembly
BE758871A (fr) * 1969-11-13 1971-05-12 Philips Nv Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
US3716846A (en) * 1970-01-24 1973-02-13 R Hafner Connector sheet with contacts on opposite sides
DE2057126C3 (de) * 1970-05-14 1975-11-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen
US3670208A (en) * 1970-07-13 1972-06-13 Logic Dynamics Inc Microelectronic package, buss strip and printed circuit base assembly
US3726989A (en) * 1970-07-27 1973-04-10 Hughes Aircraft Co Circuit module providing high density interconnections
US3762040A (en) * 1971-10-06 1973-10-02 Western Electric Co Method of forming circuit crossovers
FR2164501A1 (en) * 1971-12-23 1973-08-03 Radiotechnique Compelec Insulation of semiconductors - enveloped between polymer film and a flexible strip with conductive contact strips
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
NL7204575A (https=) * 1972-04-06 1973-10-09
US3967296A (en) * 1972-10-12 1976-06-29 General Electric Company Semiconductor devices
US3912852A (en) * 1974-05-31 1975-10-14 Westinghouse Electric Corp Thin-film electrical circuit lead connection arrangement
JPS5116876A (ja) * 1974-07-31 1976-02-10 Sharp Kk Handotaisochi
US4044397A (en) * 1976-08-12 1977-08-23 The United States Of America As Represented By The Secretary Of The Air Force Integrated circuit wiring bridge apparatus
JPS5326867U (https=) * 1976-08-16 1978-03-07
JPS58301Y2 (ja) * 1977-10-06 1983-01-06 旭光学工業株式会社 多層フレキシブル基板
US4164071A (en) * 1977-12-27 1979-08-14 Ford Motor Company Method of forming a circuit board with integral terminals
JPS5396969U (https=) * 1978-01-10 1978-08-07
US4254445A (en) * 1979-05-07 1981-03-03 International Business Machines Corporation Discretionary fly wire chip interconnection
US4518661A (en) * 1982-09-28 1985-05-21 Rippere Ralph E Consolidation of wires by chemical deposition and products resulting therefrom
IT1212711B (it) * 1983-03-09 1989-11-30 Ates Componenti Elettron Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
US4677528A (en) * 1984-05-31 1987-06-30 Motorola, Inc. Flexible printed circuit board having integrated circuit die or the like affixed thereto
US4767227A (en) * 1985-01-25 1988-08-30 Seiko Epson Corporation Print wire driving device for wire type dot printer
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4717988A (en) * 1986-05-05 1988-01-05 Itt Defense Communications Division Of Itt Corporation Universal wafer scale assembly
IT1218104B (it) * 1986-06-27 1990-04-12 Sgs Microelettronica Spa Metodo di progettazione di microcalcolatori integrati e microcalcolatore integrato a struttura modulare ottenuto con il metodo suddetto
GB8706857D0 (en) * 1987-03-23 1987-04-29 Bradley International Ltd Alle Chip carriers
US5679977A (en) * 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US6378199B1 (en) 1994-05-13 2002-04-30 Dai Nippon Printing Co., Ltd. Multi-layer printed-wiring board process for producing
JP3185540B2 (ja) * 1994-06-10 2001-07-11 松下電器産業株式会社 半導体集積回路
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6552343B1 (en) * 2000-05-18 2003-04-22 Telasic Communications, Inc. Unit cell with fan-out for large focal plane arrays with small detector pitch
DE102005053398B4 (de) * 2005-11-09 2008-12-24 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul
US8792161B2 (en) * 2007-02-21 2014-07-29 Globalfoundries Inc. Optical polarizer with nanotube array
US20150237722A1 (en) * 2014-02-20 2015-08-20 Ruey-Jen Hwu Anode Array

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3248779A (en) * 1963-11-15 1966-05-03 Leonard J Yuska Method of making an electronic module
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3381372A (en) * 1966-07-13 1968-05-07 Sperry Rand Corp Method of electrically connecting and hermetically sealing packages for microelectronic circuits

Also Published As

Publication number Publication date
NL6808931A (https=) 1968-12-31
DE1764534A1 (de) 1971-08-05
GB1225668A (https=) 1971-03-17
US3474297A (en) 1969-10-21
FR1571222A (https=) 1969-06-13
DE1764534B2 (de) 1977-07-07

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