MY196433A - Abrasive dispersion - Google Patents

Abrasive dispersion

Info

Publication number
MY196433A
MY196433A MYUI2019001639A MYUI2019001639A MY196433A MY 196433 A MY196433 A MY 196433A MY UI2019001639 A MYUI2019001639 A MY UI2019001639A MY UI2019001639 A MYUI2019001639 A MY UI2019001639A MY 196433 A MY196433 A MY 196433A
Authority
MY
Malaysia
Prior art keywords
abrasive
dispersion
abrasive dispersion
filtration
micro
Prior art date
Application number
MYUI2019001639A
Inventor
Kamiya Tomohide
OYAMA Takaharu
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of MY196433A publication Critical patent/MY196433A/en

Links

Landscapes

  • Magnetic Record Carriers (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Provided is an abrasive dispersion that allows the number of micro-scratches present on a polished surface to be effectively reduced. The abrasive dispersion provided herein contains both an abrasive and a dispersion medium. The abrasive contains colloidal silica derived from an alkali silicate-containing solution. An average primary particle diameter of the abrasive measured in accordance with the BET method is 1 nm to 50 nm. The pH of the abrasive dispersion lies within the range of 10 to 12. The abrasive dispersion exhibits a difference (Y-X) in filtration flow-through amount, calculated on the basis of filtration tests, of 25 g or less.
MYUI2019001639A 2018-03-29 2019-03-25 Abrasive dispersion MY196433A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018063612A JP7066480B2 (en) 2018-03-29 2018-03-29 Abrasive grain dispersion liquid, polishing composition kit, and polishing method for magnetic disk substrates

Publications (1)

Publication Number Publication Date
MY196433A true MY196433A (en) 2023-04-11

Family

ID=68169469

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2019001639A MY196433A (en) 2018-03-29 2019-03-25 Abrasive dispersion

Country Status (2)

Country Link
JP (1) JP7066480B2 (en)
MY (1) MY196433A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021080441A (en) * 2019-11-20 2021-05-27 株式会社フジミインコーポレーテッド Polishing composition, polishing method, and method for manufacturing substrate
JP7296504B2 (en) * 2021-04-02 2023-06-22 エスケー エンパルス カンパニー リミテッド Polishing composition for semiconductor process and method for manufacturing semiconductor device using polishing composition
JP7129576B1 (en) * 2021-12-23 2022-09-01 扶桑化学工業株式会社 Colloidal silica and method for producing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002338951A (en) 2001-05-18 2002-11-27 Nippon Chem Ind Co Ltd Hydrothermally treated colloidal silica for polishing agent
JP4643085B2 (en) 2001-09-19 2011-03-02 日本化学工業株式会社 Method for producing high-purity colloidal silica for abrasives
JP4781693B2 (en) 2004-06-14 2011-09-28 花王株式会社 Method for reducing nano scratch on magnetic disk substrate
TWI576146B (en) 2011-09-16 2017-04-01 日產化學工業股份有限公司 Purified active silicic acid solution and production method of silica sol
GB2535070A (en) 2013-10-24 2016-08-10 Kao Corp Method for producing polishing liquid composition
JP6688129B2 (en) 2016-03-30 2020-04-28 株式会社フジミインコーポレーテッド Polishing composition, method for producing magnetic disk substrate, and method for polishing magnetic disk substrate

Also Published As

Publication number Publication date
JP2019172853A (en) 2019-10-10
JP7066480B2 (en) 2022-05-13

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