JP5768529B2 - Interlayer filler composition for three-dimensional stacked semiconductor device and coating solution thereof - Google Patents

Description

  The present invention relates to an interlayer filler composition for a semiconductor device and a coating solution thereof. More specifically, the present invention relates to an interlayer filler composition for a three-dimensional stacked semiconductor device, a coating liquid containing the composition, a cured product of the composition, and a three-dimensional stacked semiconductor device using these.

  In recent years, in order to improve the performance of semiconductor devices such as higher speed and higher capacity, in addition to miniaturization of transistors and wiring, the performance has been improved by three-dimensional stacking (3D) by stacking two or more semiconductor chips. Research and development is underway.

  Specifically, after the semiconductor chips are stacked, an underfill process in which an interlayer filler is poured between the substrates, a thin coating film of the interlayer filler composition is formed on the wafer, a B stage is formed, and then the semiconductor chip is diced. A process is proposed in which a laminated body is obtained by temporary bonding using this semiconductor chip, and finally a main bonding (solder bonding) is performed under pressure and heating conditions to form a three-dimensional stacked semiconductor device. (See Non-Patent Documents 1 and 2).

  Various problems have been pointed out for the practical application of such a three-dimensional stacked semiconductor device. One of them is a problem of heat dissipation from heat generated by devices such as transistors and wiring. This heat generation is accumulated in the device because the thermal conductivity of the interlayer filler is very low compared to metals, ceramics, etc., and there is concern that this heat storage will cause malfunction and damage of the three-dimensional stacked semiconductor device. Yes.

One technique for solving this problem is to increase the thermal conductivity of the interlayer filler. In particular, for epoxy resin systems that are often used as interlayer fillers, inventions of highly heat-conductive composite materials have been disclosed so far. However, many of them are aimed at optimizing the composition of a composition containing a highly heat-conductive filler rather than the heat conductivity of the epoxy resin itself as a matrix.
For example, in Patent Documents 1 and 2, an inorganic compound powder or fiber having high thermal conductivity is blended as a high thermal conductive filler, and an epoxy resin having a very high molecular weight is used as a general bisphenol A type epoxy resin. It does not mention the thermal conductivity of the epoxy resin itself. That is, in Patent Documents 1 and 2, the thermal conductivity is borne by the filler, and the epoxy resin only provides ease of handling as a film.
Further, Patent Document 3 characterizes the shape of the filler, and Patent Document 4 improves the decrease in adhesion and the like due to the blending of the filler by blending a high molecular weight resin compatible with the epoxy resin or a reactive high molecular weight resin. The epoxy resins that are used are very common novolac and bisphenol A type epoxy resins.

On the other hand, recently, several inventions have been disclosed that attempt to improve the thermal conductivity of the epoxy resin itself by introducing a mesogenic skeleton. For example, a resin composition having high thermal conductivity due to an epoxy resin containing a mesogen and a curing agent has been reported (see Patent Documents 5 and 6).
However, although the conventionally proposed epoxy resin composition having a mesogen skeleton is excellent in thermal conductivity, it has been difficult to apply to a manufacturing process of a three-dimensional stacked semiconductor device such as coating property and bonding property. . For example, with respect to the viscosity of the interlayer filler at the time of soldering, the viscosity is 0.3 to 80 Pa · s at 150 ° C., so that the fine pitch surface electrodes (bumps) of the semiconductor chip without biting the interlayer filler And the land of the substrate can be in contact with each other (Patent Document 7). However, epoxy resins containing mesogens tend to have a high viscosity or a high melting point, and it has been difficult to achieve a low viscosity at the time of joining.
That is, an interlayer filler composition having high thermal conductivity while satisfying the manufacturing process suitability of a three-dimensional stacked semiconductor device has not been provided so far.

Japanese Patent Laid-Open No. 04-339815 Japanese Patent Laid-Open No. 04-339854 Japanese Patent Laid-Open No. 05-259312 Japanese Patent Laid-Open No. 10-183086 JP 2010-001427 A Japanese Patent No. 4118691 JP 2003-258034 A

“Electronics Package Technology (CMC Technical Library)”, CM Publishing (2003), p. 102 Proceedings of the 23rd Electronics Packaging Society Conference, Japan Institute of Electronics Packaging (2009), p. 61

  The present invention has been made in view of the above problems, and an object of the present invention is to adapt to a manufacturing process of a three-dimensional stacked semiconductor device, that is, film forming property, B stage film forming property, and bonding time. It is to provide an interlayer filler composition having low meltability and the like and having an excellent balance of performance such as thermal conductivity and heat resistance. Another object of the present invention is to provide a coating solution containing the interlayer insulating filler composition, a cured product of the interlayer insulating filler composition, and a three-dimensional stacked semiconductor device using the interlayer insulating filler composition. A production method and a three-dimensional stacked semiconductor device containing a cured product of the interlayer insulating filler composition.

  As a result of intensive studies to solve the above problems, the present inventor has found that the following invention can solve the above problems, and has completed the present invention.

That is, the gist of the present invention is as follows.
<1> An epoxy resin (A) composed of a bifunctional epoxy resin (X) having a biphenyl skeleton having an epoxy equivalent of 2500 g / equivalent or more and a biphenol compound (Y ), and an epoxy having an epoxy equivalent of 400 g / equivalent or less An interlayer filler composition for a three-dimensional stacked semiconductor device, comprising at least a resin (B).
<2> The interlayer filler composition for a three-dimensional stacked semiconductor device according to <1>, wherein the biphenyl skeleton contained in the bifunctional epoxy resin (X) and the biphenol compound (Y) is not unsubstituted at the same time .
<3> The interlayer filler composition for a three-dimensional stacked semiconductor device according to <1> or <2>, wherein the proportion of the epoxy resin (A) in the total epoxy resin is 2% by weight or more and 40% by weight or less object.
<4> Further including a curing agent (C), and the content of the curing agent (C) is 0.01 parts by weight or more and 200 parts by weight or less per 100 parts by weight of the total epoxy resin. > An interlayer filler composition for a three-dimensional stacked semiconductor device according to any one of the above.
<5> The interlayer filler composition for a three-dimensional stacked semiconductor device according to any one of <1> to <4>, further including an inorganic filler (D).
<6> An interlayer filler composition coating solution for a three-dimensional stacked semiconductor device, further comprising an organic solvent (E) in the composition according to any one of <1> to <5>.
<7> A cured interlayer filler for a three-dimensional stacked semiconductor device obtained by curing the composition according to any one of <1> to < 5 >.
<8> A method for producing a three-dimensional stacked semiconductor device using the interlayer filler composition coating liquid according to <6>.
<9> A three-dimensional stacked semiconductor device using the cured interlayer filler according to <7>.

  The present invention provides an interlayer filler composition that is excellent in adaptability to a manufacturing process of a three-dimensional stacked semiconductor device and excellent in performance balance such as thermal conductivity and heat resistance. Further, according to the present invention, a coating liquid containing the interlayer filler composition, a cured product of the interlayer filler composition, a method for producing a three-dimensional stacked semiconductor device using the interlayer filler composition, and A three-dimensional stacked semiconductor device containing a cured product of the layer filler composition is provided.

  Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to the following embodiments, and various modifications can be made within the scope of the gist of the present invention.

In the present invention, first, an interlayer filling for a three-dimensional stacked semiconductor device comprising at least an epoxy resin (A) having an epoxy equivalent of 2500 g / equivalent or more and an epoxy resin (B) having an epoxy equivalent of 400 g / equivalent or less. This relates to a material composition (hereinafter sometimes simply referred to as “interlayer filler composition”).
Here, the three-dimensional integrated semiconductor device of the present invention is a semiconductor chip stacked body in which at least two semiconductor chips on which semiconductor device layers are formed are stacked. Each semiconductor chip is provided with a through electrode (TSV), and TSVs are connected between the semiconductor chips via bumps. An interlayer filler (interlayer filler composition) is used between the layers of the laminate.

As described above, as a process for forming a three-dimensional stacked semiconductor device, after forming a coating thin film of an interlayer filler composition on a wafer, a B-stage is formed, and then a semiconductor chip is cut out by dicing. There has been proposed a process in which a laminate is obtained by temporary bonding using, and finally main bonding (solder bonding) is performed under pressure and heating conditions.
In order to adapt to this process, the interlayer filler composition is required to have film formability, B stage film formability, temporary adhesion, low melt viscosity at high temperature heating, and the like.
The epoxy resin (A) of the present invention and the interlayer filler composition containing the epoxy resin (B) are suitable for the required performance, and further, the curing agent (C) and the inorganic filler (D). It can be set as a more optimal interlayer filler composition by containing.

[Interlayer filler composition]
First, components (A) to (D) of the interlayer filler composition of the present invention (hereinafter sometimes simply referred to as “composition”) will be described.

[Epoxy resin (A)]
The epoxy resin (A) constituting the interlayer filler composition of the present invention is an epoxy resin having a structure represented by the following formula (1) and having an epoxy equivalent of 2500 g / equivalent or more.

（式（１）中、Ａは下記式（２）で表わされるビフェニル骨格であり、Ｂは水素原子又は下記式（３）であり、ｎは繰り返し数であり、平均値は１０＜ｎ＜５０である。）

（式（２）中、Ｒ¹は、水素原子、炭素数１〜１０の炭化水素基、又はハロゲン原子であり、互いに同一であっても異なっていてもよい。）

(In the formula (1), A is a biphenyl skeleton represented by the following formula (2), B is a hydrogen atom or the following formula (3), n is the number of repetitions, and the average value is 10 <n <50. .)

(In the formula (2), R ¹ is a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, or a halogen atom, may be the same or different from each other.)

The epoxy resin (A) is an epoxy resin that includes a biphenyl skeleton and has an excellent balance of extensibility, thermal conductivity, heat resistance, and the like.
The epoxy resin (A) can increase the thermal conductivity of the cured product by adding a desired amount as an epoxy resin component, and is derived from the extensibility of the epoxy resin (A), resulting in low stress to the material. Therefore, it is possible to provide the interlayer filler composition of the present invention capable of satisfying both the required physical properties of the product and high thermal conductivity.

Although the details of the reason why the epoxy resin (A) is excellent in elongation are not clear, it has a molecular chain length that can withstand stretching when subjected to tensile stress, and in order to relieve the stress, overlapping biphenyl This is presumably because the skeletons can “slide”. In addition, at this time, if the crystallinity is too high, it is brittle and breaks without elongation. Therefore, it is important to have an appropriate amorphous portion. In the epoxy resin of the present invention, the biphenyl skeleton is substituted. By having a group, the crystallinity can be reduced moderately, which is considered to lead to the expression of elongation. Therefore, from the viewpoint of elongation, it is preferable that not all R ¹ in the formula (2) are hydrogen atoms but one or more R ¹ is a hydrocarbon group or a halogen atom.

Thermal conduction is governed by phonons and conduction electrons, and when there are free electrons like metal, the contribution of conduction electrons is large, but epoxy resin is generally an insulator, and phonons are the main heat conduction in insulators. Is a factor. Since heat conduction by phonons is propagation of vibration energy, vibrations are less likely to attenuate, and the harder the material, the better the heat conductivity.
The details of the reason why the epoxy resin (A) is excellent in thermal conductivity are not clear, but since all the skeletons are biphenyl skeletons, the degree of freedom of the structure is small, vibration energy is difficult to attenuate, and the biphenyl skeleton is flat. It is presumed that this is due to the good overlap between molecules and the ability to restrain molecular motion more.

  Epoxy resins generally tend to have better heat resistance when crystallinity is better, and if the epoxy resin has the same structure, the higher the molecular weight or epoxy equivalent of the resin, the better the heat resistance. The epoxy resin (A) is excellent in heat resistance by having appropriate crystallinity and a high epoxy equivalent.

  In said Formula (1), n is a repeating number and is an average value. The range of the value is 10 <n <50, but the range of n is preferably 15 <n <50, especially 20 <n <40, from the balance of both elongation and resin handling. It is preferable. When n in the formula (1) is 10 or less, the elongation of the composition of the present invention becomes insufficient, and when it is 50 or more, the viscosity of the composition of the present invention including the epoxy resin (A) increases, and handling Tend to be difficult.

In the formula (1), A is a biphenyl skeleton represented by the formula (2). In the formula (2), R ^{1 s} may be the same as or different from each other, and may be a hydrogen atom, carbon Represents a hydrocarbon group having 1 to 10 carbon atoms or a halogen atom, but one epoxy resin includes both a hydrogen atom and a hydrocarbon group having 1 to 10 carbon atoms as R ¹ It is preferable from the viewpoint of the whole crystallinity and handling. When R ¹ is the same, the crystallinity becomes high and the thermal conductivity can be increased, but when the crystallinity is too high, the elongation when the composition is formed into a film tends to be small.

When R ¹ in the formula (2) is a hydrocarbon group having 1 to 10 carbon atoms, R ¹ is preferably an alkyl group having 1 to 4 carbon atoms, particularly preferably a methyl group.
The hydrocarbon group for R ¹ may have a substituent, and the substituent is not particularly limited, but has a molecular weight of 200 or less.
Further, the halogen atom of R ^1, a fluorine atom, a chlorine atom, refers to bromine atom, it may include a plurality of kinds in only one kind.

The biphenyl skeleton of A is 2,2′-biphenyl skeleton, 2,3′-biphenyl skeleton, 2,4′-biphenyl skeleton, 3,3-biphenyl skeleton, 3,4′-biphenyl skeleton, 4,4′- Any of the biphenyl skeletons may be used, but a 4,4′-biphenyl skeleton is preferred.
R ¹ preferably has a hydrogen atom at the 2-position and / or 6-position, and preferably has a hydrocarbon group at the 3-position and / or 5-position.

It is essential that the epoxy equivalent of the epoxy resin (A) is 2,500 g / equivalent or more. When the epoxy equivalent of the epoxy resin (A) is less than 2,500 g / equivalent, the composition of the present invention cannot obtain sufficient elongation and is difficult to apply to a process such as film molding / coating. Become.
From the viewpoint of extensibility, the epoxy equivalent of the epoxy resin (A) is preferably 3,000 g / equivalent or more, more preferably 4,000 g / equivalent or more.
On the other hand, the upper limit value of the epoxy equivalent is not particularly limited, but is preferably 15,000 g / equivalent or less, more preferably 10,000 g / equivalent or less in terms of handling and workability. The epoxy equivalent of an epoxy resin (A) is calculated | required by the method described in the term of the below-mentioned Example.

  The weight average molecular weight Mw of the epoxy resin (A) is preferably 10,000 or more and 200,000 or less. If the weight average molecular weight is lower than 10,000, the elongation tends to be low, and if it is higher than 200,000, the resin tends to be difficult to handle. The weight average molecular weight of an epoxy resin (A) is calculated | required by the method described in the term of the below-mentioned Example.

  The epoxy resin (A) is excellent in heat resistance, and can be achieved at 80 ° C. or higher and 220 ° C. or lower when evaluated by the glass transition temperature Tg shown in the Examples section below. The Tg of the epoxy resin is preferably higher in applications using the epoxy resin of the present invention described later, preferably 85 ° C. or higher, more preferably 90 ° C. or higher, and further preferably 100 ° C. or higher, but Tg is too high. And the curing reaction does not proceed sufficiently at the heating temperature used in the processing process, the quality may not be stable, and the required physical properties may not be exhibited. It is preferable that

Hereinafter, the manufacturing method of an epoxy resin (A) is demonstrated.
The epoxy resin (A) can be obtained, for example, by a two-stage method in which a bifunctional epoxy resin (X) having a biphenyl skeleton and a biphenol compound (Y) are reacted. It can also be obtained by a one-step method in which one or more biphenol compounds (Y) and epichlorohydrin are directly reacted. However, since the biphenol compound (Y) is not good in solvent solubility, a solvent generally used in the one-step method may not be applied as it is, and therefore, the two-step method is preferably used.

  The bifunctional epoxy resin (X) used for the production of the epoxy resin (A) is a compound having a biphenyl skeleton and having two epoxy groups in the molecule, and represented by the following formula (4) And an epoxy resin obtained by condensing with an epihalohydrin.

（式（４）中、Ｒ²は式（２）におけるＲ¹と同義である。）

(In formula (4), R ² has the same meaning as R ¹ in formula (2).)

  Examples of the biphenol compound represented by the formula (4) include 2,2′-biphenol, 2,3′-biphenol, 2,4′-biphenol, 3,3′-biphenol, and 3,4′-biphenol. 4,4′-biphenol, 2-methyl-4,4′-biphenol, 3-methyl-4,4′-biphenol, 2,2′-dimethyl-4,4′-biphenol, 3,3′-dimethyl -4,4'-biphenol, 3,3 ', 5,5'-tetramethyl-4,4'-biphenol, 2,2', 3,3 ', 5,5'-hexamethyl-4,4'- Biphenol, 2,2 ′, 3,3 ′, 5,5 ′, 6,6′-octamethyl-4,4′-biphenol and the like can be mentioned. Among these, 4,4′-biphenol, 3,3′-dimethyl-4,4′-biphenol, 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol are preferable. . In conducting the condensation reaction with epihalohydrin, these biphenol compounds may be used alone or in combination of two or more. Moreover, bifunctional epoxy resin (X) obtained by condensing such a biphenol compound and epihalohydrin can also be used together.

  As the bifunctional epoxy resin (X), a bifunctional epoxy resin (X) having a hydrolyzable chlorine concentration of 200 ppm or less and an α glycol group concentration of 100 meq / kg or less is used as a raw material. It is preferable. When the hydrolyzable chlorine concentration is higher than 200 ppm or when the α glycol group concentration is higher than 100 meq / kg, it is not preferable because the molecular weight is not sufficiently increased.

  On the other hand, the biphenol compound (Y) is a compound in which two hydroxyl groups are bonded to the biphenyl skeleton, and is represented by the formula (4). As the biphenol compound (Y), as described above, for example, 2,2′-biphenol, 2,3′-biphenol, 2,4′-biphenol, 3,3′-biphenol, 3,4′-biphenol, 4 , 4′-biphenol, 2-methyl-4,4′-biphenol, 3-methyl-4,4′-biphenol, 2,2′-dimethyl-4,4′-biphenol, 3,3′-dimethyl-4 , 4′-biphenol, 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol, 2,2 ′, 3,3 ′, 5,5′-hexamethyl-4,4′-biphenol, 2,2 ′, 3,3 ′, 5,5 ′, 6,6′-octamethyl-4,4′-biphenol and the like. Among these, 4,4′-biphenol, 3,3′-dimethyl-4,4′-biphenol, 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol are preferable. . These biphenol compounds can be used in combination.

  The biphenyl skeleton contained in the bifunctional epoxy resin (X) and the biphenol compound (Y) is preferably not unsubstituted at the same time, and preferably has one or more substituents in one molecule. When all are unsubstituted biphenyl skeletons, the resulting epoxy resin (A) has high crystallinity and tends to have poor elongation.

  In the production of the epoxy resin (A), the amount of the bifunctional epoxy resin (X) and the biphenol compound (Y) used is the compounding equivalent ratio, epoxy group: phenolic hydroxyl group = 1: 0.90-1. 10 is preferable. When the equivalent ratio is within the above range, a sufficiently high molecular weight proceeds.

  A catalyst may be used for the synthesis of the epoxy resin (A), and any catalyst may be used as long as it has a catalytic ability to promote a reaction between an epoxy group and a phenolic hydroxyl group, an alcoholic hydroxyl group or a carboxyl group. Something like that. For example, alkali metal compounds, organic phosphorus compounds, tertiary amines, quaternary ammonium salts, cyclic amines, imidazoles and the like can be mentioned. These catalysts can be used alone or in combination of two or more.

  Specific examples of the alkali metal compound include alkali metal hydroxides such as sodium hydroxide, lithium hydroxide and potassium hydroxide, alkali metal salts such as sodium carbonate, sodium bicarbonate, sodium chloride, lithium chloride and potassium chloride, sodium Examples include alkali metal alkoxides such as methoxide and sodium ethoxide, alkali metal phenoxides, alkali metal hydrides such as sodium hydride and lithium hydride, and alkali metal salts of organic acids such as sodium acetate and sodium stearate.

  Specific examples of the organic phosphorus compound include tri-n-propylphosphine, tri-n-butylphosphine, triphenylphosphine, tetramethylphosphonium bromide, tetramethylphosphonium iodide, tetramethylphosphonium hydroxide, Trimethylcyclohexylphosphonium chloride, trimethylcyclohexylphosphonium bromide, trimethylbenzylphosphonium chloride, trimethylbenzylphosphonium bromide, tetraphenylphosphonium bromide, triphenylmethylphosphonium bromide, triphenylmethylphosphonium iodide, triphenylethylphosphonium chloride, triphenylethylphosphonium bromide, Triphenylethylphosphonium iodai , Triphenyl benzyl phosphonium chloride, triphenyl benzyl phosphonium bromide and the like.

  Specific examples of the tertiary amine include triethylamine, tri-n-propylamine, tri-n-butylamine, triethanolamine, benzyldimethylamine and the like.

  Specific examples of the quaternary ammonium salt include tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium hydroxide, triethylmethylammonium chloride, tetraethylammonium chloride, tetraethylammonium bromide, tetraethylammonium iodide, tetrapropylammonium bromide, Tetrapropylammonium hydroxide, tetrabutylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium iodide, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium hydroxide, benzyltributylammonium chloride Id, and a phenyl trimethyl ammonium chloride.

  Specific examples of cyclic amines include 1,8-diazabicyclo (5,4,0) undecene-7,1,5-diazabicyclo (4,3,0) nonene-5.

  Specific examples of imidazoles include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and the like.

  The usage-amount of a catalyst is 0.001-1 weight% normally in reaction solid content. In addition, the alkali metal content remains in the epoxy resin (A) obtained when an alkali metal compound is used as a catalyst, and the interlayer filler composition of the present invention containing the epoxy resin (A) as a component is used as a printed wiring board. When used, it tends to deteriorate the insulating properties of the used printed wiring board, so the total content of Li, Na and K in the epoxy resin needs to be 60 ppm or less, preferably 50 ppm or less.

  In addition, when organophosphorus compounds, tertiary amines, quaternary ammonium salts, cyclic amines, imidazoles and the like are used as catalysts, these remain as catalyst residues in the resulting epoxy resin (A), and alkali Since the insulating properties of the printed wiring board are deteriorated as well as the residual metal content, the content of nitrogen in the epoxy resin (A) is 300 ppm or less, and the content of phosphorus in the epoxy resin (A) is 300 ppm or less. There must be. More preferably, the content of nitrogen in the epoxy resin (A) is 200 ppm or less, and the content of phosphorus in the epoxy resin (A) is 200 ppm or less.

  As for the epoxy resin (A) of the present invention, an organic solvent may be used as a solvent in the step of the synthesis reaction at the time of production, and any organic solvent can be used as long as it dissolves the epoxy resin (A). It may be anything. For example, aromatic solvents, ketone solvents, amide solvents, glycol ether solvents and the like can be mentioned.

Specific examples of the aromatic solvent include benzene, toluene, xylene and the like.
Specific examples of the ketone solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, 2-heptanone, 4-heptanone, 2-octanone, cyclohexanone, acetylacetone, and dioxane.
Specific examples of the amide solvent include formamide, N-methylformamide, N, N-dimethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, 2-pyrrolidone, N-methylpyrrolidone and the like.
Specific examples of glycol ether solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol dimethyl ether, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol Examples include mono-n-butyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether, propylene glycol mono-n-butyl ether, propylene glycol monomethyl ether acetate.
These organic solvents may be used alone or in combination of two or more.

  The solid concentration in the synthesis reaction during production of the epoxy resin (A) is preferably 35 to 95% by weight. In addition, when a highly viscous product is produced during the reaction, the reaction can be continued by additionally adding a solvent (organic solvent). After completion of the reaction, the solvent (organic solvent) can be removed or further added as necessary.

  In the production of the epoxy resin (A), the polymerization reaction between the bifunctional epoxy resin (X) and the biphenol compound (Y) is carried out at a reaction temperature at which the used catalyst is not decomposed. If the reaction temperature is too high, the produced epoxy resin may be deteriorated. Conversely, if the temperature is too low, the reaction may not proceed sufficiently. For these reasons, the reaction temperature is preferably 50 to 230 ° C, more preferably 120 to 200 ° C. Moreover, reaction time is 1 to 12 hours normally, Preferably it is 3 to 10 hours. When using a low boiling point solvent such as acetone or methyl ethyl ketone, the reaction temperature can be ensured by carrying out the reaction under high pressure using an autoclave.

[Epoxy resin (B)]
The epoxy resin (B) constituting the interlayer filler composition of the present invention is an epoxy resin having an epoxy equivalent of less than 500 g / equivalent.
Since the interlayer filler composition of the present invention contains the epoxy resin (B) together with the epoxy resin (A), it exhibits fluidity when heated at a high temperature, and can easily perform solder joining of the three-dimensional stacked semiconductor device. .

The above-mentioned epoxy resin (A) is an epoxy resin that itself has few limitations in the curing process including curing conditions, has sufficient elongation, and is excellent in balance between thermal conductivity and heat resistance. Since the epoxy resin (A) is a polymer having an epoxy equivalent of 2500 g / equivalent or more and a glass transition temperature (Tg), it is considered that the fluidity and reactivity of the epoxy resin are insufficient.
Here, since the composition of the present invention contains less than 500 g / equivalent of the epoxy resin (B), an epoxy resin component having high fluidity and high reactivity is introduced, and the epoxy resin (A) and the epoxy resin are introduced. The mixture with the resin (B) melts and flows at the time of heat bonding, so that the bonding between the solder and the land is not hindered.

In addition, although it is essential that the epoxy equivalent of an epoxy resin (B) is less than 500 g / equivalent, from a viewpoint of melt viscosity, Preferably, it is less than 400 g / equivalent, More preferably, it is less than 300 g / equivalent. .
When the epoxy equivalent of the epoxy resin (B) is 500 g / equivalent or more, a composition having sufficient heat fluidity may not be obtained.

The epoxy resin (B) may be an epoxy resin that satisfies the epoxy equivalent. In addition, even if it is an epoxy resin which has a structure represented by the said Formula (1), if the said epoxy equivalent is satisfied, it will correspond to an epoxy resin (B). Among such epoxy resins, those having two or more epoxy groups in the molecule are preferable. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin , Cresol novolac type epoxy resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, dicyclopentadiene type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, polyfunctional phenol type epoxy resin Various epoxy resins can be used.
These can be used alone or as a mixture of two or more.

  The epoxy resin (B) may be an epoxy resin that satisfies the above epoxy equivalent, and other physical properties may be used.

The composition of the present invention may contain an epoxy resin other than the epoxy resin (A) and the epoxy resin (B) (hereinafter referred to as “other epoxy resin”) as long as the purpose is not impaired. . The ratio of the other epoxy resins in the total epoxy resin including the epoxy resin (A), the epoxy resin (B), and the other epoxy resins is generally 50% by weight or less, preferably 45%, with the total as 100% by weight. % By weight or less.
Examples of other epoxy resins include bis A type solid epoxy resins, bis F type solid epoxy resins, phenoxy resins, and epoxy resin reactive diluents.

In the composition of the present invention, the proportion of the epoxy resin (A) in the total epoxy resin is 1 to 50% by weight, preferably 2 to 40% by weight, based on 100% by weight of the total epoxy resin. The “all epoxy resins” means that when the epoxy resin contained in the composition of the present invention is only the epoxy resin (A) and the epoxy resin (B), the epoxy resin (A) and the epoxy resin (B). In the case of further including other epoxy resins, it means the total of epoxy resin (A), epoxy resin (B) and other epoxy resins.
When the ratio of the epoxy resin (A) is 1% by weight or more, it is possible to sufficiently obtain effects such as improvement of thermal conductivity by blending the epoxy resin (A). When the proportion of the epoxy resin (A) is 50% by weight or less, a low melt viscosity at the time of heating is realized.

[Curing agent (C)]
Next, the hardening | curing agent (C) used by this invention shows the substance which contributes to the crosslinking reaction between the epoxy groups of an epoxy resin.
There is no restriction | limiting in particular as a hardening | curing agent (C), Generally, what is generally known as an epoxy resin hardening | curing agent can be used. For example, phenolic curing agents, aliphatic amines, polyether amines, alicyclic amines, aromatic amines and other amine curing agents, acid anhydride curing agents, amide curing agents, tertiary amines, imidazoles and the like Derivatives, organic phosphines, phosphonium salts, tetraphenylboron salts, organic acid dihydrazides, boron halide amine complexes, polymercaptan curing agents, isocyanate curing agents, blocked isocyanate curing agents, and the like.

  Specific examples of the phenolic curing agent include bisphenol A, bisphenol F, 4,4′-dihydroxydiphenylmethane, 4,4′-dihydroxydiphenyl ether, 1,4-bis (4-hydroxyphenoxy) benzene, 1,3-bis. (4-hydroxyphenoxy) benzene, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl 10- (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolak, bisphenol A novolak, o-cresol novolak, m-cresol novolak, p-cle All novolak, xylenol novolak, poly-p-hydroxystyrene, hydroquinone, resorcin, catechol, t-butylcatechol, t-butylhydroquinone, fluoroglycinol, pyrogallol, t-butyl pyrogallol, allylated pyrogallol, polyallylated pyrogallol, 1,2 , 4-Benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2, -Dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, allylated or polyallylated dihydroxynaphthalene, allylated bisphenol A, allylated bisphenol F, allylated phenol novolak, allylated pyrogallol, etc. The

  Specific examples of the amine curing agent include aliphatic diamines such as ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, hexamethylenediamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, Examples include diethylenetriamine, iminobispropylamine, bis (hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-hydroxyethylethylenediamine, tetra (hydroxyethyl) ethylenediamine, and the like. Examples of polyether amines include triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis (propylamine), polyoxypropylene diamine, polyoxypropylene triamines, and the like. Cycloaliphatic amines include isophorone diamine, metacene diamine, N-aminoethylpiperazine, bis (4-amino-3-methyldicyclohexyl) methane, bis (aminomethyl) cyclohexane, 3,9-bis (3-amino). Propyl) -2,4,8,10-tetraoxaspiro (5,5) undecane, norbornenediamine and the like. Aromatic amines include tetrachloro-p-xylenediamine, m-xylenediamine, p-xylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4-diaminoanisole, 2,4 -Toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, m-aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethyl) phenol, triethanolamine, methylbenzylamine, α- (m-aminophenyl) ethylamine, α- (p-aminophenyl) ethylamine , Diaminodiethyl Examples include rudimethyldiphenylmethane, α, α'-bis (4-aminophenyl) -p-diisopropylbenzene.

  Specific examples of acid anhydride curing agents include dodecenyl succinic anhydride, polyadipic acid anhydride, polyazeline acid anhydride, polysebacic acid anhydride, poly (ethyloctadecanedioic acid) anhydride, poly (phenylhexadecanedioic acid) Anhydride, Methyltetrahydrophthalic anhydride, Methylhexahydrophthalic anhydride, Hexahydrophthalic anhydride, Methylhymic anhydride, Tetrahydrophthalic anhydride, Trialkyltetrahydrophthalic anhydride, Methylcyclohexene dicarboxylic anhydride, Methylcyclohexene tetracarboxylic Acid anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bistrimellitic dianhydride, het anhydride, nadic anhydride, methyl nadic anhydride, 5- ( 2, -Dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexane-1,2-dicarboxylic anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene-2-succinic acid Examples of the anhydride include 1-methyl-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic dianhydride.

  Examples of the amide type curing agent include dicyandiamide and polyamide resin.

  Examples of the tertiary amine include 1,8-diazabicyclo (5,4,0) undecene-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol. .

  Examples of imidazole and derivatives thereof include 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole, 2-ethyl-4 (5) -methylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyano-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazo Lithium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methyl Imidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-di Mino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2- Phenyl-4-methyl-5-hydroxymethylimidazole, and adducts of an epoxy resin and the above imidazoles, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, Etc. are exemplified.

  Examples of organic phosphines include tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine and the like, and phosphonium salts include tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / ethyltriphenylborate, Examples include tetrabutylphosphonium / tetrabutylborate, and examples of the tetraphenylboron salt include 2-ethyl-4-methylimidazole / tetraphenylborate, N-methylmorpholine / tetraphenylborate, and the like.

  Moreover, these hardening | curing agents may be used individually by 1 type, and 2 or more types may be mixed and used for them in arbitrary combinations and ratios.

The content of the curing agent (C) in the interlayer filler composition of the present invention is 0.01 to 200 parts by weight, preferably 0.05 to 100 parts by weight per 100 parts by weight of the total epoxy resin. Parts by weight or less, more preferably 0.1 parts by weight or more and 65 parts by weight or less.
If the content of the curing agent (C) is less than 0.01 parts by weight, curing may be insufficient, and if it exceeds 200 parts by weight, desired physical properties such as adhesiveness and thermal conductivity cannot be obtained. There is a case.

[Inorganic filler (D)]
In the interlayer filler composition of the present invention, the inorganic filler (D) is added for the purpose of improving the thermal conductivity and controlling the linear expansion coefficient, and is mainly aimed at improving the thermal conductivity.
Therefore, the inorganic filler (D) used in the present invention preferably has a high thermal conductivity, and the inorganic filler has a high thermal conductivity inorganic conductivity of 1 W / m · K or more, preferably 2 W / m · K or more. Fillers are preferred.

As the inorganic filler (D), alumina (Al ₂ O ₃ : thermal conductivity 30 W / m · K), aluminum nitride (AlN: thermal conductivity 260 W / m · K), boron nitride (BN: thermal conductivity 3 W / K) m · K (thickness direction), 275 W / m · K (in-plane direction)), silicon nitride (Si ₃ N ₄ : thermal conductivity 23 W / m · K), silica (SiO ₂ : thermal conductivity 1.4 W / m · K) and the like. Among them, Al ₂ O ₃ , AlN, BN, and SiO ₂ are preferable, and Al ₂ O ₃ , BN, and SiO ₂ are particularly preferable. These inorganic fillers may be used alone or in a combination of two or more in any combination and ratio.

If the inorganic filler (D) has a particle size that is too large, lamination may be hindered. If the particle size is too small, the inorganic filler (D) tends to aggregate and deteriorate dispersibility. It is preferable to use one having a diameter of about 0.05 to 1000 μm.
Moreover, if it is an aggregated inorganic filler, it is preferable to use an average crystal diameter of 0.01 μm to 5 μm and an average aggregate diameter of 1 to 1000 μm.

  The content of the inorganic filler (D) in the composition of the present invention is preferably 10 to 400 parts by weight, more preferably 20 to 300 parts by weight, per 100 parts by weight of the total epoxy resin. When the content of the inorganic filler (D) is less than 10 parts by weight per 100 parts by weight of the total epoxy resin, the effect of adding the inorganic filler (D) is reduced, and the intended thermal conductivity may not be obtained. If the amount exceeds 400 parts by weight, the presence of the filler may impair the bondability.

The composition of the present invention may contain various additives within a range not impairing the effects of the present invention for the purpose of further improving the functionality.
Examples of additives include fluxes for improving solder jointability, coupling agents for improving adhesion to base materials and matrix resins and inorganic fillers, and UV inhibitors for improving storage stability. , Antioxidants, plasticizers, flame retardants, colorants, dispersants, fluidity improvers, adhesion improvers with substrates, and the like.
Any of these may be used alone or in a combination of two or more in any combination and ratio. There is no restriction | limiting in particular in the compounding quantity of another additive, It is used with the compounding quantity of a normal resin composition to such an extent that required functionality is obtained.

In addition, the compounding quantity of another additive component is preferably 10 parts by weight or less, more preferably 5 parts by weight or less, per 100 parts by weight of the total epoxy resin.
Among the additives, it is preferable to include a flux. Specifically, the flux means that the metal electrical signal terminals such as solder bumps and the surface oxide film of the land are dissolved and removed at the time of solder joining of the metal terminals, and the wetting and spreading property on the land surface of the solder bumps is further improved. It is a compound having a function of preventing reoxidation of the surface of the metal terminal of the solder bump.

  Examples of the flux used in the present invention include aliphatic carboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, malic acid, tartaric acid, citric acid, lactic acid, acetic acid, propionic acid, butyric acid, oleic acid, and stearic acid. , Benzoic acid, salicylic acid, phthalic acid, trimellitic acid, trimellitic anhydride, aromatic carboxylic acids such as trimesic acid and benzenetetracarboxylic acid, organic carboxylic acids such as terpene carboxylic acids such as abietic acid and rosin, and organic carboxylic acids Organic carboxylic acid ester, glutamic acid hydrochloride, aniline hydrochloride, hydrazine hydrochloride, cetylpyridine bromide, phenylhydrazine hydrochloride, tetrachloronaphthalene, methylhydrazine hydrochloride, which is a hemiacetal ester converted by reacting acid with alkyl vinyl ether Salt, methylamine hydrochloride , Organic halogen compounds such as ethylamine hydrochloride, diethylamine hydrochloride and butylamine hydrochloride, amines such as urea and diethylenetriamine hydrazine, polyhydric alcohols such as ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol and glycerin, hydrochloric acid, Inorganic acids such as hydrofluoric acid, phosphoric acid, borohydrofluoric acid, fluorides such as potassium fluoride, sodium fluoride, ammonium fluoride, copper fluoride, nickel fluoride, zinc fluoride, potassium chloride, sodium chloride, chloride Examples thereof include chlorides such as monocopper, nickel chloride, ammonium chloride, zinc chloride and stannous chloride, and bromides such as potassium bromide, sodium bromide, ammonium bromide, tin bromide and zinc bromide. These compounds may be used as they are or may be microencapsulated using a coating agent made of an organic polymer or an inorganic compound. These compounds may be used individually by 1 type, and 2 or more types may be mixed and used for them in arbitrary combinations and ratios.

  In the present invention, the flux content is 0.1 to 10 parts by weight, preferably 0.5 to 5 parts by weight, per 100 parts by weight of the total epoxy resin. If the content is less than 0.1 parts by weight, there is a risk of poor solder connection due to a decrease in oxide film removability, and if it exceeds 10 parts by weight, there is a risk of poor connection due to an increase in the viscosity of the composition.

Furthermore, in the said additive, it is preferable that a coupling agent is included from a viewpoint of improving the adhesiveness of an epoxy resin component and an inorganic filler (D).
Here, as the silane coupling agent, epoxy silane such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ, -Aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane, γ-ureidopropyltri Aminosilane such as ethoxysilane, mercaptosilane such as 3-mercaptopropyltrimethoxysilane, p-styryltrimethoxysilane, vinyltrichlorosilane, vinyltris (β-methoxyethoxy) silane, vinyltrimethoxysilane, vinyltriethoxysila And vinyl silanes such as γ-methacryloxypropyltrimethoxysilane, and epoxy, amino and vinyl polymer type silanes.

  On the other hand, titanate coupling agents include isopropyl triisostearoyl titanate, isopropyl tri (N-aminoethyl / aminoethyl) titanate, diisopropyl bis (dioctyl phosphate) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis ( Ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, bis (dioctyl pyrophosphate) ethylene titanate It is done.

  In addition, it is preferable that the addition amount of a coupling agent shall be about 0.1 to 2.0 weight% with respect to the total solid in a composition among other additives. If the amount of the coupling agent is small, the effect of improving the adhesion between the matrix resin and the inorganic filler due to the incorporation of the coupling agent cannot be sufficiently obtained. There is a problem that the agent bleeds out.

  In addition, thermoplastic oligomers can be added to the composition of the present invention from the viewpoint of improving the fluidity during molding and improving the adhesion to the substrate. Thermoplastic oligomers include C5 and C9 petroleum resins, styrene resins, indene resins, indene / styrene copolymer resins, indene / styrene / phenol copolymer resins, indene / coumarone copolymer resins, indene / benzothiophene. Examples thereof include copolymer resins. As addition amount, it is the range of 2-30 weight part normally with respect to 100 weight part of all the epoxy resins.

<Manufacture of interlayer filler composition>
The interlayer filler composition of the present invention is produced by uniformly mixing an epoxy resin, an inorganic filler, a curing agent and other components with a mixer or the like and then kneading them with a heating roll or a kneader. There is no restriction | limiting in particular in the mixing | blending order of these components. It is also possible to form a film using a press after kneading. Further, after kneading, the melt-kneaded product can be pulverized to be powdered or tableted.

[Interlayer filler composition coating solution]
The composition of the present invention comprises an epoxy resin (A), an epoxy resin (B), a curing agent (C), an inorganic filler (D), and, if necessary, the above other additives, and an organic solvent (E). It can be dispersed in a coating solution.

[Organic solvent (E)]
Examples of the organic solvent (E) used in the coating solution of the present invention include acetone, methyl ethyl ketone (MEK), ketones such as methyl isobutyl ketone, methyl amyl ketone, and cyclohexanone, esters such as ethyl acetate, ethylene glycol monomethyl ether, and the like. Examples include ethers, amides such as N, N-dimethylformamide and N, N-dimethylacetamide, alcohols such as methanol and ethanol, alkanes such as hexane and cyclohexane, and aromatics such as toluene and xylene.
Of these, taking into consideration the solubility of the resin and the boiling point of the solvent, ketones such as methyl ethyl ketone and cyclohexanone, esters and ethers are preferred, and in particular, ketones of methyl ethyl ketone and cyclohexanone are particularly preferred.
These organic solvents may be used alone or in a combination of two or more in any combination and ratio.

In the coating liquid of the present invention, the mixing ratio of the organic solvent (E) to other components is not particularly limited, but is preferably 20% by weight or more and 70% by weight or less, particularly preferably 30% by weight with respect to the other composition. % To 60% by weight. By setting it as such a mixing ratio, a favorable coating film can be formed by arbitrary coating methods by using the coating liquid of this invention.
If the mixing ratio of the organic solvent (E) is less than 20% by weight, the viscosity of the composition may increase and a good coating film may not be obtained, or if it exceeds 70% by weight, a predetermined film thickness may not be obtained. May come up with problems.

The coating liquid of the present invention may contain various additives.
Examples of such additives include surfactants, emulsifiers, low elasticity agents, diluents, antifoaming agents, ion trapping agents, and the like that improve the dispersibility of each component in the coating solution in addition to the additives described above. Is mentioned.

Here, as the surfactant, any of conventionally known anionic surfactants, nonionic surfactants, and cationic surfactants can be used.
For example, polyoxyethylene alkyl ethers, polyoxyethylene alkyl aryl ethers, polyoxyethylene alkyl esters, sorbitan alkyl esters, monoglyceride alkyl esters, alkylbenzene sulfonates, alkyl naphthalene sulfonates, alkyl sulfates, alkyl Examples include sulfonates, sulfosuccinate esters, alkylbetaines, amino acids, and the like.
The addition amount of the surfactant is preferably about 0.001 to 5% by weight with respect to the total solid content in the composition. If it is less than 0.001% by weight, the predetermined film thickness uniformity may not be obtained, and if it exceeds 5% by weight, phase separation from the epoxy resin component may be caused.

The manufacturing method of the coating liquid of this invention is not specifically limited, What is necessary is just to follow a conventionally well-known method, and can manufacture by mixing the structural component of a coating liquid. At that time, for the purpose of improving the uniformity of the composition, defoaming, etc., it may be mixed using a paint shaker, bead mill, planetary mixer, stirring type disperser, self-revolving stirring mixer, three rolls, etc. preferable.
The mixing order is arbitrary as long as there is no particular problem such as reaction or precipitation. Among the components of the coating liquid, any two components or three or more components are blended in advance, and then the remaining components are mixed. You may mix all at once.

<Use of interlayer filler composition and coating solution thereof>
The interlayer filler composition of the present invention has sufficient elongation to be applied to a process such as film molding / coating, is excellent in balance between thermal conductivity and heat resistance, and has excellent cured properties. Yes, it is preferably used as an interlayer insulating filler in a three-dimensional stacked semiconductor device. Moreover, the coating liquid of the composition of this invention is used suitably for processes, such as said film shaping | molding / application | coating.

[Hardened interlayer filler]
<Manufacture of cured product>
Hereinafter, a case where a cured product is obtained from a coating solution containing the interlayer filler composition of the present invention will be described in detail.
When applying the coating liquid of this invention to manufacture of a three-dimensional laminated semiconductor device and obtaining hardened | cured material, it carries out in the following procedures. The composition of the present invention is applied onto a wafer substrate, the solvent is removed from the coating film to form a B stage film, and then a semiconductor chip is cut out from the wafer. The cut-out chip is placed on the substrate, and after positioning and pressurizing and heating to temporarily bond, the semiconductor chip-substrate is pressed and heated to the melting temperature of the solder for bonding. Thereafter, the bonded semiconductor chip-substrate can be heated and cured in an oven or the like. The B-stage thin film refers to a thin film in which the coating film does not flow even when the coating film is tilted so that the film surface is in the vertical direction.

  Although there is no restriction | limiting in particular as the coating method of the coating liquid of this invention, Since a uniform thin film can be formed easily, spin coating, dip coating, spray coating, flow coating, doctor blade method, screen printing method, inkjet It is preferable to adopt a method or the like.

The removal of the solvent when removing the solvent from the formed coating film to obtain a B stage film can be performed by evaporating the solvent at room temperature or under heating. At this time, the pressure can be reduced as necessary. It is important for removing the solvent to obtain adhesiveness to be performed at a temperature lower than the curing temperature of the composition.
Here, the curing temperature of the composition is the temperature of the gel point. The treatment temperature at the time of removing the solvent is preferably a temperature lower by about 10 to 100 ° C. than the curing temperature of the composition.

  Instead of obtaining a B-stage film on the wafer substrate as described above, first, after obtaining a solid obtained by distilling off the solvent from the coating solution, it is molded into a film using a press or a roll, and then the semiconductor. It can also be cured by being sandwiched between the chip and the substrate, soldered by pressing and heating, and then heated.

  The three-dimensional stacked semiconductor device using the cured interlayer filler of the present invention has high thermal conductivity, and is expected to contribute to higher speed and higher capacity of semiconductor devices.

Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited to the following examples unless it exceeds the gist.
In addition, the following measurement methods for various physical properties and characteristics are as follows.

The epoxy resin (A1) used in the examples of the present invention was evaluated by the following method.
<Molecular weight>
Using “HLC-8120GPC device” manufactured by Tosoh Corporation, and under the following measurement conditions, as standard polystyrene, TSK Standard Polystyrene: F-128 (Mw1,090,000, Mn1,030,000), F-10 ( Mw 106,000, Mn 103,000), F-4 (Mw 43,000, Mn 42,700), F-2 (Mw 17,200, Mn 16,900), A-5000 (Mw 6,400, Mn 6,100), A- Calibration curves using 2500 (Mw 2,800, Mn 2,700) and A-300 (Mw 453, Mn 387) were prepared, and the weight average molecular weight and number average molecular weight were measured as polystyrene conversion values.
Column: “TSKGEL SuperHM-H + H5000 + H4000 + H3000 + H2000” manufactured by Tosoh Corporation
Eluent: Tetrahydrofuran Flow rate: 0.6 ml / min Detection: UV (wavelength 254 nm)
Temperature: 40 ° C
Sample concentration: 0.1% by weight
Injection volume: 10μL

<N number>
The value of n and the average value in the formula (1) were calculated from the number average molecular weight determined above.

<Epoxy equivalent>
Measured according to JIS K 7236 and expressed as a solid content converted value.

<Glass transition temperature Tg>
The epoxy resin from which the solvent was removed by drying was measured by increasing the temperature from 30 to 200 ° C. at 10 ° C./min using “DSC7020” manufactured by SII Nanotechnology.

<Elongation>
The epoxy resin solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 100 μm) with an applicator, dried at 60 ° C. for 1 hour, then at 150 ° C. for 1 hour, and further at 200 ° C. for 1 hour, and a thickness of about 50 μm. An epoxy resin film was obtained. This was cut into a width of 1 cm, and an average value measured three times at 5 mm / min using an autograph (INSTRON 5582) was shown.

<Melt viscosity>
The melt viscosity of the interlayer filler composition of the present invention is a parallel plate dynamic viscosity measured using a viscoelasticity measuring device Physica MCR301 manufactured by Anton Paar Japan. The measuring method is as follows. First, the solvent is distilled off from the composition of the present invention to obtain a solid, and then the solid is sandwiched between two separators and subjected to hot press molding, and then allowed to cool to room temperature, with a thickness of about 1 mm. A plate sample was obtained. This sample was placed between a parallel plate dish and a parallel plate (φ25 mm), and the parallel plate dynamic viscosity was measured. The measurement condition was that 20% sinusoidal distortion was applied to the sample, the angular frequency of the distortion was 10 rad / sec, and the viscosity was measured from 40 ° C. to 200 ° C. in the process of raising the temperature at a rate of 3 ° C. per minute. .

(1) Epoxy resin (A)
1) The epoxy resin (A1) used in the examples was produced by the following method.
The raw materials, catalysts, and solvents used are shown below.
-Compound (X): Mitsubishi Chemical Corporation product name "YL6121H"(4,4'-biphenol type epoxy resin and 3,3 ', 5,5'-tetramethyl-4,4'-biphenol type epoxy resin 1: 1 mixture, epoxy equivalent 171 g / equivalent)
Compound (Y): 3,3′-dimethyl-4,4′-biphenol (OH equivalent 107 g / equivalent, Honshu Chemical Co., Ltd.)
・ Catalyst: 27 wt% tetramethylammonium hydroxide aqueous solution / solvent Solvent 1: Cyclohexanone Solvent 2: Methyl ethyl ketone

210 parts by weight of compound (X), 127.6 parts by weight of compound (Y), 0.78 parts by weight of catalyst, and 181.8 parts by weight of solvent 1 (cyclohexanone) are placed in a pressure-resistant reaction vessel equipped with a stirrer, and nitrogen gas The reaction was performed at 180 ° C. for 5 hours in an atmosphere.
Thereafter, 212.1 parts by weight of solvent 1 (cyclohexanone) and 393.8 parts by weight of solvent 2 (methyl ethyl ketone) were added to the pressure-resistant reaction vessel to adjust the solid content concentration.
The results of analyzing the epoxy resin (A1) obtained after removing the solvent from the reaction product by a conventional method are shown below.
Epoxy resin (A1)
Weight average molecular weight (Mw): 26425
Number average molecular weight (Mn): 8129
N number in Formula (1): 29
Epoxy equivalent: 4586 (g / equivalent)
Tg: 103 (° C.)
Elongation: 10 (%)

(2) The epoxy resins (B1), (B2), (B3), other epoxy resins, and the solvent (E) used for the production of the compositions of the examples are shown below.

1) Epoxy resin (B)
Epoxy resin (B1): bisphenol A type liquid epoxy resin manufactured by Mitsubishi Chemical Corporation “834”
Epoxy resin (B2): Bisphenol A type liquid epoxy resin manufactured by Mitsubishi Chemical Corporation “828EL”
Epoxy resin (B3): Trisphenol methane type polyfunctional epoxy resin manufactured by Mitsubishi Chemical Co., Ltd. Trade name “1032H60” (80% by weight methyl ethyl ketone solution prepared)

Other epoxy resins: bisphenol A type solid epoxy resin manufactured by Mitsubishi Chemical Co., Ltd. Trade name “1001” (adjust 80% by weight methyl ethyl ketone solution)

2) Solvent (E): Methyl ethyl ketone

"Examples 1-7"
The epoxy resin (A1), the epoxy resins (B1), (B2), (B3) and other epoxy resins were mixed in a rotation and revolution mixer as a blending weight ratio shown in Table 1. For each sample, the properties of the B-staged film after removing the solvent, the adhesiveness at 80 ° C., and the melt viscosity at 150 ° C. were evaluated, and the results are summarized in Table 1. In all cases, the suitability for the three-dimensional lamination process was met. In all the samples, high thermal conductivity due to the orientation of mesogen sites contained in the epoxy resin (A1) is exhibited.

  The present invention provides an interlayer filler composition that is excellent in adaptability to a manufacturing process of a three-dimensional stacked semiconductor device and excellent in performance balance such as thermal conductivity and heat resistance. Since the three-dimensional stacked semiconductor device using the interlayer filler composition of the present invention is excellent in thermal conductivity and heat resistance, it is expected to contribute to higher speed and higher capacity of semiconductor devices.

Claims (8)

Epoxy resin (A) comprising bifunctional epoxy resin (X) having a biphenyl skeleton having an epoxy equivalent of 2500 g / equivalent or more and 3,3′-dimethyl-4,4′-biphenol (Y), and epoxy equivalent An interlayer filler composition for a three-dimensional stacked semiconductor device, comprising at least an epoxy resin (B) having a weight of 400 g / equivalent or less. 2. The interlayer filler composition for a three-dimensional stacked semiconductor device according to claim 1, wherein the proportion of the epoxy resin (A) in the total epoxy resin is 2% by weight or more and 40% by weight or less. Further comprising a curing agent (C), the content of the curing agent (C) is the total epoxy resin per 100 parts by weight, according to claim 1 or 2, characterized in that 200 parts by weight or less than 0.01 part by weight An interlayer filler composition for a three-dimensional stacked semiconductor device as described in 1. The interlayer filler composition for a three-dimensional stacked semiconductor device according to any one of claims 1 to 3 , further comprising an inorganic filler (D). An interlayer filler composition coating solution for a three-dimensional stacked semiconductor device, further comprising an organic solvent (E) in the composition according to any one of claims 1 to 4 . A cured product of an interlayer filler for a three-dimensional stacked semiconductor device, wherein the composition according to any one of claims 1 to 4 is cured. A method for manufacturing a three-dimensional stacked semiconductor device, comprising using the interlayer filler composition coating liquid according to claim 5 . A three-dimensional stacked semiconductor device comprising the cured interlayer filler according to claim 6 .