MY200440A - Epoxy resin composition and electronic component device - Google Patents

Epoxy resin composition and electronic component device

Info

Publication number
MY200440A
MY200440A MYPI2019005453A MYPI2019005453A MY200440A MY 200440 A MY200440 A MY 200440A MY PI2019005453 A MYPI2019005453 A MY PI2019005453A MY PI2019005453 A MYPI2019005453 A MY PI2019005453A MY 200440 A MY200440 A MY 200440A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
electronic component
component device
melting point
Prior art date
Application number
MYPI2019005453A
Inventor
Yoriko Inoue
Shinya Nakamura
Yoshinori Endo
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of MY200440A publication Critical patent/MY200440A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An epoxy resin composition includes an epoxy resin having a melting point or softening point of more than 40C, a curing agent, and a compound including a glycidyl group and having a melting point of 40C or less.
MYPI2019005453A 2017-03-31 2018-03-29 Epoxy resin composition and electronic component device MY200440A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017072889 2017-03-31
PCT/JP2018/013454 WO2018181813A1 (en) 2017-03-31 2018-03-29 Epoxy resin composition and electronic component device

Publications (1)

Publication Number Publication Date
MY200440A true MY200440A (en) 2023-12-26

Family

ID=63676421

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019005453A MY200440A (en) 2017-03-31 2018-03-29 Epoxy resin composition and electronic component device

Country Status (5)

Country Link
JP (2) JP7212830B2 (en)
CN (1) CN110461938A (en)
MY (1) MY200440A (en)
TW (1) TWI854956B (en)
WO (1) WO2018181813A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7255411B2 (en) * 2019-07-30 2023-04-11 味の素株式会社 resin composition
JP7415961B2 (en) * 2021-01-14 2024-01-17 信越化学工業株式会社 Rubber composition containing organosilicon compound

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0551435A (en) * 1991-08-23 1993-03-02 Mitsui Toatsu Chem Inc Epoxy resin composition
JPH1121426A (en) * 1997-07-02 1999-01-26 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor
JP2001131393A (en) * 1999-10-29 2001-05-15 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic part device
JP2002128868A (en) * 2000-10-24 2002-05-09 Japan Epoxy Resin Kk Epoxy resin composition for semiconductor encapsulation
JP4096806B2 (en) * 2003-05-13 2008-06-04 ジャパンエポキシレジン株式会社 Phenol resin, epoxy resin curing agent, and epoxy resin composition
JP2007031698A (en) * 2005-06-21 2007-02-08 Hitachi Chem Co Ltd Epoxy resin composition and electronic part device
MY156527A (en) * 2009-12-14 2016-02-26 Nippon Steel & Sumikin Chem Co Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product
WO2011129272A1 (en) 2010-04-13 2011-10-20 積水化学工業株式会社 Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device
TW201235402A (en) 2011-01-07 2012-09-01 Ajinomoto Kk Resin composition for release film
JP5768529B2 (en) 2011-06-24 2015-08-26 三菱化学株式会社 Interlayer filler composition for three-dimensional stacked semiconductor device and coating solution thereof
US20130026660A1 (en) * 2011-07-29 2013-01-31 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
KR101480178B1 (en) * 2011-12-20 2015-01-09 제일모직주식회사 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
CN103819870B (en) * 2012-11-16 2016-06-15 株式会社田村制作所 Resin molding, metal forming, copper-clad plate and the multilayer laminated boards substrate on compositions of thermosetting resin, B rank
KR101518502B1 (en) * 2012-12-26 2015-05-11 제일모직주식회사 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
JP6198483B2 (en) 2013-06-28 2017-09-20 太陽インキ製造株式会社 Thermosetting resin composition and printed wiring board
JP6315170B2 (en) * 2013-09-30 2018-04-25 ナガセケムテックス株式会社 Epoxy resin composition for semiconductor encapsulation, semiconductor packaging structure, and method for producing the same
JP6398824B2 (en) 2015-03-23 2018-10-03 味の素株式会社 Resin sheet
JP6555042B2 (en) 2015-09-17 2019-08-07 味の素株式会社 Granular resin composition
CN107849336B (en) * 2015-09-30 2023-11-10 积水化学工业株式会社 Resin composition and multilayer substrate
CN106398112B (en) * 2016-05-31 2019-09-13 江苏华海诚科新材料股份有限公司 A kind of composition epoxy resin suitable for ESOP encapsulation

Also Published As

Publication number Publication date
JP7485009B2 (en) 2024-05-16
TWI854956B (en) 2024-09-11
CN110461938A (en) 2019-11-15
JP7212830B2 (en) 2023-01-26
WO2018181813A1 (en) 2018-10-04
JP2023030182A (en) 2023-03-07
JPWO2018181813A1 (en) 2020-02-06
TW201842052A (en) 2018-12-01

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