MY187017A - Stably dischargeable sputtering target - Google Patents

Stably dischargeable sputtering target

Info

Publication number
MY187017A
MY187017A MYPI2019003601A MYPI2019003601A MY187017A MY 187017 A MY187017 A MY 187017A MY PI2019003601 A MYPI2019003601 A MY PI2019003601A MY PI2019003601 A MYPI2019003601 A MY PI2019003601A MY 187017 A MY187017 A MY 187017A
Authority
MY
Malaysia
Prior art keywords
metal particles
sputtering target
alloy
composite phase
content
Prior art date
Application number
MYPI2019003601A
Inventor
Yasuyuki Iwabuchi
Shin-Ichi Ogino
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY187017A publication Critical patent/MY187017A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

Provided is a ferromagnetic sputtering target with improved magnetic leakage flux, allowing a stable discharge to be obtained with a magnetron sputtering apparatus, with less generation of particles during sputtering. A sputtering target comprises a plurality of metal particles (A) composed of Co or Co alloy, and a composite phase (B) composed of Co or Co alloy and a metal oxide dispersed into each other to fill gaps between the metal particles, wherein a difference between the Co content of the Co or Co alloy composing the metal particles (A) and the Co content of the Co or Co alloy composing the composite phase (B) is 5 at% or less; and a ratio of an area of the metal particles to a total area of the metal particles (A) and the composite phase (B) is 20 to 65%.
MYPI2019003601A 2018-08-31 2018-09-28 Stably dischargeable sputtering target MY187017A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018163912A JP6873087B2 (en) 2018-08-31 2018-08-31 Stable dischargeable sputtering target
PCT/JP2018/036507 WO2020044573A1 (en) 2018-08-31 2018-09-28 Sputtering target capable of discharging steadily

Publications (1)

Publication Number Publication Date
MY187017A true MY187017A (en) 2021-08-26

Family

ID=69645084

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019003601A MY187017A (en) 2018-08-31 2018-09-28 Stably dischargeable sputtering target

Country Status (5)

Country Link
JP (1) JP6873087B2 (en)
CN (1) CN111133126B (en)
MY (1) MY187017A (en)
SG (1) SG11201905658UA (en)
WO (1) WO2020044573A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3885690T2 (en) * 1987-09-17 1994-06-09 Seiko Epson Corp A method of manufacturing a sputtering target for use in the manufacture of a magneto-optical recording medium.
JP4962905B2 (en) * 2007-03-12 2012-06-27 三菱マテリアル株式会社 Method for producing Co-based sintered alloy sputtering target for forming magnetic recording film with less generation of particles
MY145087A (en) * 2008-03-28 2011-12-30 Jx Nippon Mining & Metals Corp Sputtering target of nonmagnetic-particle-dispersed ferromagnetic material
MY149640A (en) * 2009-12-11 2013-09-13 Jx Nippon Mining & Metals Corp Sputtering target comprising oxide phase dispersed in co or co alloy phase, magnetic thin film made of co or co alloy phase and oxide phase, and magnetic recording medium using the said thin film
MY149437A (en) * 2010-01-21 2013-08-30 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
JP2011216135A (en) * 2010-03-31 2011-10-27 Mitsubishi Materials Corp Sputtering target for forming magnetic recording medium film, and manufacturing method thereof
JP4885333B1 (en) * 2010-09-03 2012-02-29 Ｊｘ日鉱日石金属株式会社 Ferromagnetic sputtering target

Also Published As

Publication number Publication date
JP2020037713A (en) 2020-03-12
CN111133126B (en) 2022-06-21
JP6873087B2 (en) 2021-05-19
WO2020044573A1 (en) 2020-03-05
CN111133126A (en) 2020-05-08
SG11201905658UA (en) 2020-04-29

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