MY196962A - Prepreg and production method therefor, stacked plate, printed circuit board and semiconductor package - Google Patents

Prepreg and production method therefor, stacked plate, printed circuit board and semiconductor package

Info

Publication number
MY196962A
MY196962A MYPI2019005775A MYPI2019005775A MY196962A MY 196962 A MY196962 A MY 196962A MY PI2019005775 A MYPI2019005775 A MY PI2019005775A MY PI2019005775 A MYPI2019005775 A MY PI2019005775A MY 196962 A MY196962 A MY 196962A
Authority
MY
Malaysia
Prior art keywords
prepreg
circuit board
printed circuit
production method
semiconductor package
Prior art date
Application number
MYPI2019005775A
Inventor
Yoshikatsu Shiraokawa
Minoru Kakitani
Hiroshi Shimizu
Keisuke Kushida
Tatsunori Kaneko
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY196962A publication Critical patent/MY196962A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/24—Thermosetting resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Provided is a prepreg obtained through steps 1 to 3. Step 1: step of obtaining a prepreg precursor, the prepreg precursor being obtained by B--staging a thermosetting resin composition, and the B-staging being performed by performing heat treatment after impregnating the thermosetting resin composition in a base material. Step 2: step of cooling the prepreg precursor obtained in step 1. Step 3: step of obtaining a prepreg, the prepreg being obtained by performing surface heat treatment on the prepreg precursor cooled in step 2, and the surface heat treatment being a process of raising a surface temperature of the prepreg precursor.
MYPI2019005775A 2017-03-30 2018-03-27 Prepreg and production method therefor, stacked plate, printed circuit board and semiconductor package MY196962A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017068070 2017-03-30
PCT/JP2018/012389 WO2018181287A1 (en) 2017-03-30 2018-03-27 Prepreg and production method therefor, stacked plate, printed circuit board and semiconductor package

Publications (1)

Publication Number Publication Date
MY196962A true MY196962A (en) 2023-05-15

Family

ID=63676131

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019005775A MY196962A (en) 2017-03-30 2018-03-27 Prepreg and production method therefor, stacked plate, printed circuit board and semiconductor package

Country Status (6)

Country Link
JP (2) JP7120220B2 (en)
KR (1) KR102489450B1 (en)
CN (1) CN110662795B (en)
MY (1) MY196962A (en)
TW (1) TWI786099B (en)
WO (1) WO2018181287A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI728781B (en) * 2020-04-21 2021-05-21 穗曄實業股份有限公司 Thermosetting resin composition

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05179023A (en) * 1991-12-27 1993-07-20 Toshiba Chem Corp Production of prepreg and copper-clad laminate
JPH09174546A (en) * 1995-12-25 1997-07-08 Matsushita Electric Works Ltd Manufacture of prepreg
JP2001122992A (en) 1999-10-25 2001-05-08 Hitachi Chem Co Ltd Production of prepreg, nozzle using for producing prepreg and apparatus for producing prepregs
JP2002103494A (en) 2000-10-05 2002-04-09 Matsushita Electric Ind Co Ltd Prepreg, printed-wiring board, and method for producing the same
JP2003008232A (en) * 2001-06-20 2003-01-10 Matsushita Electric Works Ltd Method of manufacturing prepreg
JP2003266434A (en) 2002-03-14 2003-09-24 Toto Ltd Manufacturing method for resin molded body and manufacturing method for bulk mold compound for preparing resin molded body
JP4880986B2 (en) 2005-12-02 2012-02-22 ポリマテック株式会社 Method for producing article formed using epoxy resin composition
JP2012228884A (en) * 2006-10-17 2012-11-22 Hitachi Chemical Co Ltd Prepreg, and laminate
US8114508B2 (en) 2009-10-20 2012-02-14 Nan Ya Plastics Corporation Composition of modified maleic anhydride and epdxy resin
CN102050939A (en) 2009-10-27 2011-05-11 南亚塑胶工业股份有限公司 Thermosetting resin composition with acid anhydride curing
JP5549183B2 (en) * 2009-10-29 2014-07-16 新神戸電機株式会社 Method for producing epoxy resin composition, method for producing prepreg, method for producing laminated board and wiring board
TWI560223B (en) * 2009-12-25 2016-12-01 Hitachi Chemical Co Ltd Thermal curable resin composition, fabricating method of resin composition varnish, perpreg and laminated board
JP5857514B2 (en) * 2010-08-06 2016-02-10 日立化成株式会社 Thermosetting resin composition, and prepreg and laminate using the same
JP2013004913A (en) * 2011-06-21 2013-01-07 Sumitomo Bakelite Co Ltd Manufacturing method of laminated plate
JP5920353B2 (en) * 2011-09-27 2016-05-18 日立化成株式会社 Boron nitride particles, epoxy resin composition, semi-cured resin composition, cured resin composition, resin sheet, exothermic electronic component, and method for producing boron nitride particles
JP6384711B2 (en) * 2014-06-23 2018-09-05 日立化成株式会社 Insulating resin composition, prepreg using the same, and laminate for printed wiring board
CN107073765B (en) * 2014-09-19 2019-12-31 东丽株式会社 Method for producing fiber-reinforced plastic
JP6132041B2 (en) * 2016-02-18 2017-05-24 日立化成株式会社 Resin composition, and resin sheet, prepreg, laminate, metal substrate and printed wiring board using the same

Also Published As

Publication number Publication date
WO2018181287A1 (en) 2018-10-04
JP7459901B2 (en) 2024-04-02
CN110662795A (en) 2020-01-07
JPWO2018181287A1 (en) 2020-02-06
CN110662795B (en) 2022-12-06
TWI786099B (en) 2022-12-11
KR102489450B1 (en) 2023-01-16
TW201843223A (en) 2018-12-16
JP2022164680A (en) 2022-10-27
KR20190126926A (en) 2019-11-12
JP7120220B2 (en) 2022-08-17

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