MY194451A - Method for Producing Lead Wire Terminal, Chip Electrolytic Capacitor, and Half-Finished Product of Lead Wire Terminal - Google Patents
Method for Producing Lead Wire Terminal, Chip Electrolytic Capacitor, and Half-Finished Product of Lead Wire TerminalInfo
- Publication number
- MY194451A MY194451A MYPI2019001100A MYPI2019001100A MY194451A MY 194451 A MY194451 A MY 194451A MY PI2019001100 A MYPI2019001100 A MY PI2019001100A MY PI2019001100 A MYPI2019001100 A MY PI2019001100A MY 194451 A MY194451 A MY 194451A
- Authority
- MY
- Malaysia
- Prior art keywords
- lead wire
- wire terminal
- terminal
- lead
- producing
- Prior art date
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 5
- 239000003990 capacitor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 239000011247 coating layer Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention suppresses local decrease of the solder wettability in a lead part of a lead wire terminal for chip electrolytic capacitors, while suppressing the generation of a metal powder. A method for producing a lead wire terminal (4) which has a band-like lead part (41) and a terminal part 42 that is provided at one end of the lead part (41), and which is fitted to a capacitor element (3) of a chip electrolytic capacitor (1) via the terminal part. This method for producing a lead wire terminal (4) comprises: a step for preparing a metal wire rod (411) which has a polygonal cross-sectional shape and is provided with a coating layer (412) having good solder wettability on the outer circumference; and a step for forming the lead part (41) by pressing the metal wire rod (411). FIG. 4
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016196437 | 2016-10-04 | ||
JP2017030843A JP6656625B2 (en) | 2017-02-22 | 2017-02-22 | Manufacturing method of chip type electrolytic capacitor |
JP2017143082A JP6632034B2 (en) | 2017-07-06 | 2017-07-06 | Method of manufacturing lead wire terminal for chip type electrolytic capacitor and chip type electrolytic capacitor |
JP2017175783A JP2018061015A (en) | 2016-10-04 | 2017-09-13 | Manufacturing method of lead wire terminal, chip type electrolytic capacitor and semifinished product of lead wire terminal |
PCT/JP2017/036402 WO2018066681A1 (en) | 2016-10-04 | 2017-10-02 | Method for producing lead wire terminal, chip electrolytic capacitor, and half-finished product of lead wire terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
MY194451A true MY194451A (en) | 2022-11-30 |
Family
ID=61831432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019001100A MY194451A (en) | 2016-10-04 | 2017-10-02 | Method for Producing Lead Wire Terminal, Chip Electrolytic Capacitor, and Half-Finished Product of Lead Wire Terminal |
Country Status (4)
Country | Link |
---|---|
KR (3) | KR102412355B1 (en) |
CN (2) | CN113066669B (en) |
MY (1) | MY194451A (en) |
WO (1) | WO2018066681A1 (en) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0447949Y2 (en) * | 1986-01-22 | 1992-11-12 | ||
JPH05335192A (en) * | 1992-05-29 | 1993-12-17 | Elna Co Ltd | Manufacturing device of chip-type electrolytic capacitor |
JPH0677374A (en) * | 1992-08-27 | 1994-03-18 | Nec Corp | Lead for semiconductor device and manufacture thereof |
JP3344462B2 (en) | 1997-06-30 | 2002-11-11 | エルナー株式会社 | Electronic components |
JP2004192929A (en) * | 2002-12-11 | 2004-07-08 | Anzen Dengu Kk | Thermal fuse and its mounting method |
JP2004228424A (en) * | 2003-01-24 | 2004-08-12 | Nec Tokin Corp | Chip electrolytic capacitor, and manufacturing method thereof |
KR100971482B1 (en) * | 2003-08-29 | 2010-07-21 | 고호꾸고오교오가부시끼가이샤 | Method and device for taping tab terminal |
JP5334757B2 (en) * | 2009-08-31 | 2013-11-06 | 三洋電機株式会社 | Electrolytic capacitor |
JP5431130B2 (en) * | 2009-11-24 | 2014-03-05 | 三洋電機株式会社 | Electrolytic capacitor manufacturing method |
CN104422288B (en) * | 2013-09-04 | 2016-08-24 | 株式会社村田制作所 | Heat treatment fixture |
-
2017
- 2017-10-02 CN CN202110311881.9A patent/CN113066669B/en active Active
- 2017-10-02 KR KR1020217007681A patent/KR102412355B1/en active IP Right Grant
- 2017-10-02 MY MYPI2019001100A patent/MY194451A/en unknown
- 2017-10-02 KR KR1020217007682A patent/KR102401140B1/en active IP Right Grant
- 2017-10-02 CN CN202110211455.8A patent/CN112992547B/en active Active
- 2017-10-02 KR KR1020197005337A patent/KR102370962B1/en active IP Right Grant
- 2017-10-02 WO PCT/JP2017/036402 patent/WO2018066681A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20210032019A (en) | 2021-03-23 |
CN113066669B (en) | 2022-09-13 |
KR102412355B1 (en) | 2022-06-23 |
CN112992547A (en) | 2021-06-18 |
KR102401140B1 (en) | 2022-05-24 |
WO2018066681A1 (en) | 2018-04-12 |
CN112992547B (en) | 2022-11-11 |
KR20210032018A (en) | 2021-03-23 |
KR20190057050A (en) | 2019-05-27 |
CN113066669A (en) | 2021-07-02 |
KR102370962B1 (en) | 2022-03-04 |
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