JPS5420485A - Wire cutting device - Google Patents

Wire cutting device

Info

Publication number
JPS5420485A
JPS5420485A JP8588977A JP8588977A JPS5420485A JP S5420485 A JPS5420485 A JP S5420485A JP 8588977 A JP8588977 A JP 8588977A JP 8588977 A JP8588977 A JP 8588977A JP S5420485 A JPS5420485 A JP S5420485A
Authority
JP
Japan
Prior art keywords
cutting device
wire cutting
cutting
electrode
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8588977A
Other languages
Japanese (ja)
Inventor
Kiyoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP8588977A priority Critical patent/JPS5420485A/en
Priority to DE2825868A priority patent/DE2825868C2/en
Priority to GB7826780A priority patent/GB2000069B/en
Priority to US05/915,206 priority patent/US4193852A/en
Priority to IT7849878A priority patent/IT1105210B/en
Priority to FR7817789A priority patent/FR2394360A1/en
Publication of JPS5420485A publication Critical patent/JPS5420485A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting

Abstract

PURPOSE:To perform processing such as cutting-off, cutting-out, etc., by using a moving wire electrode and by supplying electric energy between the electrode and a workpiece to cause electrospark machining, electrolytic machining or abras adrasive grain grinding.
JP8588977A 1977-06-14 1977-07-18 Wire cutting device Pending JPS5420485A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP8588977A JPS5420485A (en) 1977-07-18 1977-07-18 Wire cutting device
DE2825868A DE2825868C2 (en) 1977-06-14 1978-06-13 Machining device with a multi-guided running wire electrode
GB7826780A GB2000069B (en) 1977-06-14 1978-06-13 Improvements relating to electrical machining
US05/915,206 US4193852A (en) 1977-06-14 1978-06-13 Method and apparatus for electrical machining with a multi-guided travelling electrode
IT7849878A IT1105210B (en) 1977-06-14 1978-06-14 EQUIPMENT FOR ELECTRICAL PROCESSING WITH A MOBILE MULTIPLE GUIDE ELECTRODE
FR7817789A FR2394360A1 (en) 1977-06-14 1978-06-14 ELECTRIC MACHINING APPARATUS WITH CIRCULATING MACHINING ELECTRODE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8588977A JPS5420485A (en) 1977-07-18 1977-07-18 Wire cutting device

Publications (1)

Publication Number Publication Date
JPS5420485A true JPS5420485A (en) 1979-02-15

Family

ID=13871455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8588977A Pending JPS5420485A (en) 1977-06-14 1977-07-18 Wire cutting device

Country Status (1)

Country Link
JP (1) JPS5420485A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57184632A (en) * 1981-02-13 1982-11-13 Redland Tiles Ltd Spark etching by wire electrode
JPS62193777A (en) * 1986-02-21 1987-08-25 Shinei Kogyo Kk Linear abrasive body and polishing method
JPH09193137A (en) * 1996-01-16 1997-07-29 Cree Res Inc Production of silicon carbide wafer and wafer of 4h silicon carbide
JP2007237348A (en) * 2006-03-09 2007-09-20 Mitsubishi Electric Corp Wire electric discharge machining apparatus
WO2009154199A1 (en) * 2008-06-16 2009-12-23 三菱電機株式会社 Wire discharge-working apparatus and wire discharge-working method, semiconductor wafer manufacturing apparatus and semiconductor wafer manufacturing method, and solar cell wafer manufacturing apparatus and solar cell wafer manufacturing method
WO2010010927A1 (en) * 2008-07-24 2010-01-28 三菱電機株式会社 Electrical discharge machining device, electrical discharge machining method, and semiconductor substrate manufacturing method
WO2011145390A1 (en) * 2010-05-18 2011-11-24 三菱電機株式会社 Processing object retainer, wire electric discharge processing device, thin sheet production method, and semiconductor wafer production method
JP2015047685A (en) * 2013-09-04 2015-03-16 三菱電機株式会社 Multiwire processing device and multiwire processing method
US9387548B2 (en) 2010-11-24 2016-07-12 Mitsubishi Electric Corporation Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing method
US9950379B2 (en) 2009-09-24 2018-04-24 Mitsubishi Electric Corporation Wire electric discharge machining apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4883496A (en) * 1972-02-08 1973-11-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4883496A (en) * 1972-02-08 1973-11-07

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0460768B2 (en) * 1981-02-13 1992-09-29 Redland Tiles Ltd
JPS57184632A (en) * 1981-02-13 1982-11-13 Redland Tiles Ltd Spark etching by wire electrode
JPS62193777A (en) * 1986-02-21 1987-08-25 Shinei Kogyo Kk Linear abrasive body and polishing method
JPH09193137A (en) * 1996-01-16 1997-07-29 Cree Res Inc Production of silicon carbide wafer and wafer of 4h silicon carbide
JP4513772B2 (en) * 2006-03-09 2010-07-28 三菱電機株式会社 Wire electrical discharge machine
JP2007237348A (en) * 2006-03-09 2007-09-20 Mitsubishi Electric Corp Wire electric discharge machining apparatus
US9050672B2 (en) 2008-06-16 2015-06-09 Mitsubishi Electric Corporation Wire discharge-machining apparatus with parallel cutting wires
JP5079091B2 (en) * 2008-06-16 2012-11-21 三菱電機株式会社 Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method
WO2009154199A1 (en) * 2008-06-16 2009-12-23 三菱電機株式会社 Wire discharge-working apparatus and wire discharge-working method, semiconductor wafer manufacturing apparatus and semiconductor wafer manufacturing method, and solar cell wafer manufacturing apparatus and solar cell wafer manufacturing method
US9643270B2 (en) 2008-06-16 2017-05-09 Mitsubishi Electric Corporation Wire discharge-machining apparatus with parallel cutting wires
WO2010010927A1 (en) * 2008-07-24 2010-01-28 三菱電機株式会社 Electrical discharge machining device, electrical discharge machining method, and semiconductor substrate manufacturing method
JP5165061B2 (en) * 2008-07-24 2013-03-21 三菱電機株式会社 Electric discharge machining apparatus, electric discharge machining method, and semiconductor substrate manufacturing method
US9550245B2 (en) 2008-07-24 2017-01-24 Mitsubishi Electric Corporation Electric discharge machining apparatus, electric discharge machining method, and semiconductor substrate manufacturing method
US9950379B2 (en) 2009-09-24 2018-04-24 Mitsubishi Electric Corporation Wire electric discharge machining apparatus
WO2011145390A1 (en) * 2010-05-18 2011-11-24 三菱電機株式会社 Processing object retainer, wire electric discharge processing device, thin sheet production method, and semiconductor wafer production method
US9833854B2 (en) 2010-05-18 2017-12-05 Mitsubishi Electric Corporation Workpiece retainer, wire electric discharge machining device, thin-plate manufacturing method, and semiconductor-wafer manufacturing method
US9387548B2 (en) 2010-11-24 2016-07-12 Mitsubishi Electric Corporation Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing method
JP2015047685A (en) * 2013-09-04 2015-03-16 三菱電機株式会社 Multiwire processing device and multiwire processing method

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