MY205166A - Dressing board and dressing method for cutting blade - Google Patents

Dressing board and dressing method for cutting blade

Info

Publication number
MY205166A
MY205166A MYPI2020003627A MYPI2020003627A MY205166A MY 205166 A MY205166 A MY 205166A MY PI2020003627 A MYPI2020003627 A MY PI2020003627A MY PI2020003627 A MYPI2020003627 A MY PI2020003627A MY 205166 A MY205166 A MY 205166A
Authority
MY
Malaysia
Prior art keywords
dressing
cutting blade
board
substrate
cutting
Prior art date
Application number
MYPI2020003627A
Inventor
Ishii Takahiro
Tsuboi Sayo
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY205166A publication Critical patent/MY205166A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

A dressing board (11) for dressing a cutting blade (10) for cutting a workpiece being adapted to be cut by the cutting blade (10), thereby dressing the cutting blade (10). The dressing board (11) includes a substrate (13) not containing abrasive grains and a dressing member (15) provided on the substrate (13) and containing abrasive grains. The substrate (13) and the dressing member (15) come into contact with the cutting blade (10) in dressing the cutting blade (10), thereby wearing the cutting blade (10). (The most suitable drawing: Fig. 1A)
MYPI2020003627A 2019-08-06 2020-07-13 Dressing board and dressing method for cutting blade MY205166A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019144197A JP7378890B2 (en) 2019-08-06 2019-08-06 How to sharpen sharpening boards and cutting blades

Publications (1)

Publication Number Publication Date
MY205166A true MY205166A (en) 2024-10-04

Family

ID=74357490

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020003627A MY205166A (en) 2019-08-06 2020-07-13 Dressing board and dressing method for cutting blade

Country Status (6)

Country Link
JP (1) JP7378890B2 (en)
KR (1) KR102855084B1 (en)
CN (1) CN112338802B (en)
MY (1) MY205166A (en)
SG (1) SG10202006735PA (en)
TW (1) TWI830932B (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3992168B2 (en) 1998-09-17 2007-10-17 株式会社ディスコ Electrodeposition blade manufacturing method
JP2005251909A (en) * 2004-03-03 2005-09-15 Tokyo Seimitsu Co Ltd Dressing method
CN101844330A (en) * 2009-03-24 2010-09-29 宋健民 Polishing pad conditioner
JP5541657B2 (en) 2009-07-01 2014-07-09 株式会社ディスコ Sharpening board
JP2012187692A (en) * 2011-03-14 2012-10-04 Disco Corp Dressing material and dressing method
JP2012187693A (en) * 2011-03-14 2012-10-04 Disco Corp Dress material and dressing method
JP6246566B2 (en) * 2013-11-11 2017-12-13 株式会社ディスコ Dressing method
JP6967386B2 (en) * 2017-07-12 2021-11-17 株式会社ディスコ Dressing method

Also Published As

Publication number Publication date
JP7378890B2 (en) 2023-11-14
TW202107597A (en) 2021-02-16
SG10202006735PA (en) 2021-03-30
CN112338802A (en) 2021-02-09
JP2021024031A (en) 2021-02-22
KR20210018080A (en) 2021-02-17
TWI830932B (en) 2024-02-01
CN112338802B (en) 2024-07-12
KR102855084B1 (en) 2025-09-03

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